VNQ5027AK-E Electrical specifications
Doc ID 12730 Rev 7 19/31
Figure 22. CS_DIS high level voltage Figure 23. CS_DIS clamp voltage
Figure 24. CS_DIS low level voltage
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0,5
1
1,5
2
2,5
3
3,5
4
Vcsdh (V)
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
1
2
3
4
5
6
7
8
9
10
Vcsdcl(V)
Icsd = 1 mA
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0,5
1
1,5
2
2,5
3
Vcsdl (V)
Application information VNQ5027AK-E
20/31 Doc ID 12730 Rev 7
3 Application information
Figure 25. Application schematic
Note: Channel 2, 3, 4 have the same internal circuit as channel 1.
3.1 GND protection network against reverse battery
3.1.1 Solution 1: resistor in the ground line (R
GND
only)
This can be used with any type of load.
The following is an indication on how to dimension the R
GND
resistor.
1. R
GND
600mV / (I
S(on)max
).
2. R
GND
≥ (−V
CC
) / (-I
GND
)
where -I
GND
is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power Dissipation in R
GND
(when V
CC
<0: during reverse battery situations) is:
P
D
= (-V
CC
)
2
/R
GND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
S(on)max
becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
R
GND
will produce a shift (I
S(on)max
* R
GND
) in the input thresholds and the status output
values. This shift will vary depending on how many devices are ON in the case of several
high side drivers sharing the same R
GND
.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (see below).
V
CC
GND
OUTPUT
D
GND
R
GND
D
ld
μ
C
+5V
V
GND
CS_DIS
IINPUT
R
prot
R
prot
CURRENT SENSE
R
prot
R
SENSE
C
ext
VNQ5027AK-E Application information
Doc ID 12730 Rev 7 21/31
3.1.2 Solution 2: a diode (D
GND
) in the ground line
A resistor (R
GND
= 1kΩ) should be inserted in parallel to D
GND
if the device drives an
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift (600mV) in the input
threshold and in the status output values if the microprocessor ground is not common to the
device ground. This shift will not vary if more than one HSD shares the same diode/resistor
network.
3.2 Load dump protection
D
ld
is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
V
CC
max DC rating. The same applies if the device is subject to transients on the V
CC
line
that are greater than the ones shown in the ISO T/R 7637/1 table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transients are present on the V
CC
line,
the control pins will be pulled negative. ST suggests to insert a resistor (R
prot
) in line to
prevent the µC I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of
µ
C and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
µ
C
I/Os.
-V
CCpeak
/I
latchup
R
prot
(V
OHµC
-V
IH
-V
GND
) / I
IHmax
Calculation example:
For V
CCpeak
= - 100V and I
latchup
20mA; V
OHµC
4.5V
5kΩ R
prot
180kΩ.
Recommended values: R
prot
= 10kΩ, C
EXT
= 10nF
.

VNQ5027AK-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Quad Ch HiSide Drivr
Lifecycle:
New from this manufacturer.
Delivery:
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