OCTOBER 2008
DSC-5304/08
1
©2008 Integrated Device Technology, Inc.
Pin Description Summary
Description
The IDT71V65603/5803 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMS. They are designed to eliminate dead bus
cycles when turning the bus around between reads and writes, or writes and
reads. Thus, they have been given the name ZBT
TM
, or Zero Bus Turn-
around.
Features
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 150MHz
(3.8ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the
need to control OE
Single R/W (READ/WRITE) control pin
Positive clock-edge triggered address, data, and control signal
registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW1 - BW4) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply (±5%)
3.3V I/O Supply (VDDQ)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array(fBGA).
A
0
-A
18
Address Inputs Input Synchronous
CE
1
, CE
2
, CE
2
Chip Enables Input Synchronous
OE
Output Enable Input Asynchronous
R/W Read/Write Signal Input Synchronous
CEN
Clock Enable Input Synchronous
BW
1
, BW
2
, BW
3
, BW
4
Individual Byte Write Selects Input Synchronous
CLK Clock Input N/A
ADV/LD Advance burst address / Load new address Input Synchronous
LBO
Linear / Interleaved Burst Order Input Static
ZZ Sleep Mode Input Asynchronous
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
Data Input / Output I/O Synchronous
V
DD
, V
DDQ
Core Power, I/O Power Supply Static
V
SS
Ground Supply Static
5304 tbl 01
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
ZBT™ Feature
3.3V I/O, Burst Counter
Pipelined Outputs
IDT71V65603/Z
IDT71V65803/Z
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65603/5803 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used
to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65603/5803
to be suspended as long as necessary. All synchronous inputs are ignored
when (CEN) is high and the internal device registers will hold their previous
values.
There are three chip enable pins (CE1, CE2, CE2) that allow the user
to deselect the device when desired. If any one of these three are not
asserted when ADV/LD is low, no new memory operation can be
initiated. However, any pending data transfers (reads or writes) will be
completed. The data bus will tri-state two cycles after chip is deselected
or a write is initiated.
The IDT71V65603/5803 have an on-chip burst counter. In the burst
mode, the IDT71V65603/5803 can provide four cycles of data for a
single address presented to the SRAM. The order of the burst
sequence is defined by the LBO input pin. The LBO pin selects
between linear and interleaved burst sequence. The ADV/LD signal is
used to load a new external address (ADV/LD = LOW) or increment
the internal burst counter (ADV/LD = HIGH).
The IDT71V65603/5803 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm
100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array
(BGA) and 165 fine pitch ball grid array (fBGA) .
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
6.422
IDT71V65603, IDT71V65803, 256K x 36, 512K x 18, 3.3V Synchronous SRAMs with
ZBT
Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Pin Definitions
(1)
NOTE:
1. All synchronous inputs must meet specified setup and hold times with respect to CLK.
Symbol Pin Function I/O Active Description
A
0
-A
18
Address Inputs I N/A Synchronous Address inputs. The address register is triggered by a combination of the
rising edge of CLK, ADV/LD low, CEN low, and true chip enables.
ADV/LD Advance / Load I N/A ADV/LD is a synchronous input that is used to load the internal registers with new address
and control when it is sampled low at the rising edge of clock with the chip selected. When
ADV/LD is low with the chip deselected, any burst in progress is terminated. When ADV/LD
is sampled high then the internal burst counter is advanced for any burst that was in
progress. The external addresses are ignored when ADV/LD is sampled high.
R/W Read / Write I N/A R/W signal is a synchronous input that identifies whether the current load cycle initiated is a
Read or Write access to the memory array. The data bus activity for the current cycle takes
place two clock cycles later.
CEN
Clock Enable I LOW Synchronous Clock Enable Input. When CEN is sampled high, all other synchronous
inputs, including clock are ignored and outputs remain unchanged. The effect of CEN
sampled high on the device outputs is as if the low to high clock transition did not occur.
For normal operation, CEN must be sampled low at rising edge of clock.
BW
1
-BW
4
Individual Byte
Write Enables
I LOW Synchronous byte write enables. Each 9-bit byte has its own active low byte write enable.
On load write cycles (When R/W and ADV/LD are sampled low) the appropriate byte write
signal (BW
1
-BW
4
) must be valid. The byte write signal must also be valid on each cycle of
a burst write. Byte Write signals are ignored when R/W is sampled high. The appropriate
byte(s) of data are written into the device two cycles later. BW
1
-BW
4
can all be tied low if
always doing write to the entire 36-bit word.
CE
1
, CE
2
Chip Enables I LOW Synchronous active low chip enable. CE
1
and CE
2
are used with CE
2
to enable the
IDT71V65603/5803. (CE
1
or CE
2
sampled high or CE
2
sampled low) and ADV/LD low at the
rising edge of clock, initiates a deselect cycle. The ZBT
TM
has a two cycle deselect, i.e.,
the data bus will tri-state two clock cycles after deselect is initiated.
CE
2
Chip Enable I HIGH Synchronous active high chip enable. CE
2
is used with CE
1
and CE
2
to enable the chip.
CE
2
has inverted polarity but otherwise identical to CE
1
and CE
2
.
CLK Clock I N/A This is the clock input to the IDT71V65603/5803. Except for OE, all timing references for the
device are made with respect to the rising edge of CLK.
I/O
0
-I/O
31
I/O
P1
-I/O
P4
Data Input/Output I/O N/A Synchronous data input/output (I/O) pins. Both the data input path and data output path are
registered and triggered by the rising edge of CLK.
LBO
Linear Burst Order I LOW Burst order selection input. When LBO is high the Interleaved burst sequence is selected.
When LBO is low the Linear burst sequence is selected. LBO is a static input and it must
not change during device operation.
OE
Output Enable I LOW Asynchronous output enable. OE must be low to read data from the 71V65603/5803. When
OE is high the I/O pins are in a high-impedance state. OE does not need to be actively
controlled for read and write cycles. In normal operation, OE can be tied low.
ZZ Sleep Mode I N/A Asynchronous sleep mode input. ZZ HIGH will gate the CLK internally and power down the
71V65603/5803 to its lowest power consumption level. Data retention is guaranteed in
Sleep Mode.
V
DD
Power Supply N/A N/A 3.3V core power supply.
V
DDQ
Power Supply N/A N/A 3.3V I/O Supply.
V
SS
Ground N/A N/A Ground.
5304tbl 02
6.42
IDT71V65603, IDT71V65803, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with
ZBT
Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
3
Functional Block Diagram
Clk
DQ
DQ
DQ
Address A [0:18]
Control Logic
Address
Control
DI DO
Input Register
5304 drw 01
Clock
Data I/O [0:15],
I/O P[1:2]
D
Q
Clk
Output Register
Mux
Sel
Gate
O E
C E1, CE2, C E2
R/W
C EN
ADV/LD
BW x
LB O
512x18 BIT
MEMORY ARRAY
,

71V65603S100PFG

Mfr. #:
Manufacturer:
IDT
Description:
SRAM 9M ZBT SLOW X36 P/L 3.3V
Lifecycle:
New from this manufacturer.
Delivery:
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