4 of 30 July 17, 2012
AC Measurement Conditions
AC Measurement I/O Waveform
Input Parameters for the TSE2002GB2A1
1.T
A
=25°C, f=400 kHz
2.Verified by design and characterization not necessarily tested on all devices
Symbol Parameter Min. Max. Units
C
L
Load capacitance 100 pF
Input rise and fall times 50 ns
Input levels 0.2*V
DDSPD
to 0.8*V
DDSPD
V
Input and output timing reference levels 0.3*V
DDSPD
to 0.7*V
DDSPD
V
Symbol Parameter
1,2
Test Condition Min. Max. Units
C
IN
Input capacitance (SDA) 8 pF
C
IN
Input rise and fall times 6 ns
Z
EIL
Ei (SA0,SA1,SA2) input impedance V
IN
< 0.3* V
DDSPD
30 k
Z
EIH
Ei (SA0,SA1,SA2) input impedance V
IN
> 0.7* V
DDSPD
800 k
t
SP
Pulse width ignored (input filter on
SCL and SDA)
Single glitch, f < 100 KHz 100 ns
Single glitch, f> 100 KHz 50
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DC Characteristics
Parameter Symbol Conditions Min. Max. Units
Input Leakage Current I
LI
V
IN
= V
SSSPD
or V
DDSPD
±1 A
Output Leakage Current I
LO
V
OUT
= V
SSSPD
or V
DDSPD
,
SDA in Hi-Z
±1 A
Supply Current I
DD
V
DDSPD
= 3.3 V, f
C
= 100 kHz
(rise/fall time < 30 ns)
700 A
Standby Supply Current I
DD1
V
IN
= V
SSSPD
or V
DDSPD
,
V
DDSPD
= 3.6 V
40 A
Input Low Voltage (SCL, SDA) V
IL
-0.5 0.3*V
DDSPD
V
Input High Voltage (SCL, SDA) V
IH
0.7* V
DDSPD
V
DDSPD
+1 V
SA0 High Voltage V
HV
V
HV
- V
DDSPD
> 4.8 V 7 10 V
Output Low Voltage V
OL
I
OL
= 2.1 mA,
3 V =<
V
DDSPD
=< 3.6 V
0.4 V
I
OL
= 0.7 mA,
V
DDSPD
= 1.7 - 3.6 V
0.2 V
Input hysteresis V
HYST
V
DDSPD
> 2.2V 0.05*V
DDSPD
__ V
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AC Characteristics
1. For a RESTART condition, or following a write cycle.
2. Guaranteed by design and characterization, not necessarily tested.
3. To avoid spurious START and STOP conditions, a minimum delay is placed between falling edge of SCL and the falling or
rising edge of SDA.
4. The TSE2002GB2A1 does not initiate clock stretching which is an optional I
2
C bus feature
5. Devices participating in a transfer can abort the transfer in progress and release the bus when any single clock low interval
exceeds the value of t
TIMEOUT,MIN
. After the master in a transaction detects this condition, it must generate a stop condition
within or after the current data byte in the transfer process. Devices that have detected this condition must reset their
communication and be able to receive a new START condition no later than t
TIMEOUT,MAX
. Typical device examples include
the host controller and embedded controller and most devices that can master the SMBus. Some devices do not contain a clock
low drive circuit; this simple kind of device typically may reset its communications port after a start or stop condition. A
timeout condition can only be ensured if the device that is forcing the timeout holds SCL low for t
TIMEOUT,MAX
or longer.
6. The temperature sensor family of devices are not required to support the SMBus ALERT function.
Parameter Symbol
V
DDSPD
> 2.2 V
UnitsMin. Max.
Clock Frequency f
SCL
10 400 kHz
Clock Pulse Width High Time t
HIGH
600 ns
Clock Pulse Width Low Time t
LOW
5
1300 ns
Detect clock low timeout, Capabilities
Register bit 6 =1
t
TIMEOUT
6
25 35 ms
SDA Rise Time t
R
2
300 ns
SDA Fall Time t
F
2
20 300 ns
Data In Setup Time t
SU:DAT
100 ns
Data In Hold Time t
HD:DI
0ns
Data Out Hold Time t
HD:DAT
200 900 ns
Start Condition Setup Time t
SU:STA
1
600 ns
Start Condition Hold Time t
HD:STA
600 ns
Stop Condition Setup Time t
SU:STO
600 ns
Time Between Stop Condition and Next
Start Condition
t
BUF
1300 ns
Write Time t
W
4.5 ms

TSE2002GB2A1NCG

Mfr. #:
Manufacturer:
IDT
Description:
Board Mount Temperature Sensors Temp Sensor with Integrated EEPROM for Memory
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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