NCV8855
http://onsemi.com
4
PIN FUNCTION DESCRIPTIONS
Pin No. DescriptionSymbol
LOW DROPOUT LINEAR REGULATOR CONTROLLER 1 (LDO1) PIN CONNECTIONS
38
LR_FB1 LDO controller output voltage feedback pin. Connect a resistor divider network to VOUT3 to set the desired
output voltage.
1 LR_G1 Error amplifier output of the LDO controller. Connect to gate of P−Channel MOSFET pass element.
40 ISNS1+ Current sense positive input. Connect this pin to the supply side of the current sense resistor. This pin also
serves as the supply rail for the linear regulator controller. A local bypass capacitor with a value of 0.1 mF to 1
mF is recommended.
39 ISNS1− Current sense negative input. When using a current sense resistor, connect this pin to the pass element side
of the current sense resistor. If current limit is not used, connect this pin to the supply rail of the pass element.
LOW DROPOUT LINEAR REGULATOR CONTROLLER 2 (LDO2) PIN CONNECTIONS
34
LR_FB2 LDO controller output voltage feedback pin. Connect a resistor divider network to VOUT3 to set the desired
output voltage.
33 LR_G2 Error amplifier output of the LDO controller. Connect to gate of P−Channel MOSFET pass element.
31 ISNS2+ Current sense positive input. Connect this pin to the supply side of the current sense resistor. This pin also
serves as the supply rail for the linear regulator controller. A local bypass capacitor with a value of 0.1 mF to 1
mF is recommended.
32 ISNS2− Current sense negative input. When using a current sense resistor, connect this pin to the pass element side
of the current sense resistor. If current limit is not used, connect this pin to the supply rail of the pass element.
HIGH−SIDE LOAD SWITCH (HSS) PIN CONNECTIONS
26
VIN This pin is the supply rail for the internal high−side load switch, DRV_VPP and 5V_IC. Bypass this pin with a
1 mF ceramic capacitor.
28 HS_S Source node output of the internal high−side N−Channel MOSFET load switch.
MAXIMUM RATINGS (Voltages are with respect to AGND unless noted otherwise)
Pin Name Value Unit
Max dc voltage (GH1, BST1, SN1, SN2, BST2, HS_S) −0.3 to 30 V
Negative Transient (t < 50 ns) (SN1, SN2) −2 V
Max dc voltage: 5V_IC 6 V
Max dc voltage: DRV_VPP 9 V
Max dc voltage (BST1 & GH1w/respect to SN1, GL1, BST2 w/respect to SN2) −0.3 to 15 V
Max dc voltage (OCSET, ISNS1+, ISNS1−, LR_G1, VIN, VIN_SW, ISNS2+, ISNS2−, LR_G2) −0.3 to 40 V
Peak Transient (ES−XW7T−1A278−AB Test Pulse G – Loaded Conditions)
(OCSET, ISNS1+, ISNS1−, LR_G1, VIN, VIN_SW, ISNS2+, ISNS2−, LR_G2)
−0.3 to 45 V
Max dc voltage (SW_FB1, COMP1, LR_FB1, LDO_EN, HOT_FLG, SW_FB2, COMP2, LR_FB2, HS_EN,
SYS_EN, SYNC)
−0.3 to 7 V
Max dc voltage: PGND −0.3 to 0.3 V
Maximum Operating Junction Temperature Range, T
J
−40 to 150 °C
Maximum Storage Temperature Range, T
STG
−55 to +150 °C
Peak Reflow Soldering Temperature: Pb−Free
60 to 150 seconds at 217°C
260 peak °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
