LTC2921/LTC2922 Series
19
29212fa
F Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1650)
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
PACKAGE DESCRIPTIO
U
F20 TSSOP 0502
0.09 – 0.20
(.0036 – .0079)
0
° – 8°
0.45 – 0.75
(.018 – .030)
4.30 – 4.50**
(.169 – .177)
6.40
BSC
134
5
6
7
8910
111214 13
6.40 – 6.60*
(.252 – .260)
20 19 18 17 16 15
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
2
MILLIMETERS
(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
*
**
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
RECOMMENDED SOLDER PAD LAYOUT
0.45 ±0.05
0.65 TYP
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
GN16 (SSOP) 0502
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16
15
14
13
.189 – .196*
(4.801 – 4.978)
12 11 10
9
.016 – .050
(0.406 – 1.270)
.015 ± .004
(0.38 ± 0.10)
× 45°
0° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.053 – .068
(1.351 – 1.727)
.008 – .012
(0.203 – 0.305)
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 TYP.0165 ±.0015
.045 ±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
