Package and PC board thermal data VNQ5027AK-E
24/31 Doc ID 12730 Rev 7
4 Package and PC board thermal data
4.1 PowerSSO-24™ thermal data
Figure 28. PowerSSO-24™ PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area= 77mm x 86mm, PCB thickness=1.6mm, Cu thickness=70µm (front and back side),
Copper areas: from minimum pad lay-out to 8cm
2
).
Figure 29.
R
thj-amb
vs PCB copper area in open box free air condition (one channel ON)
30
35
40
45
50
55
0246810
RTHj_amb(°C/ W)
PCB Cu heatsink area (cm^ 2)
