ADG406/ADG407/ADG426
Rev. B | Page 20 of 20
COMPLIANT TO JEDEC STANDARDS MO-150-AH
060106-A
28
15
14
1
10.50
10.20
9.90
8.20
7.80
7.40
5.60
5.30
5.00
SEATING
PLANE
0.05 MIN
0.65 BSC
2.00 MAX
0.38
0.22
COPLANARITY
0.10
1.85
1.75
1.65
0.25
0.09
0.95
0.75
0.55
8°
4°
0°
Figure 39. 28-Lead Shrink Small Outline Package [SSOP]
(RS-28)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
2
ADG406BN −40°C to +85°C 28-Lead PDIP N-28-2
ADG406BNZ −40°C to +85°C 28-Lead PDIP N-28-2
ADG406BP −40°C to +85°C 28-Lead PLCC P-28
ADG406BP-REEL −40°C to +85°C 28-Lead PLCC P-28
ADG406BPZ −40°C to +85°C 28-Lead PLCC P-28
ADG406BPZ-REEL −40°C to +85°C 28-Lead PLCC P-28
ADG407BN −40°C to +85°C 28-Lead PDIP N-28-2
ADG407BNZ −40°C to +85°C 28-Lead PDIP N-28-2
ADG407BP −40°C to +85°C 28-Lead PLCC P-28
ADG407BP-REEL −40°C to +85°C 28-Lead PLCC P-28
ADG407BPZ −40°C to +85°C 28-Lead PLCC P-28
ADG407BPZ-RL −40°C to +85°C 28-Lead PLCC P-28
ADG407BCHIPS −40°C to +85°C DIE
ADG426BN −40°C to +85°C 28-Lead PDIP N-28-2
ADG426BNZ −40°C to +85°C 28-Lead PDIP N-28-2
ADG426BRS −40°C to +85°C 28-Lead SSOP RS-28
ADG426BRS-REEL −40°C to +85°C 28-Lead SSOP RS-28
ADG426BRS-REEL7 −40°C to +85°C 28-Lead SSOP RS-28
ADG426BRSZ −40°C to +85°C 28-Lead SSOP RS-28
ADG426BRSZ-REEL −40°C to +85°C 28-Lead SSOP RS-28
1
Z = RoHS Compliant Part.
2
N = Plastic DIP, P = Plastic Leaded Chip Carrier (PLCC), RS = Shrink Small Outline Package (SSOP).
©1994–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00026-0-5/10(B)
