ADP3207
Rev. 1 | Page 22 of 29 | www.onsemi.com
For example, if using 32 pieces of 10 µF 0805 MLC capacitors
(C
Z
= 320 µF), the fastest VID voltage change is the exit of
deeper sleep, and V
CORE
change is 220 mV in 22 µs with a
setting error of 10 mV. Where K = 3.1, solving for the bulk
capacitance yields
()
mF1.1F320
V150.1
A5.34
mV27
m1.22
A5.34nH360
=
¸
¸
¸
¸
¸
¸
¹
·
¨
¨
¨
¨
¨
¨
©
§
µ
×
¸
¸
¹
·
¨
¨
©
§
+×
×
MINx
C
()
()
mF3.2F3201
nH036mV022
m1.21.32V1501.s22
1
V150.1m1.21.32
mV220nH360
2
22
=µ
¸
¸
¸
¹
·
¨
¨
¨
©
§
¸
¸
¹
·
¨
¨
©
§
×
××××µ
+
×××
×
MAXx
C
Using four 330 µF Panasonic SP capacitors with a typical ESR of
6 m each yields C
X
= 1.32 mF with an R
X
= 1.5 m.
One last check should be made to ensure that the ESL of the
bulk capacitors (L
X
) is low enough to limit the high frequency
ringing during a load change. This is tested using
()
nH221.2F320
2
=××µ
××
x
2
2
O
zx
L
QRCL
(16)
where:
Q is limited to the square root of 2 to ensure a critically damped
system.
In this example, L
X
is about 250 pH for the four SP capacitors,
which satisfies this limitation. If the L
X
of the chosen bulk
capacitor bank is too large, the number of ceramic capacitors
may need to be increased if there is excessive ringing.
Note that for this multimode control technique, an all-ceramic
capacitor design can be used as long as the conditions of
Equation 13, Equation 14, and Equation 15 are satisfied.
POWER MOSFETS
For normal 20 A per phase application, the N-channel power
MOSFETs are selected for two high-side switches and two low-
side switches per phase. The main selection parameters for the
power MOSFETs are V
GS(TH)
, Q
G
, C
ISS
, C
RSS
and R
DS(ON)
. Because
the gate drive voltage (the supply voltage to the ADP3419) is
5 V, logic-level threshold MOSFETs must be used.
The maximum output current I
O
determines the R
DS(ON)
requirement for the low-side (synchronous) MOSFETs. In the
ADP3207, currents are balanced between phases; the current in
each low-side MOSFET is the output current divided by the
total number of MOSFETs (n
SF
). With conduction losses being
dominant, the following equation shows the total power
dissipated in each synchronous MOSFET in terms of the ripple
current per phase (I
R
) and average total output current (I
O
):
()
)(
22
12
1
1
SFDS
SF
R
SF
O
SF
R
n
In
n
I
DP ×
»
»
¼
º
«
«
¬
ª
¸
¸
¹
·
¨
¨
©
§
×
×+
¸
¸
¹
·
¨
¨
©
§
×=
(17)
Knowing the maximum output thermal current and the
maximum allowed power dissipation, users can find the
required R
DS(ON)
for the MOSFET. For 8-lead SOIC or 8-lead
SOIC compatible packaged MOSFETs, the junction to ambient
(PCB) thermal impedance is 50°C/W. In the worst case, the
PCB temperature is 90°C during heavy load operation of the
notebook; a safe limit for P
SF
is 0.6 W at 120°C junction
temperature. Thus, for this example (32 A maximum thermal
current), R
DS(SF)
(per MOSFET) is less than 9.6 mΩ for two
pieces of low-side MOSFET. This R
DS(SF)
is also at a junction
temperature of about 120°C; therefore, the R
DS(SF)
(per
MOSFET) should be lower than 6.8 mΩ at room temperature,
giving 9.6 mΩ at high temperature.
Another important factor for the synchronous MOSFET is the
input capacitance and feedback capacitance. The ratio of
feedback to input needs to be small (less than 10% is
recommended) to prevent accidental turn-on of the
synchronous MOSFETs when the switch node goes high.
The high-side (main) MOSFET has to be able to handle two
main power dissipation components, conduction and switching
losses. The switching loss is related to the amount of time it
takes for the main MOSFET to turn on and off, and to the
current and voltage that are being switched. Basing the
switching speed on the rise and fall time of the gate driver
impedance and MOSFET input capacitance, Equation 18
provides an approximate value for the switching loss per main
MOSFETs
ISS
MF
G
MF
OCC
SW
MFS
C
n
n
R
n
I
V
fP ×××
×
××= 2
)(
(18)
where:
n
MF
is the total number of main MOSFETs.
R
G
is the total gate resistance (1.5 Ω for the ADP3419 and about
0.5 Ω for two pieces of typical high speed switching MOSFETs,
making R
G
= 2 Ω).
