PTN3366 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 1.1 — 22 May 2015 4 of 26
NXP Semiconductors
PTN3366
Low power HDMI/DVI level shifter supporting 3 Gbit/s operation
4. Ordering information
4.1 Ordering options
Table 1. Ordering information
Type number Topside mark Package
Name Description Version
PTN3366BS P3366 HVQFN32 plastic thermal enhanced very thin quad flat package;
no leads; 32 terminals; body 5 5 0.85 mm
SOT617-3
Table 2. Ordering options
Type number Orderable
part number
Package Packing method Minimum
order
quantity
Temperature
PTN3366BS PTN3366BSMP HVQFN32 Reel 13” Q2/T3
*standard mark SMD dry pack
6000 T
amb
= 40 C to +105 C
PTN3366 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 1.1 — 22 May 2015 5 of 26
NXP Semiconductors
PTN3366
Low power HDMI/DVI level shifter supporting 3 Gbit/s operation
5. Functional diagram
Fig 2. Functional diagram of PTN3366
002aah584
OUT_D1−
OUT_D1+
input bias
R
term
R
term
IN_D1−
IN_D1+
HPD level shifter
HPD_SOURCE
(0 V to 3.3 V)
HPD_SINK
(0 V to 5 V)
200 kΩ
SCL_SINK
SDA_SINK
DDC_EN (0 V to 3.3 V)
SCL_SOURCE
SDA_SOURCE
OUT_D2−
OUT_D2+
IN_D2−
IN_D2+
OUT_D3−
OUT_D3+
IN_D3−
IN_D3+
OUT_D4−
OUT_D4+
IN_D4−
IN_D4+
PTN3366
OE_N
enable
enable
enable
enable
input bias
R
term
R
term
input bias
R
term
R
term
input bias
R
term
R
term
enable
enable
enable
enable
DDC BUFFER
AND
LEVEL SHIFTER
EQ
EQ0/EQ1
EQ
EQ
EQ
SYSTEM CONTROL
PTN3366 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 1.1 — 22 May 2015 6 of 26
NXP Semiconductors
PTN3366
Low power HDMI/DVI level shifter supporting 3 Gbit/s operation
6. Pinning information
6.1 Pinning
6.2 Pin description
HVQFN32 package supply ground is connected to the exposed center pad. The exposed center
pad must be connected to supply ground for proper device operation. For enhanced thermal,
electrical, and board level performance, the exposed pad must be soldered to the board using a
corresponding thermal pad on the board and for proper heat conduction through the board, thermal
vias must be incorporated in the PCB in the thermal pad region.
Fig 3. Pin configuration for HVQFN32
002aah585
PTN3366BS
Transparent top view
OE_N
SCL_SOURCE
EQ0
V
DD
SDA_SOURCE SCL_SINK
HPD_SOURCE SDA_SINK
REXT HPD_SINK
n.c. DDC_EN
EQ1 n.c.
V
DD
n.c.
OUT_D4+
OUT_D4−
OUT_D3+
OUT_D3−
OUT_D2+
OUT_D2−
OUT_D1+
OUT_D1−
IN_D4+
IN_D4−
IN_D3+
IN_D3−
IN_D2+
IN_D2−
IN_D1+
IN_D1−
8 17
7 18
6 19
5 20
4 21
3 22
2 23
1 24
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
terminal 1
index area
GND
Table 3. Pin description
Symbol Pin Type Description
OE_N, IN_Dx and OUT_Dx signals
OE_N 17 3.3 V low-voltage
CMOS single-ended
input
Output Enable and power saving function for high-speed differential
level shifter path.
When OE_N = HIGH:
IN_Dx termination = high-Z
OUT_Dx outputs = high-Z; zero output current
When OE_N = LOW:
IN_Dx termination = 50
OUT_Dx outputs = active
IN_D4+ 32 Self-biasing
differential input
Low-swing differential input from display source. IN_D4+ makes a
differential pair with IN_D4. The input to this pin must be AC coupled
externally.
IN_D4 31 Self-biasing
differential input
Low-swing differential input from display source. IN_D4 makes a
differential pair with IN_D4+. The input to this pin must be AC coupled
externally.

PTN3366BSMP

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Equalizers PTN3366BS/HVQFN32///REEL 13 Q2 DP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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