DATA SHEET
Document No. E1831E30 (Ver. 3.0)
Date Published March 2012 (K) Japan
Printed in Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2011-2012
Specifications
• Density: 4G bits
• Organization
— 2 pieces of 2Gb (8M words × 32 bits × 8 banks) in
one package
— Independent 2-channel bus
• Data rate: 1066Mbps (max.)
• Package: 216-ball FBGA
— Package size: 12.0mm × 12.0mm
— Ball pitch: 0.4mm
— Lead-free (RoHS compliant) and Halogen-free
• Power supply
— VDD1 = 1.70V to 1.95V
— VDD2, VDDQ = 1.14V to 1.30V
• Interface: HSUL_12
• Operating case temperature range
— TC = -30°C to +85°C
Block Diagram
Features
• JEDEC LPDDR2-S4B compliance
• DLL is not implemented
• Low power consumption
• Mobile RAM functions
— Partial Array Self-Refresh (PASR)
— Auto Temperature Compensated Self-Refresh
(ATCSR) by built-in temperature sensor
— Deep power-down mode
— Per Bank Refresh
• This FBGA is suitable for Package on Package (PoP)
4G bits DDR2 Mobile RAM™ PoP
(12mm × 12mm, 216-ball FBGA)
EDB4064B3PB
CA0_a to CA9_a
DQS0_a to DQS3_a
DQ0_a to DQ31_a
/CS_a
CK_a, /CK_a
CKE_a
DM0_a to DM3_a
ZQ_a
2G bits
(64M x 32)
VDD2
VSS
VDD1
VREFCA_a, VREFCA_b
VDDQ
VREFDQ_a, VREFDQ_b
/DQS0_a to /DQS3_a
DQS0_b to DQS3_b
DQ0_b to DQ31_b
DM0_b to DM3_b
ZQ_b
/DQS0_b to /DQS3_b
CA0_b to CA9_b
CK_b, /CK_b
/CS_b
CKE_b
2G bits
(64M x 32)
EDB4064B3PB
Data Sheet E1831E30 (Ver. 3.0)
2
Ordering Information
Part Number
Part number
Organization
(words x bits) Clock frequency Data rate Read latency Package
EDB4064B3PB-1D-F
64M x 64
(64M × 32 × 2pcs)
533MHz 1066Mbps 8
216-ball FBGA
EDB4064B3PB-8D-F 400MHz 800Mbps 6
Elpida Memory
Density/Chip select
40: 4Gb/2-CS
Organization
64: x64
Power Supply, Interface
B: VDD1 = 1.8V, VDD2 = VDDQ = 1.2V,
Product Family
B: DDR2 Mobile RAM
Type
D: Packaged Device
E D B 40 64 B 3 PB - 1D - F
Revision
Package
PB: BGA for PoP
Speed
1D: 1066Mbps
8D: 800Mbps
Environment Code
F: Lead Free (RoHS compliant)
and Halogen Free
S4B device, HSUL
EDB4064B3PB
Data Sheet E1831E30 (Ver. 3.0)
3
CONTENTS
Specifications ........................................................................................................................................ 1
Block Diagram ....................................................................................................................................... 1
Features ................................................................................................................................................ 1
Ordering Information ............................................................................................................................. 2
Part Number .......................................................................................................................................... 2
Pin Configurations ................................................................................................................................. 4
Pin Descriptions .................................................................................................................................... 5
Pin Capacitance .................................................................................................................................... 6
Package Drawing .................................................................................................................................. 7
Mode Register Specification ................................................................................................................. 8
1. Electrical Conditions ...................................................................................................................... 9
1.1 Absolute Maximum Ratings .............................................................................................. 9
1.2 Recommended DC Operating Conditions ........................................................................ 9
2. Electrical Specifications ............................................................................................................... 10
2.1 DC Characteristics 1 ....................................................................................................... 10
2.2 DC Characteristics 2 ....................................................................................................... 12
2.3 AC Characteristics ..........................................................................................................13

EDB4064B3PB-8D-F-D

Mfr. #:
Manufacturer:
Micron
Description:
IC DRAM 4G PARALLEL 216FBGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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