C
ISS
is the input capacitance of the main MOSFET. The best
thing to reduce switching loss is to use lower gate capacitance
devices.
The conduction loss of the main MOSFET is given by
)(
22
)(
12
1
MFDS
MF
R
MF
O
MFC
R
n
In
n
I
DP ×
»
»
¼
º
«
«
¬
ª
¸
¸
¹
·
¨
¨
©
§
×
×+
¸
¸
¹
·
¨
¨
©
§
×=
(19)
where:
R
DS(MF)
is the on-resistance of the MOSFET.
ADP3207
Rev. 1 | Page 23 of 29 | www.onsemi.com
Typically, for main MOSFETs, users want the highest speed (low
C
ISS
) device, but these usually have higher on-resistance. Users
must select a device that meets the total power dissipation
(0.6 W for a single 8-lead SOIC package) when combining the
switching and conduction losses.
For example, using an IRF7821 device as the main MOSFET
(four in total; that is, n
MF
= 4), with about C
ISS
= 1010 pF (max)
and R
DS(MF)
= 18 mΩ (max at T
J
= 120°C) and an IR7832 device
as the synchronous MOSFET (four in total; that is, n
SF
= 4),
R
DS(SF)
= 6.7 mΩ (max at T
J
= 120°C). Solving for the power
dissipation per MOSFET at I
O
= 32 A and I
R
= 10.7 A yields
420 mW for each synchronous MOSFET and 410 mW for each
main MOSFET.
One last consideration is the power dissipation in the driver for
each phase. This is best described in terms of the QG for the
MOSFETs and is given by the following equation:
()
CCCCGSFSFGMFMF
SW
DRV
VIQnQn
n
f
P ×
»
¼
º
«
¬
ª
+×+××
×
=
2
(20)
where:
Q
GMF
is the total gate charge for each main MOSFET.
Q
GSF
is the total gate charge for each synchronous MOSFET.
Also shown is the standby dissipation (I
CC
× V
CC
) of the driver.
For the ADP3419, the maximum dissipation should be less than
300 mW, considering its thermal impedance is 220°C/W and
the maximum temperature increase is 50°C. For this example,
with I
CC
= 2 mA, Q
GMF
= 14 nC and Q
GSF
= 51 nC, there is 120
mW dissipation in each driver, which is below the 300 mW
dissipation limit. See the ADP3419 data sheet for more details.
RAMP RESISTOR SELECTION
The ramp resistor (R
R
) is used for setting the size of the internal
PWM ramp. The value of this resistor is chosen to provide the
best combination of thermal balance, stability, and transient
response. Use this equation to determine a starting value
=
×××
×
=
×××
×
=
k282
pF5m4.353
nH3602.0
3
R
R
DS
D
R
R
R
CRA
L
A
R
(21)
where:
A
R
is the internal ramp amplifier gain.
A
D
is the current balancing amplifier gain.
R
DS
is the total low-side MOSFET ON-resistance, C
R
is the
internal ramp capacitor value.
Another consideration in the selection of R
R
is the size of the
internal ramp voltage (see Equation 22). For stability and noise
immunity, keep this ramp size larger than 0.5 V. Taking this into
consideration, the value of R
R
is selected as 280 kΩ.Ҡ
The internal ramp voltage magnitude can be calculated using:
V55.0
kHz280pF5k280
V150.1)061.01(2.0
)1(
=
××
××
=
××
××
=
R
SWRR
VIDR
R
V
fCR
VDA
V
(22)
The size of the internal ramp can be made larger or smaller. If it
is made larger, then stability and transient response improves,
but thermal balance degrades. Likewise, if the ramp is made
smaller, then thermal balance improves at the sacrifice of
transient response and stability. The factor of three in the
denominator of Equation 21 sets a minimum ramp size that
gives an optimal balance for good stability, transient response,
and thermal balance.
COMP Pin Ramp
There is a ramp signal on the COMP pin due to the droop
voltage and output voltage ramps. This ramp amplitude adds to
the internal ramp to produce the following overall ramp signal
at the PWM input:
()
¸
¸
¹
·
¨
¨
©
§
×××
××
=
OXSW
R
RT
RCfn
Dn
V
V
12
1
(23)
For this example, the overall ramp signal is found to be 1.5 V.
SETTING THE SWITCHING FREQUENCY FOR RPM
MODE OPERATION OF PHASE 1
During the RPM mode operation of Phase 1, the ADP3207 runs
in pseudo constant frequency, given that the load current is
high enough for continuous current mode. While in
discontinuous current mode, the switching frequency is
reduced with the load current in a linear manner. When
considering power conversion efficiency in light load, lower
switching frequency is usually preferred for RPM mode.
However, the V
CORE
ripple specification in the IMVP-6 sets the
limitation for lowest switching frequency. Therefore, depending
on the inductor and output capacitors, the switching frequency
in RPM mode can be equal, larger, or smaller than its
counterpart in PWM mode.
