Application information STGIPN3H60-E
16/22 DocID027271 Rev 1
5 Application information
Figure 7. Typical application circuit
DocID027271 Rev 1 17/22
STGIPN3H60-E Application information
22
5.1 Recommendations
Input signal HIN is active high logic. An 85 kΩ (typ.) pull-down resistor is built-in for
each high side input. If an external RC filter is used for noise immunity, attention should
be given to the variation of the input signal level.
Input signal LIN
is active low logic. A 720 kΩ (typ.) pull-up resistor, connected to an
internal 5 V regulator through a diode, is built-in for each low side input.
To prevent input signal oscillation, the wiring of each input should be as short as
possible.
By integrating an application-specific type HVIC inside the module, direct coupling to
the MCU terminals without an opto-coupler is possible.
Each capacitor should be located as close as possible to the pins of the IPM.
Low inductance shunt resistors should be used for phase leg current sensing.
Electrolytic bus capacitors should be mounted as close to the module bus terminals as
possible. Additional high frequency ceramic capacitors mounted close to the module
pins will further improve performance.
The SD
/OD signal should be pulled up to 5 V / 3.3 V with an external resistor (see
Section 4: Smart shutdown function for detailed info).
Note: For further details refer to AN4043.
Table 14. Recommended operating conditions
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
PN
Supply voltage
Applied between P-Nu,
Nv, Nw
300 500 V
V
CC
Control supply voltage
Applied between V
CC
-
GND
13.5 15 18 V
V
BS
High side bias voltage
Applied between V
BOOTi
-
OUT
i
for i = U, V, W
13 18 V
t
dead
Blanking time to prevent
Arm-short
For each input signal 1.5 μs
f
PWM
PWM input signal
-40°C < T
c
< 100°C
-40°C < T
j
< 125°C
25 kHz
T
C
Case operation temperature 100 °C
Package mechanical data STGIPN3H60-E
18/22 DocID027271 Rev 1
6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 8. NDIP-26L type C mechanical drawing

STGIPN3H60-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IGBT Modules
Lifecycle:
New from this manufacturer.
Delivery:
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