M95M01-R M95M01-W Package mechanical data
Doc ID 13264 Rev 8 37/41
Figure 21. TSSOP8 – 8-lead thin shrink small outline, package outline
1. Drawing is not to scale.
Table 18. TSSOP8 – 8-lead thin shrink small outline, package mechanical data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ Min Max Typ Min Max
A 1.200 0.0472
A1 0.050 0.150 0.0020 0.0059
A2 1.000 0.800 1.050 0.0394 0.0315 0.0413
b 0.190 0.300 0.0075 0.0118
c 0.090 0.200 0.0035 0.0079
CP 0.100 0.0039
D 3.000 2.900 3.100 0.1181 0.1142 0.1220
e 0.650 - - 0.0256 - -
E 6.400 6.200 6.600 0.2520 0.2441 0.2598
E1 4.400 4.300 4.500 0.1732 0.1693 0.1772
L 0.600 0.450 0.750 0.0236 0.0177 0.0295
L1 1.000 0.0394
α
N8 8
Package mechanical data M95M01-R M95M01-W
38/41 Doc ID 13264 Rev 8
Figure 22. WLCSP – 8 bump wafer length chip scale package
1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
3. Bump position designation as per JESD 95-1, SPP-010.
Table 19. WLCSP – 8 bump wafer length chip scale package
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ Min Max Typ Min Max
A 0.580 0.555 0.605 0.0228 0.0219 0.0238
A1 0.230 0.0091
A2 0.350 0.0138
b 0.322 0.0127
D 3.570 3.685 0.1406 0.1451
E 2.050 2.165 0.0807 0.0852
e 0.600 0.0236
e1 2.400 0.0945
e2 1.200 0.0472
F 0.585 0.0230
G 0.425 0.0167
N (number of bumps) 8
aaa 0.110 0.0043
bbb 0.110 0.0043
ccc 0.110 0.0043
ddd 0.060 0.0024
eee 0.060 0.0024
Wafer back side Side view Bump side
D
Detail A
Orientation reference
Orientation
reference
Bump
Detail A rotated by 90°
Seating plane
(2)
b(8x)
Note
(3)
A1
E
A2
A
e1
e2
e2
e
G
F
ai16079
Øccc M
Øddd M
Z X Y
Z
M95M01-R M95M01-W Part numbering
Doc ID 13264 Rev 8 39/41
12 Part numbering
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST sales office.
Table 20. Ordering information scheme
Example: M95M01 R MN 6 T P /K
Device type
M95 = SPI serial access EEPROM
Device function
M01 = 1024 Kbits (131 072 × 8)
Operating voltage
R = V
CC
= 1.8 V to 5.5 V
W = V
CC
= 2.5 V to 5.5 V
Package
MN = SO8N (150 mils width)
MW = SO8W (208 mils width)
CS = WLCSP
DW = TSSOP8 (169 mils width)
Device grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
3 = Automotive temperature range, –40 to 125 °C.
Device tested with high reliability certified flow
(1)
1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment.
The high reliability certified flow (HRCF) is described in the quality note QNEE9801. Please ask your
nearest ST sales office for a copy.
Option
blank = standard packing
T = tape and reel packing
Plating technology
P or G = ECOPACK
®
(RoHS compliant)
Process
(2)
2. The process letter only concerns WLCSP devices and device grade 3 products. For all other packages,
the process letters do not appear in the Ordering Information but only appear on the device package
(marking) and on the shipment box. Please contact your nearest ST sales office.
/A or /K= Manufacturing technology code

M95M01-RMW6G

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
EEPROM 1 Mbit Serial SPI EEProm
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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