OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

72V3656L15PF8

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39
7
COMMERCIAL TEMPERATURE RANGE
IDT72V3656/72V3666/72V3676 3.3V CMOS TRIPLE BUS SyncFIFO
TM
WITH BUS MATCHING 2,048 x 36 x 2, 4,096 x 36 x 2 and 8,192 x 36 x 2
Symbol Rating Commercial Unit
VCC Supply Voltage Range –0.5 to +4.6 V
VI
(2)
Input Voltage Range –0.5 to VCC+0.5 V
VO
(2)
Output Voltage Range –0.5 to VCC+0.5 V
IIK Input Clamp Current (VI < 0 or VI > VCC) ±20 mA
IOK Output Clamp Current (VO = < 0 or VO > VCC) ±50 mA
IOUT Continuous Output Current (VO = 0 to VCC) ±50 mA
ICC Continuous Current Through VCC or GND ±400 mA
TSTG Storage Temperature Range –65 to 150 °C
NOTES:
1. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these
or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect
device reliability.
2. The input and output voltage ratings may be exceeded provided the input and output current ratings are observed.
ABSOLUTE MAXIMUM RATINGS OVER OPERATING FREE-AIR
TEMPERATURE RANGE (Unless otherwise noted)
(1)
ELECTRICAL CHARACTERISTICS OVER RECOMMENDED OPERATING
FREE-AIR TEMPERATURE RANGE (Unless otherwise noted)
RECOMMENDED OPERATING CONDITIONS
NOTE:
1. For 10ns speed grade: Vcc = 3.3V ± 0.15V, JEDEC JESD8-A compliant
Symbol Parameter Min. Typ. Max. Unit
V
CC
(1)
Supply Voltage for 10ns 3.15 3.3 3.45 V
V
CC Supply Voltage for 15ns 3.0 3.3 3.6 V
V
IH High-Level Input Voltage 2 — VCC+0.5 V
VIL Low-Level Input Voltage — — 0.8 V
I
OH High-Level Output Current — — –4 mA
I
OL Low-Level Output Current — — 8 mA
T
A Operating Temperature 0 — 70 °C
NOTES:
1. All typical values are at VCC = 3.3V, TA = 25°C.
2. Commercial-10ns speed grade only: Vcc = 3.3V ± 0.15V, TA = 0° to +70°; JEDEC JESD8-A compliant.
3. For additional ICC information, see Figure 1, Typical Characteristics: Supply Current (ICC) vs. Clock Frequency (fS).
4. Characterized values, not currently tested.
IDT72V3656
IDT72V3666
IDT72V3676
Commercial
t
CLK = 10, 15 ns
(2)
Symbol Parameter Test Conditions Min. Typ.
(1)
Max. Unit
V
OH Output Logic "1" Voltage VCC = 3.0V, IOH = –4 mA 2.4 — — V
VOL Output Logic "0" Voltage VCC = 3.0V, IOL = 8 mA — — 0.5 V
I
LI Input Leakage Current (Any Input) VCC = 3.6V, VI = VCC or 0 — — ±10 µ A
I
LO Output Leakage Current VCC = 3.6V, VO = VCC or 0 — — ±10 µA
ICC2
(3)
Standby Current (with CLKA, CLKB & CLKC running) VCC = 3.6V, VI = VCC –0.2V or 0V — — 5 mA
I
CC3
(3)
Standby Current (no clocks running) VCC = 3.6V, VI = VCC –0.2V or 0V — — 1 mA
C
IN
(4)
Input Capacitance VI = 0, f = 1 MHz — 4 — pF
COUT
(4)
Output Capacitance VO = 0, f = 1 MHZ — 8 — pF
8
COMMERCIAL TEMPERATURE RANGE
IDT72V3656/72V3666/72V3676 3.3V CMOS TRIPLE BUS SyncFIFO
TM
WITH BUS MATCHING 2,048 x 36 x 2, 4,096 x 36 x 2 and 8,192 x 36 x 2
DETERMINING ACTIVE CURRENT CONSUMPTION AND POWER DISSIPATION
The ICC(f) current for the graph in Figure 1 was taken while simultaneously reading and writing a FIFO on the IDT72V3656/72V3666/72V3676 with CLKA,
CLKB and CLKC set to fS. All data inputs and data outputs change state during each clock cycle to consume the highest supply current. Data outputs were
disconnected to normalize the graph to a zero capacitance load. Once the capacitance load per data-output channel and the number of these device's inputs
driven by TTL HIGH levels are known, the power dissipation can be calculated with the equation below.
CALCULATING POWER DISSIPATION
