ADP3207
Rev. 1 | Page 13 of 29 | www.onsemi.com
node side of the output inductors) are summed together by
using series summing resistors. The feedback resistor between
CSCOMP and CSSUM sets the gain of the current-sense
amplifier, and a filter capacitor is placed in parallel with this
resistor. The current information is then given as the voltage
difference between CSREF and CSCOMP. This signal is used
internally as a differential input for the current-limit
comparator.
An additional resistor divider connected between CSREF and
CSCOMP with the midpoint connected to LLSET can be used
to set the load line required by the microprocessor specification.
The current information for load line setting is then given as
the voltage difference of CSREF − LLSET. The configuration in
the previous paragraph makes it possible for the load line slope
to be set independently of the current-limit threshold. In the
event that the current-limit threshold and load line do not have
to be independent, the resistor divider between CSREF and
CSCOMP can be omitted and the CSCOMP pin can be
connected directly to LLSET. To disable voltage positioning
entirely (that is, to set no load line), tie LLSET to CSREF.
To provide the best accuracy for current sensing, the CSA is
designed to have a low offset input voltage. In addition, the
sensing gain is set by an external resistor ratio.
ACTIVE IMPEDANCE CONTROL MODE
To control the dynamic output voltage droop as a function of
the output current, the signal proportional to the total output
current is converted to a voltage that appears between CSREF
and LLSET. This voltage can be scaled to equal the droop voltage,
which is calculated by multiplying the droop impedance of the
regulator with the output current. The droop voltage is then
used as the control voltage of the PWM regulator. The droop
voltage is subtracted from the DAC reference output voltage
and determines the voltage positioning setpoint. The setup
results in an enhanced feed-forward response.
CURRENT CONTROL MODE AND THERMAL
BALANCE
The ADP3207 has individual inputs for monitoring the current in
each phase. The phase current information is combined with an
internal ramp to create a current balancing feedback system
that is optimized for initial current accuracy and dynamic
thermal balance. The current balance information is
independent of the total inductor current information used for
voltage positioning described in the Active Impedance Control
Mode section.
The magnitude of the internal ramp can be set so the transient
response of the system becomes optimal. The ADP3207 also
monitors the supply voltage to achieve feed-forward control
whenever the supply voltage changes. A resistor connected from
the power input voltage rail to the RAMPADJ pin determines
the slope of the internal PWM ramp. Detailed information
about programming the ramp is given in the Ramp Resistor
Selection section.
External resistors can be placed in series with the SW2 and
SW3 pins to create an intentional current imbalance, if desired.
Such a condition can exist when one phase has better cooling
and supports higher currents than the other phase. Resistor
RSW2 and Resistor RSW3 (see the typical application circuit in
Figure 10) can be used to adjust thermal balance. It is
recommended to add these resistors during the initial design to
make sure placeholders are provided in the layout.
To increase the current in any given phase, users should make
RSW for that phase larger (that is, make RSW = 0 for the hottest
phase and do not change it during balance optimization).
Increasing RSW to 500 makes a substantial increase in phase
current. Increase each RSW value by small amounts to achieve
thermal balance starting with the coolest phase.
When current limit is reached, the ADP3207 switches to full-
phase PWM mode, regardless of System Signal DRPSLP and
PSI
,
to avoid inrush current stress to the Phase 1 power stage.
VOLTAGE CONTROL MODE
A high gain bandwidth error amplifier is used for the voltage-
mode control loop. The noninverting input voltage is set via the
7-bit VID DAC. The VID codes are listed in Table 6. The
noninverting input voltage is offset by the droop voltage as a
function of current, commonly known as active voltage
positioning. The output of the error amplifier is the COMP pin,
which sets the termination voltage for the internal PWM ramps.
The negative input, FB, is tied to the output sense location
through a resistor, RB, for sensing and controlling the output
voltage at the remote sense point. The main loop compensation
is incorporated in the feedback network connected between FB
and COMP.
POWER-GOOD MONITORING
The power-good comparator monitors the output voltage via
the CSREF pin. The PWRGD pin is an open drain output that
can be pulled up through an external resistor to a voltage rail
that is not necessarily the same VCC voltage rail of the
controller. Logic high level indicates that the output voltage is
within the voltage limits defined by a window around the VID
voltage setting. PWRGD goes low when the output voltage is
outside of that window.
Following the IMVP-6 specification, PWRGD window is
defined as −300 mV below and +200 mV above the actual VID
DAC output voltage. For any DAC voltage below 300 mV, only
the upper limit of the PWRGD window is monitored. To
prevent false alarm, the power-good circuit is masked during
various system transitions, including any VID change and
entrance/exit out of deeper sleep. The duration of the PWRGD
ADP3207
Rev. 1 | Page 14 of 29 | www.onsemi.com
mask is set by an internal timer to be about 100 µs. In
conditions where a larger than 200 mV voltage drop occurs
during deeper sleep entry or slow deeper sleep exit, the
duration of PWRGD masking is extended by an internal logic
circuit.
