SiI 163B PanelLink Receiver
Data Sheet
iii SiI-DS-0055-C
TABLE OF CONTENTS
SiI 163B Pin Diagram ..................................................................................................................................... 1
Functional Description .................................................................................................................................... 2
Electrical Specifications .................................................................................................................................. 3
Absolute Maximum Conditions ................................................................................................................... 3
Normal Operating Conditions ..................................................................................................................... 3
Digital I/O Specifications ............................................................................................................................. 3
DC Specifications........................................................................................................................................ 4
AC Specifications ........................................................................................................................................ 5
Setup and Hold Timings for Data Rates other than 165 MHz ................................................................. 6
Timing Diagrams............................................................................................................................................. 7
Pin Descriptions............................................................................................................................................ 10
Output Pins ............................................................................................................................................... 10
Configuration Pins..................................................................................................................................... 11
Power Management Pins.......................................................................................................................... 11
Differential Signal Data Pins ..................................................................................................................... 12
Reserved Pin............................................................................................................................................. 12
Power and Ground Pins............................................................................................................................ 12
Feature Information ...................................................................................................................................... 13
Dual Link ................................................................................................................................................... 13
Dual Link Configuration Pins................................................................................................................. 13
Dual Link Power Management .............................................................................................................. 16
Dual Link Mode Selection...................................................................................................................... 16
Dual Link Timing Diagrams ................................................................................................................... 17
Clock Detect Function............................................................................................................................... 19
OCK_INV# Function ................................................................................................................................. 19
TFT Panel Data Mapping.......................................................................................................................... 20
Design Recommendations ........................................................................................................................... 27
Differences Between SiI 161A and SiI 163B............................................................................................. 27
Voltage Ripple Regulation......................................................................................................................... 28
Decoupling Capacitors.............................................................................................................................. 29
Series Damping Resistors on Outputs...................................................................................................... 30
Receiver Layout ........................................................................................................................................ 30
Stabilized TMDS Inputs............................................................................................................................. 32
Staggered Outputs and Two Pixels per Clock .......................................................................................... 32
Packaging ..................................................................................................................................................... 33
ePad Enhancement .................................................................................................................................. 33
PCB Thermal Land Area ....................................................................................................................... 34
100-pin TQFP Package Dimensions and Marking Specification .............................................................. 35
Marking Specification ................................................................................................................................ 35
Ordering Information..................................................................................................................................... 35
