NCL30186
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5
Table 3. MAXIMUM RATINGS TABLE(S)
Symbol Rating Value Unit
V
CC(MAX)
I
CC(MAX)
Maximum Power Supply voltage, V
CC
pin, continuous voltage
Maximum current for V
CC
pin
−0.3 to 30
Internally limited
V
mA
V
DRV(MAX)
I
DRV(MAX)
Maximum driver pin voltage, DRV pin, continuous voltage
Maximum current for DRV pin
−0.3, V
DRV
(Note 1)
−300, +500
V
mA
V
MAX
I
MAX
Maximum voltage on low power pins (except DRV and V
CC
pins)
Current range for low power pins (except DRV and V
CC
pins)
−0.3, 5.5 (Notes 2 and 5)
−2, +5
V
mA
R
θ
J−A
Thermal Resistance Junction−to−Air 180 °C/W
T
J(MAX)
Maximum Junction Temperature 150 °C
Operating Temperature Range −40 to +125 °C
Storage Temperature Range −60 to +150 °C
ESD Capability, HBM model (Note 3) 3.5 kV
ESD Capability, MM model (Note 3) 250 V
ESD Capability, CDM model (Note 3) 2 kV
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. V
DRV
is the DRV clamp voltage V
DRV(high)
when V
CC
is higher than V
DRV(high)
. V
DRV
is V
CC
otherwise.
2. This level is low enough to guarantee not to exceed the internal ESD diode and 5.5−V Zener diode. More positive and negative voltages can
be applied if the pin current stays within the −2 mA / 5 mA range.
3. This device contains ESD protection and exceeds the following tests: Human Body Model 3500 V per JEDEC Standard JESD22−A114E,
Machine Model Method 250 V per JEDEC Standard JESD22−A115B, Charged Device Model 2000 V per JEDEC Standard JESD22−C101E.
4. This device contains latch−up protection and has been tested per JEDEC Standard JESD78D, Class I and exceeds ±100 mA.
5. Recommended maximum V
S
voltage for optimal operation is 4 V. −0.3 V to +4.0 V is hence, the V
S
pin recommended range.
Table 4. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T
J
= 25°C, V
CC
= 12 V, V
ZCD
= 0 V,
V
CS
= 0 V, V
SD
= 1.5 V) For min/max values T
J
= −40°C to +125°C, V
CC
= 12 V)
Description
Test Condition Symbol Min Typ Max Unit
STARTUP AND SUPPLY CIRCUITS
Supply Voltage
Startup Threshold
Minimum Operating Voltage
Hysteresis V
CC(on)
– V
CC(off)
Internal logic reset
V
CC
rising
V
CC
rising
V
CC
falling
V
CC(on)
V
CC(off)
V
CC(HYS)
V
CC(reset)
16.0
8.2
8
4
18.0
8.8
−
5
20.0
9.4
−
6
V
V
CC
Over Voltage Protection Threshold V
CC(OVP)
25.5 26.8 28.5 V
V
CC(off)
noise filter
V
CC(reset)
noise filter
t
VCC(off)
t
VCC(reset)
−
−
5
20
−
−
ms
Startup current I
CC(start)
− 13 30
mA
Startup current in fault mode I
CC(Fault)
58 75
mA
Supply Current
Device Disabled/Fault
Device Enabled/No output load on DRV pin
Device Switching
V
CC
> V
CC(off)
F
sw
= 65 kHz
C
DRV
= 470 pF, F
sw
= 65 kHz
I
CC1
I
CC2
I
CC3
0.8
–
−
1.0
2.6
3.0
1.2
4.0
4.5
mA
CURRENT SENSE
Maximum Internal current limit
V
ILIM
0.95 1.00 1.05 V
Leading Edge Blanking Duration for V
ILIM
t
LEB
240 300 360 ns
Propagation delay from current detection to gate
off−state
t
ILIM
− 100 150 ns
6. Guaranteed by Design
7. A NTC is generally placed between the SD and GND pins. Parameters R
TF(start)
, R
TF(stop)
, R
OTP(off)
and R
OTP(on)
give the resistance the
NTC must exhibit to respectively, enter thermal foldback, stop thermal foldback, trigger the OTP limit and allow the circuit recovery after
an OTP situation.
8. At startup, when V
CC
reaches V
CC(on)
, the controller blanks OTP for more than 250 ms to avoid detecting an OTP fault by allowing the
SD pin voltage to reach its nominal value if a filtering capacitor is connected to the SD pin.
