34
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
FEBRUARY 13, 2009
Figure 14. Read Cycle, Empty Flag and First Data Word Latency in x20 DDR to x10 SDR with Bus-Matching and Rate-Matching (IDT Standard Mode)
RCLK
EF
WEN
REN
WCS
tENS
tSKEW2
(1)
D0-D19
tDS
W
0
- W
1
Q0-Q9
WCLK
tENH
twcSH
tWCSS
W
2
-
W
3
tDH
tDS
tDH
12
tREF
tENS
tA tA
tA tA
W0
W1 W2 W3
tENH
tREF
Previous Data in Ouput Register
5996 drw17
NOTES:
1. t
SKEW2 is the minimum time between a falling WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the falling edge of WCLK and the rising edge of RCLK
is less than t
SKEW2, then EF deassertion may be delayed one extra RCLK cycle.
2. REN = LOW.
3. First data word latency = t
SKEW1 + 1*tRCLK + tREF.
4. RCS = LOW, WSDR = HIGH and RSDR = HIGH.
5. RCLK must be free running for EF to update.
35
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
FEBRUARY 13, 2009
Figure 15. Read Cycle and Empty Flag in x10 SDR to x20 DDR with Bus-Matching and Rate-Matching (IDT Standard Mode)
NOTES:
1. t
SKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the rising edge of WCLK and the rising edge of RCLK is
less than t
SKEW1, then EF deassertion may be delayed one extra RCLK cycle.
2. OE = LOW.
3. First data word latency = t
SKEW1 + 1*tRCLK + tREF.
4. RCS = LOW, WCS = LOW, WSDR = LOW and RSDR = HIGH.
5. RCLK must be free running for EF to update.
Q0-Q19
tSKEW
(1)
WCLK
RCLK
REN
12
WEN
t
REF
EF
D
0
-D9
5996 drw18
tREF tREF
Last
Word
Last 20-bit Word
tENS
tENH
W
0
W
1
W
2
W
3
tENH
tENS
W
0
-W
1
W
2
-W
3
tA tAtA tA
tDS
tDH
tDS
tDH
tDS
tDH tDH
tDS
tCLK2
tCLKH2 tCLKL2
Previous Data
tENH
NO Read
36
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
FEBRUARY 13, 2009
Figure 16. Write Cycle and Full Flag Timing in x10 DDR to x20 SDR with Bus-Matching and Rate-Matching (IDT Standard Mode)
WCLK
FF
WEN
RCS
t
ENS
t
SKEW1
(1)
Q
0
-Q
19
RCLK
t
ENH
t
ENS
1
2
t
WFF
D
0
-D
9
REN
t
RCSLZ
t
A
t
DS
t
DS
t
DH
t
DH
t
WFF
t
SKEW1
(1)
t
ENS
t
ENH
t
A
1
2
t
WFF
t
DS
t
DS
t
DH
t
DH
t
CLK2
t
CLKH2
t
CLKL2
NO WRITE
NO WRITE
t
WFF
DATA READ
NEXT DATA READ
Wx
Wx+1 Wx+2 Wx+3
5996 drw19
NOTES:
1. t
SKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle plus tWFF). If the time between the rising edge of the RCLK and the rising edge of the
WCLK is less than t
SKEW1, then the FF deassertion may be delayed one extra WCLK cycle.
2. OE = LOW, EF = HIGH.
3. WCS = LOW.
4. WCLK must be free running for FF to update.

IDT72T20118L5BB

Mfr. #:
Manufacturer:
Description:
IC FIFO 65536X20 5NS 208BGA
Lifecycle:
New from this manufacturer.
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