List of figures SPC563Mxx
4/48 Doc ID 13850 Rev 6
List of figures
Figure 1. SPC563Mxx block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 2. Commercial product code structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
SPC563Mxx Introduction
Doc ID 13850 Rev 6 5/48
1 Introduction
The SPC563Mxx is a family of system-on-chip devices that are built on Power Architecture
®
technology and:
Are 100% user-mode compatible with the classic Power Architecture instruction set
Contain enhancements that improve the architecture’s fit in embedded applications
Include additional instruction support for digital signal processing (DSP)
Integrate technologies, such as an enhanced time processor unit, enhanced queued
analog-to-digital converter, Controller Area Network, and an enhanced modular input-
output system, that are important for today’s lower-end powertrain applications
This document describes the features of the SPC563Mxx and highlights important electrical
and physical characteristics of the device.
1.1 Document overview
This document provides an overview and describes the features of the device series of
microcontroller units (MCUs). For functional characteristics, refer to the device reference
manual. For electrical specifications and package mechanical drawings, refer to the device
data sheet. Pin assignments can be found in both the reference manual and data sheet.
1.2 Description
These 32-bit automotive microcontrollers are a family of system-on-chip (SoC) devices that
contain all the features of the SPC563Mxx family and many new features coupled with high
performance 90 nm CMOS technology to provide substantial reduction of cost per feature
and significant performance improvement.
The advanced and cost-efficient host processor core of this automotive controller family is
built on Power Architecture technology. This family contains enhancements that improve the
architecture’s fit in embedded applications, includes additional instruction support for digital
signal processing (DSP), integrates technologies — such as an enhanced time processor
unit, enhanced queued analog-to-digital converter, Controller Area Network, and an
enhanced modular input-output system — that are important for today’s lower-end
powertrain applications.
The device has a single level of memory hierarchy consisting of up to 94 KB on-chip SRAM
and up to 1.5 MB of internal flash memory. The device also has an external bus interface
(EBI) for ‘calibration’. This external bus interface has been designed to support most of the
standard memories used with the SPC564Axx and SPC563Mxx families.
SPC563Mxx is part of a family of devices that contain many new features coupled with high
performance 90 nm CMOS technology to provide substantial reduction of cost per feature
and significant performance improvement.
The host processor core of the SPC563Mxx complies with the Power Architecture Book E. It
is 100% user mode compatible (with floating point library) with the classic Power
Architecture instruction set. The Book E architecture has enhancements that improve the
Power Architectures fit in embedded applications. In addition to the classic Power
Architecture instruction set, this core also has additional instruction support for digital signal
processing (DSP).
Introduction SPC563Mxx
6/48 Doc ID 13850 Rev 6
The SPC563Mxx has a single level of memory hierarchy consisting of up to 94 KB on-chip
SRAM and up to 1.5 MB of internal Flash memory. The SPC563Mxx also has an external
bus interface (EBI) for ‘calibration’
(b)
.
On-chip modules include:
Single issue, 32-bit Power Architecture technology compliant e200z335 CPU core
complex
Includes Variable Length Encoding (VLE) enhancements for code size reduction
Floating Point Unit (FPU)
32-channel direct memory access controller (DMA)
Interrupt controller (INTC) capable of handling 364 selectable-priority interrupt
sources—191 peripheral interrupt sources, 8 software interrupts and 165 reserved
interrupts.
Frequency-modulated phase-locked loop (FMPLL)
Calibration external bus interface (EBI)
b
System integration unit (SIU)
Up to 1.5 MB on-chip flash with flash controller
Fetch Accelerator for single cycle flash access @80 MHz
Up to 94 KB on-chip static RAM (including up to 32 KB standby RAM)
Boot assist module (BAM)
32-channel second-generation enhanced time processor unit (eTPU2)
32 standard eTPU channels
Architectural enhancements to improve code efficiency and added flexibility
16-channels enhanced modular input-output system (eMIOS)
Enhanced queued analog-to-digital converter (eQADC)
Decimation filter (part of eQADC)
Silicon die temperature sensor
Two deserial serial peripheral interface (DSPI) modules (compatible with Microsecond
Channel)
Two enhanced serial communication interface (eSCI) modules compatible with LIN
Two Controller Area Network (FlexCAN) modules that support CAN 2.0B
Nexus port controller (NPC) per IEEE-ISTO 5001-2003 standard
IEEE 1149.1 (JTAG) support
Nexus interface
On-chip voltage regulator controller that provides 1.2 V and 3.3 V internal supplies from
a 5 V external source
Designed for LQFP100, LQFP144, LQFP176, and LBGA208 packages
b. The external bus interface is only accessible when using the calibration tool. It is not available on production
packages.

SPC563M64L5COBR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
32-bit Microcontrollers - MCU 32-bit Pwr Architect MCU Auto PwrTrainApp
Lifecycle:
New from this manufacturer.
Delivery:
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