AMIS30523
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4
Table 1. PIN DESCRIPTION
Name Equivalent SchematicTypeDescriptionPin
MOTYN 31, 32 Positive end of phase Y coil output Driver Output
/ 33 No function (to be left open in normal operation)
MOTXN 34, 35 Positive end of phase X coil output Driver Output
GND 36, 37 Ground, heat sink Supply
MOTXP 38, 39 Negative end of phase X coil output Driver Output
VBB 40, 41 High voltage supply input Supply Type 3
PORB/WD 42 Poweronreset and watchdog reset output (open drain) Digital Output Type 2
TST0 43 Test pin input (to be tied to ground in normal operation) Digital Input
/ 44 No function (to be left open in normal operation)
DO 45 SPI data output (open drain) Digital Output Type 4
VDD 46 5V Logic Supply Output (needs external decoupling
capacitor)
Supply Type 6
GND 47 Ground Supply
CANH 48 Highlevel CAN bus line (high in dominant mode) Analog Output
CANL 49 Lowlevel CAN bus line (low in dominant mode) Analog Output
/ 50 No function (to be left open in normal operation)
STB 51 CAN standby mode control input Digital Input
TXD 52 CAN transmit data input; low input ³ dominant driver;
internal pullup current
Digital Input
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
V
BB
Analog DC supply voltage (Note 1) 0.3 +40 V
V
CC
CAN Supply voltage 0.3 +7 V
V
CANH
,
V
CANL
,
V
SPLIT
DC voltage CANH ,CANL and VSPLIT (Note 2) 50 +50 V
V
TRANS
Transient voltage CANH, CANL and VSPLIT (Note 3) 300 +300 V
T
ST
Storage temperature 55 +150 °C
T
J
Junction Temperature under bias (Note 4) 40 +170 °C
V
ESD
Electrostatic discharges on component level, All pins (Note 5) 2 +2 kV
V
ESD
Electrostatic discharges on component level, All pins (Note 7) 500 +500 V
V
ESD
Electrostatic discharges on CANH, CANL and VSPLIT (Note 6) 6 +6 kV
V
ESD
Electrostatic discharges on CANH and CANL (Note 7) 500 +500 V
V
ESD
Electrostatic discharges on component level, HiV pins (Note 6) 6 +6 kV
Latchup Static latchup at all pins 100 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. For limited time < 0.5 s.
2. For 0 < V
CC
< 5.25 V unlimited time
3. Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b.
4. Circuit functionality not guaranteed.
5. Standardized Human body model (100 pF via 1.5 kW, according to JEDEC EIAJESD22A114B).
6. Standardized human body model electrostatic discharge (ESD) pulses (100 pF via 1.5 kW) stressed pin to ground.
7. Standardized charged device model ESD pulses when tested according to ESD STM5.3.11999.
AMIS30523
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Table 3. THERMAL RESISTANCE
Package
Thermal Resistance
Unit
JunctiontoExposed Pad
(Rth
JEP
)
JunctiontoAmbient (Rth
JA
)
1S0P Board 2S2P Board
QFN52 0.95 60 30 K/W
EQUIVALENT SCHEMATICS
Following figure gives the equivalent schematics of the user relevant inputs and outputs. The diagrams are simplified
representations of the circuits used.
Figure 3. In and Output Equivalent Diagrams
IN
IN
VDD
OUT
SLA
4k
4k
VBB
VDD VBB
R
out
TYPE 1: CLR Input
TYPE 2: CLK, DI, CS
, NXT, DIR Inputs
TYPE 4: DO and ERR
Open
Drain Outputs
TYPE 5: SLA Analog Output
TYPE 3: V
DD
and V
BB
Power Supply
Rpd
PACKAGE THERMAL CHARACTERISTICS
The AMIS30523 is available in a QFN52 package. For
cooling optimizations, the QFN has an exposed thermal pad
which has to be soldered to the PCB ground plane. The
ground plane needs thermal vias to conduct the heat to the
bottom layer. Figure 4 gives an example for good power
distribution solutions.
For precise thermal cooling calculations the major
thermal resistances of the device are given. The thermal
media to which the power of the devices has to be given are:
Static environmental air (via the case)
PCB board copper area (via the exposed pad)
The thermal resistances are presented in Table 5: DC
Parameters Motor Driver.
The major thermal resistances of the device are the Rth
from the junction to the ambient (Rth
JA
) and the overall Rth
from the junction to exposed pad (Rth
JEP
). In Table 3 one
can find the values for the Rth
JA
and Rth
JEP
, simulated
according to JESD51:
The Rth
JA
for 2S2P is simulated conform JEDEC
JESD51 as follows:
A 4layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
Board thickness is 1.46 mm (FR4 PCB material)
The 2 signal layers: 70 mm thick copper with an area of
5500 mm
2
copper and 20% conductivity
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The 2 power internal planes: 36 mm thick copper with
an area of 5500 mm
2
copper and 90% conductivity
The Rth
JA
for 1S0P is simulated conform JEDEC
JESD51 as follows:
A 1layer printed circuit board with a single power and
signal layer
Board thickness is 1.46 mm (FR4 PCB material)
The layer has a thickness of 70 mm copper with an area
of 5500 mm
2
copper and 20% conductivity
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
39
38
37
36
29
28
27
52
51
50
49
48
47
46
45
44
43
42
41
40
DO
DI
CPN
MOTXP
GND
GND
MOTXP
POR/WD
CLK
VDD
CLR
CS
DIR
NXT
SLA
GND
GND
MOTYP
VBB
TSTO
CPP
VCP
VBB
VBB
VBB
MOTYP
ERR
CANH
CANL
STB
TxD
GND
VCC
RxD
VSPLIT
GND
35
34
33
32
31
30
MOTYN
GND
MOTYN
MOTXN
MOTXN
Figure 4. Example of QFN52 PCB Ground Plane Layout in Top View (preferred layout at top and bottom)
ELECTRICAL SPECIFICATION
Recommend Operation Conditions
Operating ranges define the limits for functional
operation and parametric characteristics of the device. Note
that the functionality of the chip outside these operating
ranges is not guaranteed. Operating outside the
recommended operating ranges for extended periods of time
may affect device reliability.
Table 4. OPERATING RANGES
Symbol Parameter Min Max Unit
V
BB
Motor Driver Analog DC supply 6 30 V
V
CC
CAN transceiver DC supply 4.75 5.25 V
T
J
Junction temperature (Note 8) 40 +172 °C
8. No more than 100 cumulative hours in life time above T
tw
.

AMIS30523C5231G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Motor / Motion / Ignition Controllers & Drivers AMIS30523 MULTI-CHIP ST
Lifecycle:
New from this manufacturer.
Delivery:
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