Document Number: 001-98295 Rev. *L Page 13 of 19
S70FL01GS
11.1 Valid Combinations — Standard
Table 9 lists the valid combinations configurations planned to be supported in volume for this device.
Note:
1. Package Marking omits the leading “S70” and package type.
11.2 Valid Combinations — Automotive Grade / AEC-Q100
Table 10 lists configurations that are Automotive Grade / AEC-Q100 qualified and are planned to be available in volume. The table
will be updated as new combinations are released. Consult your local sales representative to confirm availability of specific
combinations and to check on newly released combinations.
Production Part Approval Process (PPAP) support is only provided for AEC-Q100 grade products.
Products to be used in end-use applications that require ISO/TS-16949 compliance must be AEC-Q100 grade products in
combination with PPAP. Non–AEC-Q100 grade products are not manufactured or documented in full compliance with
ISO/TS-16949 requirements.
AEC-Q100 grade products are also offered without PPAP support for end-use applications that do not require ISO/TS-16949
compliance.
Note:
1. Package Marking omits the leading “S70” and package type.
Table 9. S70FL01GS Valid Combinations — Standard
S70FL01GS Valid Combinations
Package Marking (1)
Base Ordering
Part Number
Speed
Option
Package and
Temperature
Model
Number
Packing Type
S70FL01GS
AG
MFI, MFV 01 0, 1, 3
FL01GS + A + (temp) + F + (Model Number)
DP FL01GS + D + (temp) + F + (Model Number)
DS FL01GS + S + (temp) + F + (Model Number)
AG
BHI, BHV C1 0, 3
FL01GS + A + (temp) + H + (Model Number)
DP FL01GS + D + (temp) + H + (Model Number)
DS FL01GS + S + (temp) + H + (Model Number)
Table 10. S70FL01GS Valid Combinations — Automotive Grade / AEC-Q100
S70FL01GS Valid Combinations
Package Marking (1)
Base Ordering
Part Number
Speed
Option
Package and
Temperature
Model
Number
Packing Type
S70FL01GS
AG
MFA, MFB,
MFM
01 0, 1, 3
FL01GS + A + (temp) + F + (Model Number)
DS FL01GS + S + (temp) + F + (Model Number)
AG
BHA, BHB,
BHM
C1 0, 3
FL01GS + A + (temp) + H + (Model Number)
DS FL01GS + S + (temp) + H + (Model Number)
Document Number: 001-98295 Rev. *L Page 14 of 19
S70FL01GS
12. Other Resources
12.1 Cypress Flash Memory Roadmap
www.cypress.com/product-roadmaps/cypress-flash-memory-roadmap
12.2 Links to Software
www.cypress.com/software-and-drivers-cypress-flash-memory
12.3 Links to Application Notes
www.cypress.com/appnotes
Document Number: 001-98295 Rev. *L Page 15 of 19
S70FL01GS
13. Physical Diagram
13.1 SOIC 16 Lead, 300-mil Body Width
SHEET
OF
REVSPEC NO.
THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF CYPRESS
SEMICONDUCTOR CORPORATION. THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED WITHOUT WRITTEN CONSENT OF CYPRESS SEMICONDUCTOR CORPORATION.
CYPRESS
TITLE
SCALE :
Company Confidential
PACKAGE
CODE(S)
DRAWN BY
APPROVED BY
DATE
DATE
0.33 C
0.25 M DCA-B
0.20 C
A-B
0.10 C
0.10 C
0.10 C
D
2X
2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M - 1994.
3. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
END. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 mm PER SIDE.
1. ALL DIMENSIONS ARE IN MILLIMETERS.
NOTES:
D AND E1 DIMENSIONS ARE DETERMINED AT DATUM H.
FLASH, BUT INCLUSIVE OF ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD
4. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM. DIMENSIONS
5. DATUMS A AND B TO BE DETERMINED AT DATUM H.
6. "N" IS THE MAXIMUM NUMBER OF TERMINAL POSITIONS FOR THE SPECIFIED
7. THE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 TO
MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE
8. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR
LOWER RADIUS OF THE LEAD FOOT.
IDENTIFIER MUST BE LOCATED WITHIN THE INDEX AREA INDICATED.
9. THIS CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT, THEN A PIN 1
10. LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
h
0
D
L2
N
e
A1
b
c
E
E1
A
0.75
10.30 BSC
1.27 BSC
0.30
10.30 BSC
0.33
0.25
16
0.20
7.50 BSC
0.10
0.31
0.51
2.65
2.35
A2
2.05
2.55
b1
0.27
0.48
0.30
0.20
c1
L1
0.40
L
1.27
1.40 REF
0.25 BSC
0
15°
0
1
2
-
DIMENSIONS
SYMBOL
MIN. NOM.
MAX.
-
-
-
-
-
-
-
-
-
-
-
-
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 mm PER
D AND E1 ARE DETERMINED AT THE OUTMOST EXTREMES OF THE PLASTIC BODY
0.25 mm FROM THE LEAD TIP.
PROTRUSION SHALL BE 0.10 mm TOTAL IN EXCESS OF THE "b" DIMENSION AT
THE PLASTIC BODY.
PACKAGE LENGTH.
SEATING PLANE.
SO3016
KOTA
BESY
24-OCT-16
24-OCT-16
*A
002-15547
PACKAGE OUTLINE, 16 LEAD SOIC
12
TO FIT
10.30X7.50X2.65 MM SO3016/SL3016/SS3016
SL3016 SS3016

S70FL01GSDSMFV010

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
NOR Flash IC 1 Gb FLASH MEMORY
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union