POWER-UP SEQUENCE AND SOFT START
The power-on ramp-up time of the output voltage is set with a
capacitor tied from the SS pin to GND. The capacitance on the
SS pin also determines the current-limit latch-off time as
explained in the Soft Transient section. The whole power-up
sequence, including soft start, is illustrated in Figure 9.
In VCC UVLO or in shutdown, the SS pin is held at zero
potential. When VCC ramps above the upper UVLO threshold
and EN is asserted high, the ADP3207 enables internal bias and
starts a reset cycle that lasts about 50 μs to 60 µs. Next, when
initial reset is over, the chip detects the number of phases set by
the user, and gives a go signal to ramp up the SS voltage. During
soft start, the external SS capacitor is charged by an internal
8 µA current source. The V
CORE
voltage follows the ramping SS
voltage up to the V
BOOT
voltage level, which is determined by a
burnt-in VID code (the 1.2 V code by IMVP-6 specification).
While V
CORE
is being regulated at V
BOOT
voltage, the SS capacitor
continues to rise. When the SS pin voltage reaches 1.7 V, the
ADP3207 asserts the
CLKEN
signal low, given that the V
CORE
voltage is within the power-good window of V
BOOT
. The
ADP3207 reads the VID codes provided by the CPU on VID0
to VID6 input pins. The V
CORE
voltage changes from V
BOOT
to
the VID voltage by a well controlled soft transition, as
introduced in the Soft Transient section. Meanwhile, the SS pin
voltage is quickly charged up to a clamp voltage of 2.9 V.
The PWRGD signal is not asserted until there is a t
CPU_PWRGD
delay of about 3 ms to 10 ms as specified by the IMVP-6. The
power-good delay can be programmed by the capacitor
connected from PGDELAY to GND. Before the
CLKEN
signal
is asserted low, PGDELAY is reset to zero. After the assertion of
the
CLKEN
signal, an internal source current of 2 µA starts
charging up the external capacitor on the PGDELAY pin.
Assuming the V
CORE
voltage is settled within the power-good
window defined by the VID DAC voltage, the PWRGD signal is
asserted high when the PGDELAY voltage reaches the 2.9 V
power-good delay termination threshold.
If either EN is taken low or VCC drops below the lower VCC
UVLO threshold, then both the SS capacitor and PGDELAY
capacitor are reset to ground to be ready for another soft-start cycle.
VCC
EN
SS
CLKEN
PWRGD
V
CORE
t
CPU_PWRGD
V
VID
V
BOOT
1.2V
1.7V
2.9V
05782-009
Figure 9. Power-Up Sequence
SOFT TRANSIENT
The ADP3207 provides a soft transient function to reduce inrush
current during various transitions, including the entrance/exit of
deeper sleep and the transition from V
BOOT
to VID voltage.
Reducing the inrush current helps decrease the acoustic noise
generated by the MLCC input capacitors and inductors.
The soft transient feature is implemented with an STSET buffer
amplifier that outputs constant sink or source current on the
STSET pin where an external capacitor is connected. The
capacitor is used to program the slew rate of V
CORE
voltage
during any VID voltage transient. During steady-state
operation, both the reference input of the voltage error
amplifier and the STSET amplifier are connected to the VID
DAC output. Consequently, the STSET voltage is a buffered
version of VID DAC output. When system signals trigger a soft
transition, the reference input of the voltage error amplifier
switches from the DAC output to the STSET output, while the
input of the STSET amplifier remains connected to the DAC.
The STSET buffer input sees the almost instantaneous VID
voltage change and tries to track it. Tracking is not
instantaneous because the buffer slew rate is limited by the
source/sink current capability of the STSET output. Therefore,
V
CORE
voltage follows the VID DAC output voltage change with
a controlled slew rate. When the transient period is complete,
the reference input of the voltage amplifier switches back to the
VID DAC output to ensure higher accuracy.
ADP3207
Rev. 1 | Page 15 of 29 | www.onsemi.com
Table 5 lists the source/sink current on the STSET pin for
various transitions. By charging/discharging the external
capacitor on the STSET pin, users actually program the voltage
slew rate on the STSET pin, and consequently, on the V
CORE
output. For example, a 750 pF STSET capacitor leads to a
10 mV/s V
CORE
slew rate appropriate for a fast exit from deeper
sleep, and to a ±3.3 mV/µs V
CORE
slew rate for a slow entry to, or
exit from, deeper sleep.