A resistor between VRPM and RRPM pins sets the pseudo
constant frequency as following:
××
××
×
+
×
= k5.0
)1(
V0.1
2
SW
RR
VIDR
VID
T
RPM
fCR
VDA
V
R
R
(24)
where:
A
R
is the internal ramp amplifier gain.
ADP3207
Rev. 1 | Page 24 of 29 | www.onsemi.com
C
R
is the internal ramp capacitor value.
R
R
is an external resistor on the RAMPADJ pin to set the
internal ramp magnitude.
Because R
R
= 280 kΩ, the following resistance sets up 300 kHz
switching frequency in RPM operation.
Ωk6.80500
kHz300pF7Ωk280
150.1)061.01(2.0
V0.1V150.1
Ωk2372
=
××
××
×
+
×
=
RPM
R
CURRENT-LIMIT SETPOINT
To select the current-limit setpoint, we need to find the resistor
value for R
LIM
. The current-limit threshold for the ADP3207 is
set with a 1.7 V source (V
LIM
) across R
LIM
with a gain of
13 mV/µA. R
LIM
can be found using the following equation:
O
LIM
LIMLIM
LIM
RI
V
A
R
×
×
=
(25)
For values of R
LIM
greater than 500 kΩ, the current limit may be
lower than expected, so some adjustment of R
LIM
may be
needed. Here, I
LIM
is the average current limit for the output of
the supply. In this example, if choosing 55 A for I
LIM
, R
LIM
is
190 kΩ, which is close to a standard 1% resistance of 191 kΩ.
The per-phase current limit described earlier has its limit
determined by the following:
2
)(
)(
R
MAXDS
D
BIAS
R
MAXCOMP
PHLIM
I
RA
V
V
V
I +
×
(26)
For the ADP3207, the maximum COMP voltage (V
COMP(MAX)
) is
3.3 V, the COMP pin bias voltage (V
BIAS
) is 1.0 V, and the
current balancing amplifier gain (A
D
) is 5. Using a V
R
of 0.55 V,
and a R
DS(MAX)
of 3.8 mΩ (low-side on-resistance at 150°C)
results in a per-phase limit of 85 A. Although this number
seems high, this current level can only be reached with a
absolute short at the output and the current-limit latch-off
function shutting down the regulator before overheating occurs.
This limit can be adjusted by changing the ramp voltage V
R
.
However, users should not set the per-phase limit lower than
the average per-phase current (I
LIM
/n).
There is also a per-phase initial duty-cycle limit at maximum
input voltage:
R
BIAS
MAXCOMP
MINLIM
V
VV
DD
×=
)(
(27)
For this example, the duty-cycle limit at maximum input
voltage is found to be 0.25 when D is 0.061.
FEEDBACK LOOP COMPENSATION DESIGN
Optimized compensation of the ADP3207 allows the best
possible response of the regulator’s output to a load change. The
basis for determining the optimum compensation is to make
the regulator and output decoupling appear as an output
impedance that is entirely resistive over the widest possible
frequency range, including dc, and equal to the droop resistance
(R
O
). With the resistive output impedance, the output voltage
droops in proportion with the load current at any load current
slew rate. This ensures the optimal positioning and minimizes
the output decoupling.
With the multimode feedback structure of the ADP3207, users
need to set the feedback compensation to make the converter
output impedance work in parallel with the output decoupling.
Several poles and zeros are created by the output inductor and
decoupling capacitors (output filter) that need to be
compensated for.
A type-three compensator on the voltage feedback is adequate
for proper compensation of the output filter. Equation 28 to
Equation 36 is intended to yield an optimal starting point for
the design; some adjustments can be necessary to account for
PCB and component parasitic effects (see the Tuning Procedure
for ADP3207).
The first step is to compute the time constants for all of the
poles and zeros in the system
()
VID
O
X
RT
ID
RT
L
DS
D
O
E
VRCn
V
DnL
V
V
R
RARnR
×××
××××
+
×
+×+×=
12
(28)
()
X
O
O
X
O
X
A
R
RR
R
L
RRCT
'
'
×+×=
(29)
(
)
XOXB
CRRR
T
×+= '
(30)
EVID
SW
DS
D
RT
C
RV
f
RA
LV
T
×
¸
¸
¹
·
¨
¨
©
§
×
×
×
=
2
(31)
()
O
Z
O
X
O
Z
X
D
RCRRC
RCC
T
×+×
××
=
'
2
(32)
where:
R’ is the PCB resistance from the bulk capacitors to the ceramics.
R
DS
is the total low-side MOSFET on-resistance per phase.
For this example, A
D
is 5, V
RT
= 1. 5 V, R’ is approximately
0.4 mΩ (assuming an 8-layer motherboard) and L
X
is 250 pH
for the four Panasonic SP capacitors.

ADP3207JCPZ-RL

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Switching Controllers IMVP6 MLTI/PHSE CNTR
Lifecycle:
New from this manufacturer.
Delivery:
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