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AT21CS01-SSHM11-T

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P47
33
AT21CS01 [DATASHEET]
Atmel-8903A-SEEPROM-AT21CS01-Datasheet_082015
12. Packaging Information
12.1 8S1 — 8-lead SOIC
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 – 0.25
A – – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.90 BSC
E 6.00 BSC
E1 3.90 BSC
e 1.27 BSC
L 0.40 – 1.27
Ø
Ø
0° – 8°
Ø
E
1
N
TOP VIEW
C
E1
END VIEW
A
b
L
A1
e
D
SIDE VIEW
8S1 H
3/6/2015
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
SWB
Note:  For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging.
AT21CS01/AT21CS11
© 2017 Microchip Technology Inc.
Datasheet
DS20005857A-page 40
35
AT21CS01 [DATASHEET]
Atmel-8903A-SEEPROM-AT21CS01-Datasheet_082015
12.3 4U-6 — 4-ball WLCSP
DRAWING NO. REV. TITLE GPC
4U-6 B
8/7/15
4U-6, 4-ball 2x2 Array, 0.40mm Pitch
Wafer Level Chip-Scale Package (WLCSP) with BSC
GPH
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN TYP MAX NOTE
A 0.313 0.334 0.355
A1 — 0.094 —
A2 — 0.240 — 3
D
Contact Microchip for details
d1 0.400 BSC
E
Contact Microchip for details
e1 0.400 BSC
b 0.170 0.185 0.200
PIN ASSIGNMENT MATRIX
1 2
A
B
SI/O
GND
NC
NC
TOP VIEW
SIDE VIEW
BOTTOM SIDE
Note: 1. Dimensions are NOT to scale.
2. Solder ball composition is 95.5Sn-4.0Ag-0.5Cu.
3. Product offered with Back Side Coating.
k
0.015
(4X)
A
B
C
k 0.075 C
SEATING PLANE
d b
A1 CORNER
A1 CORNER
d 0.015
m
C
v
0.05
C A B
m
d
D
E
d1
e1
A2
A1
A
A
B
12
B
A
1 2
Note:  For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging.
AT21CS01/AT21CS11
© 2017 Microchip Technology Inc.
Datasheet
DS20005857A-page 41
11. Revision History
Atmel AT21CS01 Document 8903 Revision A (August 2015)
Initial document release.
Atmel AT21CS11 Document 8975 Revision A (August 2015)
Initial document release, Preliminary Status.
Atmel AT21CS11 Document 8975 Revision B (November 2015)
Removed Standard Speed mode
Revision A (October 2017)
Updated to Microchip template. This replaces Atmel documents 8903 and 8975. Added XSFN package.
Updated DC output current absolute maximum rating. Removed lead finish designation. Updated trace
code format in package markings.
AT21CS01/AT21CS11
© 2017 Microchip Technology Inc.
Datasheet
DS20005857A-page 42
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P47

AT21CS01-SSHM11-T

Mfr. #:
Buy AT21CS01-SSHM11-T
Manufacturer:
Microchip Technology / Atmel
Description:
EEPROM SEEPROM, 1K, SW - 1.7-3.6V, 125Kbps, Ind Tmp, 8-SOIC
Lifecycle:
New from this manufacturer.
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