NCP81119
http://onsemi.com
27
PACKAGE DIMENSIONS
WQFN32 4x4, 0.4P
CASE 510AT
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
A
D
E
B
C0.10
PIN ONE
REFERENCE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
K
D2
E2
C
C0.10
C0.05
C0.05
A1
SEATING
PLANE
e
32X
NOTE 3
b
32X
C
C
A
B
DIM MIN MAX
MILLIMETERS
A 0.70 0.80
A1 0.00 0.05
b 0.15 0.25
D 4.00 BSC
D2 2.60 2.80
E 4.00 BSC
E2 2.60 2.80
e 0.40 BSC
L 0.25 0.45
9
17
25
32X
0.40
PITCH
4.30
0.58
4.30
DIMENSIONS: MILLIMETERS
0.25
32X
1
L
A3 0.20 REF
MOUNTING FOOTPRINT*
NOTE 4
A3
DETAIL B
2.80
2.80
1
PACKAGE
OUTLINE
DETAIL A
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
L1 −−− 0.15
DETAIL C
CORNER LEAD
CONSTRUCTION
L3
L3
DETAIL C
0.10
C
A
BB
0.10
C
A
BB
M
0.07
M
0.05
L3 0.17 REF
K 0.30 REF
RECOMMENDED
8X
C0.08
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP81119/D
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