NCV7513B
www.onsemi.com
5
MAXIMUM RATINGS (Voltages are with respect to device substrate.)
Rating Value Unit
DC Supply (V
CC1
, V
CC2
, V
DD
) −0.3 to 6.5 V
Difference Between V
CC1
and V
CC2
"0.3 V
Difference Between GND (Substrate) and V
SS
"0.3 V
Output Voltage (Any Output) −0.3 to 6.5 V
Drain Feedback Clamp Voltage (Note 1) −0.3 to 47 V
Drain Feedback Clamp Current (Note 1) 10 mA
Input Voltage (Any Input) −0.3 to 6.5 V
Junction Temperature, T
J
−40 to 150 °C
Storage Temperature, T
STG
−65 to 150 °C
Peak Reflow Soldering Temperature: Lead−Free
60 to 150 seconds at 217°C (Note 2)
260 peak °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
ATTRIBUTES
Characteristic Value
ESD Capability
Human Body Model
Machine Model
w " 2.0 kV
w " 200 V
Moisture Sensitivity (Note 2) MSL2
Package Thermal Resistance (Note 3)
Junction–to–Ambient, R
q
JA
Junction–to–Pin, R
Y
JL
86.0 °C/W
58.5 °C/W
1. An external series resistor must be connected between the MOSFET drain and the feedback input in the application. Total clamp power
dissipation is limited by the maximum junction temperature, the application environment temperature, and the package thermal resistances.
2. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D, and
Application Note AND8003/D.
3. Values represent still air steady−state thermal performance on a 4 layer (42 x 42 x 1.5 mm) PCB with 1 oz. copper on an FR4 substrate, using
a minimum width signal trace pattern (384 mm
2
trace area).
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC1
Main Power Supply Voltage 4.75 5.25 V
V
CC2
Gate Drivers Power Supply Voltage V
CC1
− 0.3 V
CC1
+ 0.3 V
V
DD
Serial Output Driver Power Supply Voltage 3.0 V
CC1
V
V
IN
High Logic High Input Voltage 2.0 V
CC1
V
V
IN
Low Logic Low Input Voltage 0 0.8 V
T
A
Ambient Still−Air Operating Temperature −40 125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
Recommended Operating Ranges limits may affect device reliability.
