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VNQ5027AK-E

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P31
VNQ5027AK-E Package and PC board thermal data
Doc ID 12730 Rev 7 25/31
Figure 30.
PowerSSO-24
™
thermal impedance junction ambient single pulse (one channel
on)
Figure 31. Thermal fitting model of a double channel HSD in PowerSSO-24™
(a)
a. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
Footprint
8 cm
2
2 cm
2
Package and PC board thermal data VNQ5027AK-E
26/31 Doc ID 12730 Rev 7
Equation 1
: pulse calculation formula
Table 15. Thermal parameters
Area/island (cm
2
) Footprint 2 8
R1=R7=R9=R11 (°C/W) 0.28
R2=R8=R10=R12 (°C/W) 0.9
R3 (°C/W) 6
R4 (°C/W) 7.7
R5 (°C/W) 9 9 8
R6 (°C/W) 28 17 10
C1=C7=C9=C11 (W.s/°C) 0.001
C2=C8=C10=C12 (W.s/°C) 0.003
C3 (W.s/°C) 0.025
C4 (W.s/°C) 0.75
C5 (W.s/°C) 1 4 9
C6 (W.s/°C) 2.2 5 17
Z
THδ
R
TH
δ Z
THtp
1 δ–()+⋅=
where
δ t
p
T⁄=
VNQ5027AK-E Package and packing information
Doc ID 12730 Rev 7 27/31
5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
5.2 PowerSSO-24™ mechanical data
Figure 32. PowerSSO-24™ package dimensions
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P31

VNQ5027AK-E

Mfr. #:
Buy VNQ5027AK-E
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Quad Ch HiSide Drivr
Lifecycle:
New from this manufacturer.
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