Table 5. Source/Sink Current of STSET
System Signals
VID Transient
DPRSLP
DPRSTP
STSET
Current
Entrance to Deeper Sleep HIGH DNC
1
−2.5 ȝA
Fast Exit from Deeper Sleep LOW DNC
1
+7.5 ȝA
Slow Exit from Deeper Sleep HIGH HIGH +2.5 ȝA
Transient from V
BOOT
to VID DNC
1
DNC
1
±2.5 ȝA
1
Do not care.
CURRENT-LIMIT, SHORT-CIRCUIT, AND LATCH-
OFF PROTECTION
The ADP3207 compares the differential output of a current-
sense amplifier to a programmable current-limit setpoint to
provide current-limiting function. The nominal voltage on the
ILIMIT pin is 1.7 V. The current-limit threshold is set with a
resistor connected from the ILIMIT pin to GND. In multiphase
normal operating mode, the ILIMIT is internally scaled by
using a trimmed 12 k resistor to give a current-limit threshold
of 10 mV for each µA of ILIMIT current. For single-phase
operation, the current-limit threshold is scaled down even
further. The scaling factor is the user selected number of
phases. For example, a 3-phase design scales the current-limit
threshold to 3.3 mV/µA referred to single-phase operation; a 2-
phase design scales the current-limit threshold to 5 mV/µA also
referred to single-phase operation. During any mode of
operation, if the voltage difference between CSREF and
CSCOMP rises above the current-limit threshold, the internal
current-limit amplifier takes control over the internal COMP
voltage to maintain an average output current equal to the set
limit level.
During start-up when the output voltage is below 200 mV, a
secondary current limit is activated. This is necessary because
the voltage swing on CSCOMP cannot extend below ground.
The secondary current-limit circuit clamps the internal COMP
voltage and sets the internal compensation ramp termination
voltage at 1.5 V level. The clamp actually limits voltage drop
across the low side MOSFETs through the current balance
circuitry.
An inherent per phase current limit protects individual phases
in case one or more phases stop functioning because of a faulty
component. This limit is based on the maximum normal-mode
COMP voltage.
After a current limit is hit, or following a PWRGD failure, the
SS pin is discharged by an internal sink current of 2 µA. A
comparator monitors the SS pin voltage and shuts off the
controller when the voltage drops below about 1.65 V. Because
voltage ramp (2.9 V − 1.65 V = 1.25 V) and discharge current
(2 µA) are internally fixed, current-limit latch-off delay time
can be set by selecting the external SS pin capacitor.
The controller keeps cycling the phases during latch-off delay
time. If current overload is removed and PWRGD is recovered
before the 1.65 V threshold is reached, then the controller
resumes normal operation, and the SS pin voltage recovers to
2.9 V clamp level.
The latch-off can be reset by removing and reapplying VCC, or
by recycling the EN pin low and high for a short time. To
disable the current-limit latch-off function, an external pull-up
resistor can be tied from the SS pin to the VCC rail. The pull-up
current has to override the 2 µA sink current of the SS pin to
prevent the SS capacitor from discharging down to the 1.65 V
latch-off threshold.
CHANGING VID ON-THE-FLY
The ADP3207 is designed to track dynamically changing VID
code. As a result, the converter output voltage, that is, the CPU
VCC voltage, can change without the need to reset either the
controller or the CPU. This concept is commonly referred to as
VID on-the-fly (VID OTF) transient. A VID-OTF can occur
either under light load or heavy load conditions. The processor
signals the controller by changing the VID inputs in LSB
incremental steps from the start code to the finish code. The
change can be either upwards or downwards steps.
When a VID input changes state, the ADP3207 detects the
change but ignores the new code for a minimum of time of
400 ns. This keep out is required to prevent reaction to false
code that can occur by a skew in the VID code while the 7-bit
VID input code is in transition. Additionally, the VID change
triggers a PWRGD masking timer to prevent a PWRGD failure.
Each VID change resets and retriggers the internal PWRGD
masking timer. As listed in Table 5, during any VID transient,
the ADP3207 forces a multiphase PWM mode regardless of
system input signals.
OUTPUT CROWBAR
To protect the CPU load and output components of the
converter, the PWM outputs are driven low,
DCM
and
OD
are
driven high (that is, commanded to turn on the low-side
MOSFETs of all phases) when the output voltage exceeds an
OVP threshold of 1.7 V as specified by IMVP-6.
Turning on the low-side MOSFETs discharges the output
capacitor as soon as reverse current builds up in the inductors.
If the output overvoltage is due to a short of the high-side
MOSFET, then this crowbar action current limits the input

ADP3207JCPZ-RL

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ON Semiconductor
Description:
Switching Controllers IMVP6 MLTI/PHSE CNTR
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