With ICC(f) taken from Figure 1, the maximum power dissipation (PT) of these FIFOs may be calculated by:
PT = VCC x ICC(f) + Σ(CL x VCC
2
x fo)
N
where:
N = number of used outputs (36-bit (long word), 18-bit (word) or 9-bit (byte) bus size)
CL = output capacitance load
fo = switching frequency of an output
Figure 1. Typical Characteristics: Supply Current (ICC) vs. Clock Frequency (fS)
010203040506070
0
10
20
30
40
50
60
fS
⎯
Clock Frequency
⎯
MHz
ICC(f) Supply Current mA
fdata = 1/2 fS
TA = 25°C
C
L = 0 pF
4665 drw02a
70
90
80
100
80
90
100
VCC = 3.3V
V
CC = 3.6V
V
CC = 3.0V
9
COMMERCIAL TEMPERATURE RANGE
IDT72V3656/72V3666/72V3676 3.3V CMOS TRIPLE BUS SyncFIFO
TM
WITH BUS MATCHING 2,048 x 36 x 2, 4,096 x 36 x 2 and 8,192 x 36 x 2
TIMING REQUIREMENTS OVER RECOMMENDED RANGES OF SUPPLY
VOLTAGE AND OPERATING FREE-AIR TEMPERATURE
IDT72V3656L10
(1)
IDT72V3656L15
IDT72V3666L10
(1)
IDT72V3666L15
IDT72V3676L10
(1)
IDT72V3676L15
Symbol Parameter Min. Max. Min. Max. Unit
fS Clock Frequency, CLKA, CLKB, or CLKC — 100 — 66.7 MHz
tCLK Clock Cycle Time, CLKA, CLKB, or CLKC 10 — 15 — ns
tCLKH Pulse Duration, CLKA, CLKB, or CLKC HIGH 4.5 — 6 — ns
tCLKL Pulse Duration, CLKA, CLKB, OR CLKC LOW 4.5 — 6 — ns
tDS Setup Time, A0-A35 before CLKA↑ and C0-C17 before CLKC↑ 3—4—ns
tENS1 Setup Time, CSA and W/RA before CLKA↑; CSB 4 — 4.5 — ns
before CLKB↑
tENS2 Setup Time, ENA, and MBA before CLKA↑; RENB 3 — 4.5 — ns
and MBB before CLKB↑; WENC and MBC before CLKC↑
tRSTS Setup Time, MRS1, MRS2, PRS1, PRS2, RT1 or RT2 5—5—ns
LOW before CLKA↑ or CLKB↑
(2)
tFSS Setup Time, FS0, FS1, FS2 before MRS1 and MRS2 HIGH 7.5 — 8.5 — ns
tBES Setup Time, BE/FWFT before MRS1 and MRS2 HIGH 7.5 — 7.5 — ns
tSDS Setup Time, FS0/SD before CLKA↑ 3—4—ns
tSENS Setup Time, FS1/SEN before CLKA↑ 3—4—ns
tFWS Setup Time, BE/FWFT before CLKA↑ 0—0—ns
tRTMS Setup Time, RTM before RT1; RTM before RT2 5—5—ns
tDH Hold Time, A0-A35 after CLKA↑ and C0-C17 after CLKC↑ 0.5 — 1 — ns
tENH Hold Time, CSA, W/RA, ENA, and MBA after CLKA↑; CSB, 0.5 — 1 — ns
RENB, and MBB after CLKB↑; WENC and MBC after CLKC↑
tRSTH Hold Time, MRS1, MRS2, PRS1, PRS2, RT1 or RT2 4—4—ns
LOW after CLKA↑or CLKB↑
(2)
tFSH Hold Time, FS0, FS1, FS2 after MRS1 and MRS2 HIGH 2 — 2 — ns
tBEH Hold Time, BE/FWFT after MRS1 and MRS2 HIGH 2 — 2 — ns
tSDH Hold Time, FS0/SD after CLKA↑ 0.5 — 1 — ns
tSENH Hold Time, FS1/SEN HIGH after CLKA↑ 0.5 — 1 — ns
tSPH Hold Time, FS1/SEN HIGH after MRS1 and MRS2 HIGH 2 — 2 — ns
tRTMH Hold Time, RTM after RT1; RTM after RT2 5—5—ns
tSKEW1
(3)
Skew Time, between CLKA↑ and CLKB↑ for EFB/ORB and 5 — 7.5 — ns
FFA/IRA; between CLKA↑ and CLKC↑ for EFA/ORA and
FFC/IRC
tSKEW2
(3,4)
Skew Time, between CLKA↑ and CLKB↑ for AEB and AFA;12—12—ns
between CLKA↑ and CLKC↑ for AEA and AFC
NOTES:
1. For 10ns speed grade:
Vcc = 3.3V ± 0.15V; TA = 0° to +70°.
2. Requirement to count the clock edge as one of at least four needed to reset a FIFO.
3. Skew time is not a timing constraint for proper device operation and is only included to illustrate the timing relationship among CLKA cycle, CLKB cycle, and CLKC cycle.
4. Design simulated, not tested.
(For 10ns speed grade only: Vcc = 3.3V ± 0.15V; TA = 0°C to +70°C; JEDEC JESD8-A compliant)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39

72V3656L15PF8

Mfr. #:
Buy 72V3656L15PF8
Manufacturer:
IDT
Description:
FIFO 2KX36X2 TRIPLE BUS SYNC FIFO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet