10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
FEBRUARY 13, 2009
AC ELECTRICAL CHARACTERISTICS
(1)
(Commercial: VCC = 2.5V ± 5%, TA = 0°C to +70°C;Industrial: VCC = 2.5V ± 5%, TA = -40°C to +85°C)
Commercial Commercial Com’l & Ind’l
(2)
Commercial
IDT72T2098L4 IDT72T2098L5 IDT72T2098L6-7 IDT72T2098L10
IDT72T20108L4 IDT72T20108L5 IDT72T20108L6-7 IDT72T20108L10
IDT72T20118L4 IDT72T20118L5 IDT72T20118L6-7 IDT72T20118L10
IDT72T20128L4 IDT72T20128L5 IDT72T20128L6-7 IDT72T20128L10
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
fS1 Clock Cycle Frequency SDR 250 200 150 100 MHz
fS2 Clock Cycle Frequency DDR 110 100 75 50 MHz
tA Data Access Time 0.6 3.2 0.6 3.6 0.6 3.8 0.6 4.5 ns
tASO Data Access Serial Output Time 0.6 3.2 0.6 3.6 0.6 3.8 0.6 4.5 ns
tCLK1 Clock Cycle Time SDR 4 5 6.7 10 ns
tCLK2 Clock Cycle Time DDR 9.1 10 13 20 ns
tCLKH1 Clock High Time SDR 1.8 2.3 2.8 4.5 ns
tCLKH2 Clock High Time DDR 4.0 4.5 6.0 9.5 ns
tCLKL1 Clock Low Time SDR 1.8 2.3 2.8 4.5 ns
tCLKL2 Clock Low Time DDR 4.0 4.5 6.0 9.5 ns
tDS Data Setup Time 1.2 1.5 2.0 3.0 ns
tDH Data Hold Time 0.5 0.5 0.5 0.5 ns
tENS Enable Setup Time 1.2 1.5 2.0 3.0 ns
tENH Enable Hold Time 0.5 0.5 0.5 0.5 ns
tWCSS WCS setup time 1.2 1.5 2.0 3.0 ns
tWCSH WCS hold time 0.5 0.5 0.5 0.5 ns
fC Clock Cycle Frequency (SCLK) 10 10 10 10 MHz
tSCLK Serial Clock Cycle 100 100 100 100 ns
tSCKH Serial Clock High 45 45 45 45 ns
tSCKL Serial Clock Low 45 45 45 45 ns
tSDS Serial Data In Setup 15 15 15 15 ns
tSDH Serial Data In Hold 5 5 5 5 ns
tSENS Serial Enable Setup 5 5 5 5 ns
tSENH Serial Enable Hold 5 5 5 5 ns
tRS Reset Pulse Width
(3)
30 30 30 30 ns
tRSS Reset Setup Time 15 15 15 15 ns
tHRSS HSTL Reset Setup Time 4 4 4 4 µs
tRSR Reset Recovery Time 10 10 10 10 ns
tRSF Reset to Flag and Output Time 10 12 15 15 ns
tOLZ Output Enable to Output in Low Z
(4)
0—0—0—0ns
tOE Output Enable to Output Valid 3.2 3.6 3.8 4.5 ns
tOHZ Output Enable to Output in High Z
(4)
3.2 3.6 3.8 4.5 ns
tWFF Write Clock to FF or IR 3.2 3.6 3.8 4.5 ns
tREF Read Clock to EF or OR 3.2 3.6 3.8 4.5 ns
tPAFS Write Clock to Programmable Almost-Full Flag 3.2 3.6 3.8 4.5 ns
tPAES Read Clock to Programmable Almost-Empty Flag 3.2 3.6 3.8 4.5 ns
tERCLK RCLK to Echo RCLK output 3.6 4 4.3 5 ns
tCLKEN RCLK to Echo REN output 3.2 3.6 3.8 4.5 ns
tRCSLZ RCLK to Active from High-Z 3.2 3.6 3.8 4.5 ns
tRCSHZ RCLK to High-Z
(4)
3.2 3.6 3.8 4.5 ns
tSKEW1 Skew time between RCLK and WCLK for EF/OR and FF/IR 3.5—4—5—7ns
tSKEW2 Skew time between RCLK & WCLK for EF/OR & FF/IR in DDR mode 3.5—4—5—7ns
tSKEW3 Skew time between RCLK and WCLK for PAE and PAF 4—5—6—8ns
NOTES:
1. All AC timings apply to both IDT Standard mode and First Word Fall Through mode.
2. Industrial temperature range product for the 6-7ns speed grade is available as a standard device. All other speed grades are available by special order.
3. Pulse widths less than minimum values are not allowed.
4. Values guaranteed by design, not currently tested.
11
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
FEBRUARY 13, 2009
Input Pulse Levels 0.25 to 1.25V
Input Rise/Fall Times 0.4ns
Input Timing Reference Levels 0.75V
Output Reference Levels 0.75V
HSTL
1.5V AC TEST CONDITIONS
Figure 2b. Lumped Capacitive Load, Typical Derating
AC TEST LOADS
Figure 2a. AC Test Load
Input Pulse Levels 0.4 to 1.4V
Input Rise/Fall Times 0.4ns
Input Timing Reference Levels 0.9V
Output Reference Levels 0.9V
EXTENDED HSTL
1.8V AC TEST CONDITIONS
Input Pulse Levels GND to 2.5V
Input Rise/Fall Times 1ns
Input Timing Reference Levels 1.25V
Output Reference Levels 1.25V
2.5V LVTTL
2.5V AC TEST CONDITIONS
NOTE:
1. VDDQ = 1.5V±.
NOTE:
1. VDDQ = 1.8V±.
NOTE:
1. For LVTTL VCC = VDDQ.
5996 drw04
50
V
DDQ
/2
I/O
Z0 = 50
10pF
5996 drw04a
6
5
4
3
2
1
20 30 50 80 100 200
Ca
p
acitance
(p
F
)
t
CD
(Typical, ns)
12
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
FEBRUARY 13, 2009
OUTPUT ENABLE & DISABLE TIMING
READ CHIP SELECT ENABLE & DISABLE TIMING
V
IH
OE
V
IL
t
OE &
t
OLZ
V
CC
2
V
CC
2
100mV
100mV
t
OHZ
100mV
100mV
Output
Normally
LOW
Output
Normally
HIGH
V
OL
V
OH
V
CC
2
V
CC
2
5996 drw04b
Output
Enable
Output
Disable
VIH
RCS
VIL
tENS
tENH
tRCSLZ
RCLK
VCC
2
VCC
2
100mV
100mV
tRCSHZ
100mV
100mV
Output
Normally
LOW
Output
Normally
HIGH
V
OL
VOH
VCC
2
VCC
2
5996 drw04c
NOTES:
1. REN is HIGH.
2. RCS is LOW.
NOTES:
1. REN is HIGH.
2. OE is LOW.

IDT72T20118L5BB

Mfr. #:
Manufacturer:
Description:
IC FIFO 65536X20 5NS 208BGA
Lifecycle:
New from this manufacturer.
Delivery:
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