MAX6917
I
2
C-Compatible RTC with Microprocessor
Supervisor, Alarm, and NV RAM Controller
28 ______________________________________________________________________________________
Freshness-Seal Mode
When the battery is first attached to the MAX6917 without
V
CC
power applied, the device does not immediately pro-
vide battery-backup power to V
OUT
(Figure 19). Only
after V
CC
exceeds V
RST
and later falls below both V
RST
and V
BATT
does the MAX6917 leave freshness-seal mode
and provide battery-backup power. This mode allows a
battery to be attached during manufacturing but not used
until after the system has been activated for the first time.
As a result, no battery energy is drained during storage
and shipping.
Battery-Test Control Register and Other Test Options
There are two warning formats for the BATT_LO and
BATT_ON outputs. By setting D0 (BATT ON BLINK)
and/or D1 (BATT LO BLINK) in the control register to one,
the respective warning output toggles on every 0.5s and
off every 0.5s when set to active low by the internal
MAX6917 logic. This allows a more noticeable warning
indicator in systems where an LED is connected as a sta-
tus or warning light for the end user. The POR default set-
tings of zero leave these outputs set to logic low when
they are active.
D5 (INT/EXT TEST) selects whether the battery-test cir-
cuit is configured as internal or external (Table 1). If D5
is set to zero (default value), then the internal resistor-
divider is used between V
BATT
and GND to select the
battery-low trip point (Figure 17). The internal resistors,
R
SET+_INT
and R
SET-_IINT
, are used to divide V
BATT
in
half, as well as to provide the battery-test-load resis-
tance of 0.91M (typ).
If D5 (INT/EXT TEST) is set to one, then the two external
resistors, R
SET+_EXT
and R
SET-_EXT
, are used to divide
V
BATT
down to the ratio for a trip point set at TRIP of
1.24V (V
TRIP
) (typ). R
SET+_EXT
plus R
SET-_EXT
in series
provide the load resistance used during the 1s every-
24hr-battery test. If additional load resistance is
desired, then an external load resistor, R
LOAD_EXT
, can
be placed between V
BATT
and the collector or drain of
the transistor driven by TEST. The equivalent load resis-
tance used to test the battery is then R
LOAD_EXT
in par-
allel with the series combination of R
SET+_EXT
plus
R
SET-_EXT
. In this mode, the internal resistors are
removed from TRIP and are not used as a load during
the battery-test pulse. TEST pulses high to perform the
battery test and remains low between tests.
One final battery-test feature of the MAX6917 is the
software write address/command of 1Ah that forces a
1s battery test to be performed every time it is sent.
Frequency Outputs
The 1Hz and 32kHz (32.768kHz) frequency outputs
provide buffered, push-pull outputs for timing or clock-
ing of external devices. Each push-pull output is refer-
enced to GND for logic-low output levels and
referenced to V
OUT
for logic-high output levels.
Disabled frequency outputs are held at a logic-low
level. The FOUT configuration register (Table 1) con-
tains individual enable bits that control the state of the
respective frequency output for V
CC
operating mode
and for V
BATT
operating mode.
Bits D5 (32kHz VBATT EN) and D4 (1Hz VBATT EN) in
the FOUT configuration register enable the respective
frequency output when operating from V
BATT
, if set to
one, or disable the respective frequency output if set to
zero. POR settings disable all frequency outputs when
operating from V
BATT
.
Rf
Rd
Cd
12pF
Cg
12pF
EXTERNAL
CRYSTAL
X1 X2
MAX6917
Figure 20. Oscillator Functional Schematic
*
*
*
*
*
*
*
*
*
**
**
**
X2
*
GUARD RING
GROUND PLANE
VIA CONNECTION
GROUND PLANE
VIA CONNECTION
SM WATCH CRYSTAL
*LAYER 1 TRACE
*
**LAYER 2 LOCAL GROUND PLANE
CONNECT ONLY TO PIN 8
GROUND PLANE VIA CONNECTION
MAX6917
X1
GROUND
PLANE VIA
CONNECTION
Figure 21. Crystal Layout
Bits D7 (32kHz VCC EN) and D6 (1Hz VCC EN) in the
FOUT configuration register enable the respective fre-
quency output when operating from V
CC
, if set to one,
or disable the respective frequency output if set to
zero. POR settings enable both output frequencies
when operating from V
CC
.
Applications Information
Crystal Selection
Connect a 32.768kHz watch crystal directly to the
MAX6917 through pins 9 and 10 (X1, X2) (Figure 20).
Use a crystal with a specified load capacitance (C
L
) of
6pF. Refer to Applications Note 616: Considerations for
Maxim Real-Time Clock Crystal Selection from the
Maxim website (www.maxim-ic.com) for more informa-
tion regarding crystal parameters and crystal selection,
as well as a list of crystal manufacturers.
When designing the PC board, keep the crystal as
close to the X1 and X2 pins of the MAX6917 as possi-
ble. Keep the trace lengths short and small to reduce
capacitive loading and prevent unwanted noise pickup.
Place a guard ring around the crystal and tie the ring to
ground to help isolate the crystal from unwanted noise
pickup. Keep all signals out from beneath the crystal
and the X1 and X2 pins to prevent noise coupling.
Finally, an additional local ground plane on an adjacent
PC board layer can be added under the crystal to
shield it from unwanted pickup from traces on other lay-
ers of the board. This plane should be isolated from the
regular PC board ground, tied to the GND pin of the
MAX6917, and needs to be no larger than the perime-
ter of the guard ring. Ensure that this ground plane
does not contribute to significant capacitance between
the signal line and ground on the connections that run
from X1 and X2 to the crystal. See Figure 21.
For frequency stability overtemperature, refer to the
Applications Note: Real-Time-Clock Selection and Opti-
mization from the Maxim website (www.maxim-ic.com.)
MAX6917
I
2
C-Compatible RTC with Microprocessor
Supervisor, Alarm, and NV RAM Controller
______________________________________________________________________________________ 29
Chip Information
PROCESS: CMOS
MAX6917
I
2
C-Compatible RTC with Microprocessor
Supervisor, Alarm, and NV RAM Controller
30 ______________________________________________________________________________________
USER RESET
N
3.3V
3.3V 3.3V
3.3V 3.3V
3.3V
LED
N.C.
CRYSTAL
3.3V
0.1µF
0.1µF
3.0V
0.1µF
N.C.
N.C.
N.C.
BATT_LO
BATT_ON
X1
X2
V
CC
V
BATT
MR
ALM
SDA
SCL
1HZ
CE_IN
RESET
WDI
TEST
TRIP
32KHZ
V
OUT
CE_OUT
MAX6917
GND
GND
CE
I/O
P1.0
RST
CS
INT1
SCL
SDA
INTO
µC
GND
CMOS SRAM
Typical Application Circuit
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
BATT
V
CC
RESET
BATT_LOBATT_ON
TRIP
TEST
V
OUT
TOP VIEW
CE_OUT
ALM
SCL
SDAGND
WDI
MR
CE_IN
12
11
9
10
1HZ
32KHZX2
X1
MAX6917
QSOP
Pin Configuration
PART SUPPLY VOLTAGE (V)
MAX6917EO30
3.0
MAX6917EO33 3.3
MAX6917EO50 5.0
Selector Guide

MAX6917EO30+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
IC RTC I2C COMPAT 20-QSOP
Lifecycle:
New from this manufacturer.
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