Applications Information
MC13192/MC13193 Technical Data, Rev. 3.1
Freescale Semiconductor 19
Figure 11. MC13192/MC13193 Configured With a MCU
L2
8.2nH
GPIO
GPIO
100_Ohm4
50_Ohm2
GPIO
50_Ohm7
GPIO
SCLK
CLK
Z1
LDB212G4020C-001
5
1
6
2
3
4
C4
220nF
C8
10pF
C6
6.8pF
J1
SMA Receptacle, Female
1
2
5
3
4
C12
0.5pF
C11
10pF
C2
220nF
L1
6.8nH
C9
10pF
MOSI
MCU
C3
220nF
100_Ohm1
50_Ohm1
C10
10pF
L3
8.2nH
MISO
C5
6.8pF
SS
IC1
MC13192
14
19
15
11
10
9
8
25
23
24
20
18
17
6
5
1
2
12
13
7
16
4
3
26
27
31
32
21
22
29
28
30
EP
ATTNB
CEB
CLKO
GPIO1
GPIO2
GPIO3
GPIO4
GPIO7
GPIO5
GPIO6
IRQB
MISO
MOSI
PAO_M
PAO_P
RIN_M
RIN_P
RSTB
RXTXEN
Not Used
SPICLK
Not Used
Not Used
XTAL1
XTAL2
VBATT
VDDA
VDDD
VDDINT
VDDLO1
VDDLO2
VDDVCO
GND
R3
0
VDDA
VDDA
Z2
LDB212G4020C-001
5
1
6
2
3
4
R2 0
3V0_BB
GPIO
3V0_RF
50_Ohm4
50_Ohm6
X1
16.000MHz
C1
1µF
100_Ohm2
IC2
µPG 2012TK-E2
6
5
4
1
3
2
VDD
IN
VCONT
OUT1
OUT2
GND
GPIO
50_Ohm3
R1 470K
ANT1
F_Antenna
C7
10pF
100_Ohm3
IRQ
Applications Information
MC13192/MC13193 Technical Data, Rev. 3.1
20 Freescale Semiconductor
8.3 Crystal Requirements
The suggested crystal specification for the MC13192/MC13193 is shown in Table 10. A number of the
stated parameters are related to desired package, desired temperature range and use of crystal capacitive
load trimming. For more design details and suggested crystals, see application note AN3251, Reference
Oscillator Crystal Requirements for MC1319x, MC1320x, and MC1321x.
Table 9. MC13192/MC13193 to MCU Bill of Materials (BOM)
Item Quantity Reference Part Manufacturer
1 1 ANT1 F_Antenna Printed wire
21 C1 1 µF
3 3 C2, C3, C4 220 nF
4 2 C5, C6 6.8 pF
5 5 C7, C8, C9, C10,
C11
10 pF
6 1 C12 0.5 pF
7 1 IC1 MC13192/MC13193 Freescale Semiconductor
81 IC2 µPG2012TK-E2 NEC
9 1 J1 SMA Receptacle,
Female
10 1 L1 6.8 nH
11 2 L2, L3 8.2 nH
12 1 R1 470 k
13 2 R2, R3 0
14 1 X1 16.000 MHz, Type
DSX321G, ZD00882
KDS, Daishinku Corp
15 2 Z1, Z2 LDB212G4020C-001 Murata
Table 10. MC13192/MC13193 Crystal Specifications
1
Parameter Value Unit Condition
Frequency 16.000000 MHz
Frequency tolerance (cut tolerance)
2
± 10 ppm at 25 °C
Frequency stability (temperature drift)
3
± 15 ppm Over desired temperature range
Aging
4
± 2 ppm max
Equivalent series resistance
5
43 max
Load capacitance
6
5 - 9 pF
Applications Information
MC13192/MC13193 Technical Data, Rev. 3.1
Freescale Semiconductor 21
8.4 Low Power Considerations
Program and use the modem IO pins properly for low power operation
All unused modem GPIOx signals must be used one of 2 ways:
If the Off mode is to be used as a long term low power mode, unused GPIO should be tied
to ground. The default GPIO mode is an input and there will be no conflict.
If only Hibernate and/or Doze modes are used as long term low power modes, the GPIO
should programmed as outputs in the low state.
When modem GPIO are used as outputs:
Pullup resistors should be provided (can be provided by the MCU IO pin if tied to the MCU)
if the modem Off condition is to be used as a long term low power mode.
During Hibernate and/or Doze modes, the GPIO will retain its programmed output state.
If the modem GPIO is used as an input, the GPIO should be driven by its source during all low
power modes or a pullup resistor should be provided.
Digital outputs IRQ, MISO, and CLKO:
MISO - is always an output. During Hibernate, Doze, and active modes, the default
condition is for the MISO output to go to tristate when CE
is de-asserted, and this can cause
a problem with the MCU because one of its inputs can float. Program Control_B Register
07, Bit 11, miso_hiz_en = 0 so that MISO is driven low when CE
is de-asserted. As a result,
MISO will not float when Doze or Hibernate Mode is enabled.
–IRQ
- is an open drain output (OD) and should always have a pullup resistor (typically
provided by the MCU IO). IRQ acts as the interrupt request output.
NOTE
It is good practice to have the IRQ
interrupt input to the MCU disabled
during the hardware reset to the modem. After releasing the modem
hardware reset, the interrupt request input to the MCU can then be enabled
to await the IRQ that signifies the modem is ready and in Idle mode; this can
prevent a possible extraneous false interrupt request.
CLKO - is always an output. During Hibernate CLKO retains its output state, but does not
toggle. During Doze, CLKO may toggle depending on whether it is being used.
Shunt capacitance <2 pF max
Mode of oscillation fundamental
1
User must be sure manufacturer specifications apply to the desired package.
2
A wider frequency tolerance may acceptable if application uses trimming at production final test.
3
A wider frequency stability may be acceptable if application uses trimming at production final test.
4
A wider aging tolerance may be acceptable if application uses trimming at production final test.
5
Higher ESR may be acceptable with lower load capacitance.
6
Lower load capacitance can allow higher ESR and is better for low temperature operation in Doze mode.
Table 10. MC13192/MC13193 Crystal Specifications
1
(continued)
Parameter Value Unit Condition

MC13193FCR2

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF Transceiver ABEL ZIGBEE TRANS
Lifecycle:
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