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S70FL01GSDSMFV010

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19
Document Number: 001-98295 Rev. *L Page 16 of 19
S70FL01GS
13.2 24-Ball BGA 8 x 6 mm (ZSA024)
SHEET
OF
REVSPEC NO.
THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF CYPRESS
SEMICONDUCTOR CORPORATION. THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED WITHOUT WRITTEN CONSENT OF CYPRESS SEMICONDUCTOR CORPORATION.
CYPRESS
TITLE
SCALE :
Company Confidential
PACKAGE
CODE(S)
DRAWN BY
APPROVED BY
DATE
DATE
METALLIZED MARK INDENTATION OR OTHER MEANS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK,
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX SIZE
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW,
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW,
THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.
"SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
e REPRESENTS THE SOLDER BALL GRID PITCH.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE
BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.
DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS.
8.
9.
7
ALL DIMENSIONS ARE IN MILLIMETERS.
PARALLEL TO DATUM C.
5.
6
4.
3.
1.
2.
NOTES:
0.35
eD
eE
ME
MD
b
n
1.00 BSC
0.00
1.00 BSC
5
5
0.40
24
MIN.
0.20
D1
E1
D
E
SYMBOL
A1
A
8.00 BSC
4.00 BSC
6.00 BSC
4.00 BSC
NOM.
0.45
1.20
MAX.
DIMENSIONS
--
--
SE
SD
0.00
"SD" = eD/2 AND "SE" = eE/2.
"SD" OR "SE" = 0.
MD X ME.
ZSA024
KOTA
SYLI
5-JUL-16
5-JUL-16
**
002-15078
8.0X6.0X1.2 MM ZSA024
PACKAGE OUTLINE, 24 BALL FBGA
12
TO FIT
Document Number: 001-98295 Rev. *L Page 17 of 19
S70FL01GS
14. Revision History
Document Title: S70FL01GS, 1 Gbit (128 Mbyte) 3.0V SPI Flash
Document Number: 001-98295
Rev. ECN No.
Orig. of
Change
Submission
Date
Description of Change
**
BWHA 11/06/2012 Initial release
*A
BWHA 04/25/2013
Global: Datasheet designation updated from Advance Information to Preliminary
DC Characteristics: DC Characteristics table: changed Max value of ILI, ILO,
ICC1, and ISB
*B BWHA 05/16/2013
SOIC 16 Physical Diagram: Updated package nomenclature from S03016 to
SL3016
*C
BWHA 08/22/2013
Valid Combinations: Valid Combinations table: added MFV
DC Characteristics: DC Characteristics table: added ISB (Automotive)
*D
BWHA 11/08/2013 Global: Datasheet designation updated from Preliminary to Full Production
*E
BWHA 03/19/2014
Features: Packages (all Pb-free): added BGA-24, 8 x 6 mm
Connections Diagrams: Added figure: 24-Ball BGA, 5 x 5 Ball Footprint (FAB024),
Top View
Ordering Information: Added options to: Model Number, Package Materials,
Package Type, and Speed
Valid Combinations: Added option to S70FL01GS Valid Combinations Table
SDR AC Characteristics: SDR AC Characteristics (Single Die Package, VCC =
2.7V to 3.6V) table: updated tv Min
DDR AC Characteristics:Updated DDR AC Characteristics 66 MHz Operation
table
Capacitance Characteristics: Capacitance table: updated Max values and
removed note
*F
BWHA 11/07/2014 Valid Combinations: Added DP Speed Option for BGA 5x5 package
*G
BWHA 04/21/2015 Valid Combinations: Added BHV option
*H 4871631 BWHA 08/24/2015
Updated to Cypress template.
Changed Automotive Temperature Range to Industrial Plus Temperature Range
in Features and Section 4.
*I 5123878 BWHA 02/03/2016 Updated General Description.
*J 5536564 BWHA 12/02/2016
Updated Features on page 1: Added Extended and Automotive Grade
temperatures.
Updated DDR AC Characteristics 66 MHz and 80 MHz Operation on page 11
table: Corrected t
HO
Min value, t
CSH
and t
SU
Max value.
Ordering Information on page 12: Added Extended and Automotive Grade.
Added Other Resources on page 14.
*K 5612027 ECAO 01/17/2017
Added I
CC1
value for Quad DDR @ 80 MHz in Table 4, DC Characteristics
on page 8
Updated I
CC5
value in Table 4, DC Characteristics on page 8
Updated DDR AC Characteristics 66 MHz and 80 MHz Operation on page 11
Removed Extended (-40°C to +125°C) temperature option in Ordering Infor-
mation
Updated Physical Diagram:
Updated package name and drawing from SL3016 to SS3016.
Updated package name and drawing from FAB024 to ZSA024.
Document Number: 001-98295 Rev. *L Page 18 of 19
S70FL01GS
*L 5669602 ECAO 04/05/2017
Updated Figure 2, 24-Ball BGA, 5 x 5 Ball Footprint (ZSA024), Top View
on page 4.
Removed SS3016 from Section 13.1, SOIC 16 Lead, 300-mil Body Width
on page 15.
Removed CS# from Table 2, Signal List on page 5.
Updated t
SU
in Table 6, SDR AC Characteristics (Single Die Package, V
CC
=
2.7V to 3.6V) on page 10.
Updated Cypress logo.
Updated Sales page.
Document Title: S70FL01GS, 1 Gbit (128 Mbyte) 3.0V SPI Flash
Document Number: 001-98295
Rev. ECN No.
Orig. of
Change
Submission
Date
Description of Change
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19

S70FL01GSDSMFV010

Mfr. #:
Buy S70FL01GSDSMFV010
Manufacturer:
Cypress Semiconductor
Description:
NOR Flash IC 1 Gb FLASH MEMORY
Lifecycle:
New from this manufacturer.
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