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TC642CPA

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
2001-2012 Microchip Technology Inc. DS21444D-page 19
TC642
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
Foot Angle
f
048048
1512015120
Mold Draft Angle Bottom
1512015120
Mold Draft Angle Top
0.510.420.33.020.017.013BLead Width
0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length
0.510.380.25.020.015.010hChamfer Distance
5.004.904.80.197.193.189DOverall Length
3.993.913.71.157.154.146
E1
Molded Package Width
6.206.025.79.244.237.228EOverall Width
0.250.180.10.010.007.004A1Standoff §
1.551.421.32.061.056.052A2Molded Package Thickness
1.751.551.35.069.061.053AOverall Height
1.27.050
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
c
45×
f
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
TC642
DS21444D-page 20 2001-2012 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
p
A
A1
A2
D
L
c
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037.035FFootprint (Reference)
exceed. 010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
c
B
7
7
.004
.010
0
.006
.012
(F)
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff §
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016
.114
.114
.022
.118
.118
.002
.030
.193
.034
MIN
p
n
Units
.026
NOM
8
INCHES
1.000.950.90.039
0.15
0.30
.008
.016
6
0.10
0.25
0
7
7
0.20
0.40
6
MILLIMETERS*
0.65
0.86
3.00
3.00
0.55
4.90
.044
.122
.028
.122
.038
.006
0.40
2.90
2.90
0.05
0.76
MINMAX
NOM
1.18
0.70
3.10
3.10
0.15
0.97
MAX
8
E1
E
B
n 1
2
§ Significant Characteristic
.184
.200
4.67
.5.08
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2001-2012 Microchip Technology Inc. DS21444D-page 21
TC642
6.2 Taping Form
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin SOIC (N) 12 mm 8 mm 2500 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
Standard Reel Component Orientation
for 713 Suffix Device
PIN 1
User Direction of Feed
P
W
Component Taping Orientation for 8-Pin MSOP Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP 12 mm 8 mm 2500 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
PIN 1
User Direction of Feed
Standard Reel Component Orientation
for 713 Suffix Device
W
P
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

TC642CPA

Mfr. #:
Buy TC642CPA
Manufacturer:
Microchip Technology
Description:
Motor / Motion / Ignition Controllers & Drivers w/Fault Dtct
Lifecycle:
New from this manufacturer.
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