Data Sheet ADV7181D
Rev. A | Page 9 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
AVDD to GND 4 V
PVDD to GND 2.2 V
DVDDIO to GND 4 V
DVDDIO to AVDD −0.3 V to +0.3 V
PVDD to DVDD −0.3 V to +0.3 V
DVDDIO to PVDD −0.3 V to +2 V
DVDDIO to DVDD −0.3 V to +2 V
AVDD to PVDD −0.3 V to +2 V
AVDD to DVDD −0.3 V to +2 V
Digital Inputs to GND GND − 0.3 V to
DVDDIO + 0.3 V
Digital Outputs to GND GND − 0.3 V to
DVDDIO + 0.3 V
Analog Inputs to GND GND − 0.3 V to
AVDD + 0.3 V
Operating Temperature Range −40°C to +85°C
Maximum Junction Temperature (T
J MAX
)
Storage Temperature Range
Infrared Reflow, Soldering (20 sec) 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
REFLOW SOLDER
The ADV7181D is a Pb-free, environmentally friendly product.
It is manufactured using the most up-to-date materials and pro-
cesses. The coating on the leads of each device is 100% pure Sn
electroplate. The device is suitable for Pb-free applications and
can withstand surface-mount soldering at up to 255°C ± 5°C.
In addition, the ADV7181D is backward-compatible with
conventional SnPb soldering processes. This means that the
electroplated Sn coating can be soldered with Sn/Pb solder
pastes at conventional reflow temperatures of 220°C to 235°C.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the part, turn off any
unused ADCs.
It is imperative that the recommended scripts be used for the
following high current modes: SCART, 720p, 1080i, and all
RGB graphic standards. Using the recommended scripts ensures
correct thermal performance. These scripts are available from
a local field applications engineer (FAE).
The junction temperature must always stay below the maximum
junction temperature (T
J
MAX
) of 125°C. The junction temperature
can be calculated by
T
J
= T
A MAX
+ (θ
JA
× W
MAX
)
where:
T
A MAX
= 85°C.
θ
JA
= 20.3°C / W.
W
MAX
= ((AV D D × I
AV DD
) + (DVDD × I
DVDD
) +
(DVDDIO × I
DVDDIO
) + (PVDD × I
PVDD
))
THERMAL RESISTANCE
Table 6 specifies the typical values for the junction-to-ambient
thermal resistance (θ
JA
) and the junction-to-case thermal resis-
tance (θ
JC
) for an ADV7181D soldered on a 4-layer PCB with
solid ground plane.
Table 6. Thermal Resistance
Package Type θ
θ
Unit
64-Lead LFCSP (CP-64-3) 20.3 1.2 °C/W
1
In still air.
ESD CAUTION
