4
IDT72V3623/72V3643 CMOS 3.3V SyncBiFIFO
TM
WITH BUS-MATCHING
256 x 36, 1,024 x 36
COMMERCIAL TEMPERATURE RANGE
Symbol Name I/O Description
A0-A35 Port A Data I/O 36-bit bidirectional data port for side A.
AE Almost-Empty Flag O Programmable Almost-Empty flag synchronized to CLKB. It is LOW when the number of
(Port B) words in the FIFO is less than or equal to the value in the Almost-Empty B offset register, X.
AF Almost-Full Flag O Programmable Almost-Full flag synchronized to CLKA. It is LOW when the number of empty
(Port A) locations in the FIFO is less than or equal to the value in the Almost-Full A offset register, Y.
B0-B35 Port B Data I/O 36-bit bidirectional data port for side B.
BE/FWFT Big-Endian/ I This is a dual purpose pin. During Master Reset, a HIGH on BE will select Big-Endian
First Word operation. In this case, depending on the bus size, the most significant byte or word written to
Fall Through Port A is read from Port B first. A LOW on BE will select Little-Endian operation. In this case,
the least significant byte or word written to Port A is read from Port B first. After Master Reset,
this pin selects the timing mode. A HIGH on FWFT selects IDT Standard mode, a LOW
selects First Word Fall Through mode. Once the timing mode has been selected, the level
on FWFT must be static throughout device operation.
BM Bus-Match Select I A HIGH on this pin enables either byte or word bus width on Port B, depending on the state of
(Port B) SIZE. A LOW selects long word operation. BM works with SIZE and BE to select the bus size
and endian arrangement for Port B. The level of BM must be static throughout device
operation.
CLKA Port A Clock I CLKA is a continuous clock that synchronizes all data transfers through Port A and can be
asynchronous or coincident to CLKB. FF/IR and AF are synchronized to the LOW-to-HIGH
transition of CLKA.
CLKB Port B Clock I CLKB is a continuous clock that synchronizes all data transfers through Port B and can be
asynchronous or coincident to CLKA. EF/OR and AE are synchronized to the LOW-to-HIGH
transition of CLKB.
CSA Port A Chip I CSA must be LOW to enable to LOW-to-HIGH transition of CLKA to read or write on Port A.
Select The A0-A35 outputs are in the high-impedance state when CSA is HIGH.
CSB Port B Chip I CSB must be LOW to enable a LOW-to-HIGH transition of CLKB to read or write data on
Select Port B. The B0-B35 outputs are in the high-impedance state when CSB is HIGH.
EF/OR Empty/Output O This is a dual function pin. In the IDT Standard mode, the EF function is selected. EF indicates
Ready Flag whether or not the FIFO memory is empty. In the FWFT mode, the OR function is selected.
(Port B) OR indicates the presence of valid data on the B0-B35 outputs, available for reading. EF/OR is
synchronized to the LOW-to-HIGH transition of CLKB.
ENA Port A Enable I ENA must be HIGH to enable a LOW-to-HIGH transition of CLKA to read or write data on Port A.
ENB Port B Enable I ENB must be HIGH to enable a LOW-to-HIGH transition of CLKB to read or write data on Port B.
FF/IR Full/Input O This is a dual function pin. In the IDT Standard mode, the FF function is selected. FF indicates
Ready Flag whether or not the FIFO memory is full. In the FWFT mode, the IR function is selected. IR
(Port A) indicates whether or not there is space available for writing to the FIFO memory. FF/IR is
synchronized to the LOW-to-HIGH transition of CLKA.
FS1/SEN Flag Offset I FS1/SEN and FS0/SD are dual-purpose inputs used for flag offset register programming.
Select 1/ During Reset, FS1/SEN and FS0/SD, together with SPM, select the flag offset programming
Serial Enable method. Three offset register programming methods are available: automatically load one of
three preset values (8, 16, or 64), parallel load from Port A, and serial load.
FS0/SD Flag Offset I When serial load is selected for flag offset register programming, FS1/SEN is used as an
Serial Data enable synchronous to the LOW-to-HIGH transition of CLKA. When FS1/SEN is LOW, a
rising edge on CLKA load the bit present on FS0/SD into the X and Y registers. The number
of bit writes required to program the offset registers is 16 for the IDT72V3623 and 20 for the
IDT72V3643. The first bit write stores the Y-register MSB and the last bit write stores the
X-register LSB.
PIN DESCRIPTIONS
5
COMMERCIAL TEMPERATURE RANGE
IDT72V3623/72V3643 CMOS 3.3V SyncBiFIFO
TM
WITH BUS-MATCHING
256 x 36, 1,024 x 36
Symbol Name I/O Description
PIN DESCRIPTIONS (CONTINUED)
MBA Port A Mailbox I A HIGH level on MBA chooses a mailbox register for a Port A read or write operation.
Select
MBB Port B Mailbox I A HIGH level on MBB chooses a mailbox register for a Port B read or write operation.
Select When the B0-B35 outputs are active, a HIGH level on MBB selects data from the mail1
register for output and a LOW level selects FIFO data for output.
MBF1 Mail1 Register Flag O MBF1 is set LOW by a LOW-to-HIGH transition of CLKA that writes data to the mail1
register. Writes to the mail1 register are inhibited while MBF1 is LOW. MBF1 is set HIGH by
a LOW-to-HIGH transition of CLKB when a Port B read is selected and MBB is HIGH. MBF1
is set HIGH following either a Reset (RS1) or Partial Reset (PRS).
MBF2 Mail2 Register Flag O MBF2 is set LOW by a LOW-to-HIGH transition of CLKB that writes data to the mail2 register.
Writes to the mail2 register are inhibited while MBF2 is LOW. MBF2 is set HIGH by a LOW-
to-HIGH transition of CLKA when a Port A read is selected and MBA is HIGH. MBF2 is set
HIGH following either a Reset (RS2) or Partial Reset (PRS).
RS1, RS2 Resets I A LOW on both pins initializes the FIFO read and write pointers to the first location of memory
and sets the Port B output register to all zeroes. A LOW-to-HIGH transition on RS1 selects the
programming method (serial or parallel) and one of three programmable flag default offsets.
It also configures Port B for bus size and endian arrangement. Four LOW-to-HIGH transitions
of CLKA and four LOW-to-HIGH transitions of CLKB must occur while RS1 is LOW.
PRS Partial Reset I A LOW on this pin initializes the FIFO read and write pointers to the first location of memory and
sets the Port B output register to all zeroes. During Partial Reset, the currently selected bus size,
endian arrangement, programming method (serial or parallel), and programmable flag settings
are all retained.
SIZE Bus Size Select I A HIGH on this pin when BM is HIGH selects byte bus (9-bit) size on Port B. A LOW on this pin
(Port B) when BM is HIGH selects word (18-bit) bus size. SIZE works with BM and BE to select the bus
size and endian arrangement for Port B. The level of SIZE must be static throughout device operation.
SPM Serial Programming I A LOW on this pin selects serial programming of partial flag offsets. A HIGH on this pin selects
Mode parallel programming or default offsets (8, 16, or 64).
W/RA Port A Write/ I A HIGH selects a write operation and a LOW selects a read operation on Port A for a LOW-to-HIGH
Read Select transition of CLKA. The A0-A35 outputs are in the HIGH impedance state when W/RA is HIGH.
W/RB Port B Write/ I A LOW selects a write operation and a HIGH selects a read operation on Port B for a LOW-to-HIGH
Read Select transition of CLKB. The B0-B35 outputs are in the HIGH impedance state when W/RB is LOW.
6
IDT72V3623/72V3643 CMOS 3.3V SyncBiFIFO
TM
WITH BUS-MATCHING
256 x 36, 1,024 x 36
COMMERCIAL TEMPERATURE RANGE
ABSOLUTE MAXIMUM RATINGS OVER OPERATING FREE-AIR
TEMPERATURE RANGE (Unless otherwise noted)
(1)
Symbol Rating Commercial Unit
V
CC Supply Voltage Range –0.5 to +4.6 V
V
I
(
2)
Input Voltage Range –0.5 to VCC+0.5 V
VO
(2)
Output Voltage Range –0.5 to VCC+0.5 V
I
IK Input Clamp Current (VI < 0 or VI > VCC) ±20 mA
I
OK Output Clamp Current (VO = < 0 or VO > VCC) ±50 mA
I
OUT Continuous Output Current (VO = 0 to VCC) ±50 mA
I
CC Continuous Current Through VCC or GND ±400 mA
T
STG Storage Temperature Range –65 to 150 °C
NOTES:
1. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these
or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect
device reliability.
2. The input and output voltage ratings may be exceeded provided the input and output current ratings are observed.
NOTES:
1. For 10ns speed grade only: Vcc = 3.3V +/-0.15V; TA = 0°
to +70°C; JEDEC JESD8-A compliant.
2. All typical values are at VCC = 3.3V, TA = 25°C.
3. For additional ICC information, see Figure 1, Typical Characteristics: Supply Current (ICC) vs. Clock Frequency (fS).
4. Characterized values, not currently tested.
5. Industrial temperature range is available by special order.
ELECTRICAL CHARACTERISTICS OVER RECOMMENDED OPERATING
FREE-AIR TEMPERATURE RANGE (Unless otherwise noted)
IDT72V3623
IDT72V3643
Commercial
tCLK = 10
(1)
, 15ns
Symbol Parameter Test Conditions Min. Typ.
(2)
Max. Unit
VOH Output Logic "1" Voltage VCC = 3.0V, IOH = –4 mA 2.4 V
V
OL Output Logic "0" Voltage VCC = 3.0V, IOL = 8 mA 0.5 V
I
LI Input Leakage Current (Any Input) VCC = 3.6V, VI = VCC or 0 ±10 μA
ILO Output Leakage Current VCC = 3.6V, VO = VCC or 0 ±10 μA
I
CC2
(3)
Standby Current (with CLKA and CLKB running) VCC = 3.6V, VI = VCC - 0.2V or 0 5 mA
I
CC3
(3)
Standby Current (no clocks running) VCC = 3.6V, VI = VCC - 0.2V or 0 1 mA
CIN
(4)
Input Capacitance VI = 0, f = 1 MHz 4 pF
C
OUT
(4)
Output Capacitance VO = 0, f = 1 MHZ 8 pF
NOTE:
1. For 10ns (100 MHz operation), VCC = 3.3V +/-0.15V;TA = 0°
to +70°C; JEDEC JESD8-A compliant.
Symbol Parameter Min. Typ. Max. Unit
VCC
(1)
Supply Voltage 3.0 3.3 3.6 V
V
IH High-Level Input Voltage 2 VCC+0.5 V
V
IL Low-Level Input Voltage 0.8 V
IOH High-Level Output Current 4 mA
I
OL Low-Level Output Current 8 mA
T
A Operating Temperature 0 70 °C
RECOMMENDED OPERATING CONDITIONS

72V3623L10PFG

Mfr. #:
Manufacturer:
IDT
Description:
FIFO 8KX36K2 BUS BIDIRECTIONAL
Lifecycle:
New from this manufacturer.
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