2004 Mar 04 55
Philips Semiconductors Product specification
Digital video encoder SAA7104E; SAA7105E
10 THERMAL CHARACTERISTICS
Note
1. The overall R
th(j-a)
value can vary depending on the board layout. To minimize the effective R
th(j-a)
all power and
ground pins must be connected to the power and ground layers directly. An ample copper area direct under the
SAA7104E; SAA7105E with a number of through-hole plating, which connect to the ground layer (four-layer board:
second layer), can also reduce the effective R
th(j-a)
. Please do not use any solder-stop varnish under the chip. In
addition the usage of soldering glue with a high thermal conductance after curing is recommended.
11 CHARACTERISTICS
T
amb
= 0 to 70 °C (typical values excluded); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air 38
(1)
K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
DDA
analog supply voltage 3.15 3.3 3.45 V
V
DDD2
,
V
DDD3
,
V
DDD4
digital supply voltage 3.15 3.3 3.45 V
V
DDD1
digital supply voltage (DVO) 1.045 1.1 1.155 V
1.425 1.5 1.575 V
1.71 1.8 1.89 V
2.375 2.5 2.625 V
3.135 3.3 3.465 V
I
DDA
analog supply current note 1 1 110 115 mA
I
DDD
digital supply current note 2 1 175 200 mA
Inputs
V
IL
LOW-level input voltage V
DDD1
= 1.1 V, 1.5 V, 1.8 V
or 2.5 V; note 3
−0.1 − +0.2 V
V
DDD1
= 3.3 V; note 3 −0.5 − +0.8 V
pins RESET, TMS, TCK,
TRST and TDI
−0.5 − +0.8 V
V
IH
HIGH-level input voltage V
DDD1
= 1.1 V, 1.5 V, 1.8 V
or 2.5 V; note 3
V
DDD1
− 0.2 − V
DDD1
+ 0.1 V
V
DDD1
= 3.3 V; note 3 2 − V
DDD1
+ 0.3 V
pins RESET, TMS, TCK,
TRST and TDI
2 − V
DDD2
+ 0.3 V
I
LI
input leakage current −−10 µA
C
i
input capacitance clocks −−10 pF
data −−10 pF
I/Os at high-impedance −−10 pF