PRELIMINARY
CYP15G0401RB
Document #: 38-02111 Rev. ** Page 34 of 35
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Package Diagram
HOTLink is a registered trademark, and HOTLink II, and MultiFrame are trademarks, of Cypress Semiconductor. IBM and ESCON
are registered trademarks, and FICON is a trademark, of International Business Machines. All product and company names
mentioned in this document are the trademarks of their respective holders.
Ordering Information
Speed Ordering Code Package Name Package Type Operating Range
Standard CYP15G0401RB-BGC BL256 256-ball Thermally Enhanced Ball Grid Array Commercial
Standard CYP15G0401RB-BGI BL256 256-ball Thermally Enhanced Ball Grid Array Industrial
Standard CYP15G0401RB-BGXC BL256 Pb Free 256-ball Thermally Enhanced Ball Grid
Array
Commercial
Standard CYP15G0401RB-BGXI BL256 Pb Free 256-ball Thermally Enhanced Ball Grid
Array
Industrial
A
B
0.15 C
0.15 C
0.97 REF.
0.60±0.10
1.57±0.175
C
0.20 MIN
SEATING PLANE
SIDE VIEW
TOP VIEW
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A
Ø0.15 M C
Ø0.30 M C
Ø0.75±0.15(256X)
BA
1.27
BOTTOM VIEW (BALL SIDE)
A
0.20(4X)
TOP OF MOLD COMPOUND
TO TOP OF BALLS
26°
TYP.
A1 CORNER I.D.
0.50 MIN.
27.00±0.13
27.00±0.13
24.13
24.13
A1 CORNER I.D.
R 2.5 Max (4X)
12.065
256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
51-85123-*E
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