AD7785
Rev. 0 | Page 27 of 32
AV
DD
MONITOR
Along with converting external voltages, the ADC can be
used to monitor the voltage on the AV
DD
pin. When Bit CH2 to
Bit CH0 equal 1, the voltage on the AV
DD
pin is internally
attenuated by 6, and the resultant voltage is applied to the ∑-Δ
modulator using an internal 1.17 V reference for analog-to-
digital conversion. This is useful, because variations in the
power supply voltage can be monitored.
CALIBRATION
The AD7785 provides four calibration modes that can be
programmed via the mode bits in the mode register. These are
internal zero-scale calibration, internal full-scale calibration,
system zero-scale calibration, and system full-scale calibration,
which effectively reduces the offset error and full-scale error to
the order of the noise. After each conversion, the ADC con-
version result is scaled using the ADC calibration registers
before being written to the data register. The offset calibration
coefficient is subtracted from the result prior to multiplication
by the full-scale coefficient.
To start a calibration, write the relevant value to the MD2 to
MD0 bits in the mode register. After the calibration is complete,
the contents of the corresponding calibration registers are
updated, the
RDY
bit in the status register is set, the DOUT/
RDY
pin goes low (if
CS
is low), and the AD7785 reverts to idle mode.
During an internal zero-scale or full-scale calibration, the
respective zero input and full-scale input are automatically
connected internally to the ADC input pins. A system calibration,
however, expects the system zero-scale and system full-scale
voltages to be applied to the ADC pins before the calibration
mode is initiated. In this way, external ADC errors are removed.
From an operational point of view, a calibration should be
treated like another ADC conversion. A zero-scale calibration
(if required) should always be performed before a full-scale
calibration. System software should monitor the
RDY
bit in
the status register or the DOUT/
RDY
pin to determine the
end of calibration via a polling sequence or an interrupt-driven
routine.
Both an internal offset calibration and a system offset
calibration take two conversion cycles. An internal offset
calibration is not needed, as the ADC itself removes the offset
continuously.
To perform an internal full-scale calibration, a full-scale input
voltage is automatically connected to the selected analog input
for this calibration. When the gain equals 1, a calibration takes
2 conversion cycles to complete. For higher gains, 4 conversion
cycles are required to perform the full-scale calibration.
DOUT/
RDY
goes high when the calibration is initiated and
returns low when the calibration is complete.
The ADC is placed in idle mode following a calibration. The
measured full-scale coefficient is placed in the full-scale register
of the selected channel. Internal full-scale calibrations cannot be
performed when the gain equals 128. With this gain setting, a
system full-scale calibration can be performed. A full-scale
calibration is required each time the gain of a channel is
changed to minimize the full-scale error.
An internal full-scale calibration can be performed at specified
update rates only. For gains of 1, 2, and 4, an internal full-scale
calibration can be performed at any update rate. However, for
higher gains, internal full-scale calibrations can be performed
when the update rate is less than or equal to 16.7 Hz, 33.2 Hz,
and 50 Hz only. However, the full-scale error does not vary with
the update rate, so a calibration at one update rate is valid for all
update rates (assuming the gain or reference source is not
changed).
A system full-scale calibration takes 2 conversion cycles to
complete, irrespective of the gain setting. A system full-scale
calibration can be performed at all gains and all update rates.
If system offset calibrations are being performed along with
system full-scale calibrations, the offset calibration should be
performed before the system full-scale calibration is initiated.
GROUNDING AND LAYOUT
Because the analog inputs and reference inputs of the ADC are
differential, most of the voltages in the analog modulator are
common-mode voltages. The excellent common-mode reject-
ion of the part removes common-mode noise on these inputs.
The digital filter provides rejection of broadband noise on the
power supply, except at integer multiples of the modulator
sampling frequency. The digital filter also removes noise from
the analog and reference inputs, provided that these noise
sources do not saturate the analog modulator. As a result, the
AD7785 is more immune to noise interference than a conventional
high resolution converter. However, because the resolution of
the AD7785 is so high, and the noise levels from the AD7785 is
so low, care must be taken with regard to grounding and layout.
The printed circuit board that houses the AD7785 should be
designed such that the analog and digital sections are separated
and confined to certain areas of the board. A minimum etch
technique is generally best for ground planes because it provides
the best shielding.
It is recommended that the GND pins of the AD7785 be tied
to the AGND plane of the system. In any layout, it is important
to keep in mind the flow of currents in the system, ensuring
that the return paths for all currents are as close as possible to
the paths the currents took to reach their destinations. Avoid
forcing digital currents to flow through the AGND sections of
the layout.
AD7785
Rev. 0 | Page 28 of 32
The ground planes of the AD7785 should be allowed to run
under the device to prevent noise coupling. The power supply
lines to the AD7785 should use as wide a trace as possible to
provide low impedance paths and reduce the effects of glitches
on the power supply line. Fast switching signals such as clocks
should be shielded with digital ground to avoid radiating noise
to other sections of the board, and clock signals should never be
run near the analog inputs.
Avoid crossover of digital and analog signals. Traces on oppo-
site sides of the board should run at right angles to each other.
This reduces the effects of feedthrough through the board.
A microstrip technique is by far the best, but it is not always
possible with a double-sided board. In this technique, the
component side of the board is dedicated to ground planes, and
signals are placed on the solder side.
Good decoupling is important when using high resolution
ADCs. AV
DD
should be decoupled with 10 μF tantalum in
parallel with 0.1 μF capacitors to GND. DV
DD
should be
decoupled with 10 μF tantalum in parallel with 0.1 μF
capacitors to the systems DGND plane, with the systems
AGND to DGND connection being close to the AD7785.
To achieve the best from these decoupling components, they
should be placed as close as possible to the device, ideally right
up against the device. All logic chips should be decoupled with
0.1 μF ceramic capacitors to DGND.
AD7785
Rev. 0 | Page 29 of 32
APPLICATIONS INFORMATION
The AD7785 provides a low cost, high resolution analog-to-
digital function. Because the analog-to-digital function is
provided by a ∑-Δ architecture, the part is more immune to
noisy environments, making it ideal for use in sensor
measurement and industrial and process control applications.
TEMPERATURE MEASUREMENT USING A
THERMOCOUPLE
Figure 20 outlines a connection from a thermocouple to the
AD7785. In a thermocouple application, the voltage generated
by the thermocouple is measured with respect to an absolute
reference, so the internal reference is used for this conversion.
The cold junction measurement uses a ratiometric configuration,
so the reference is provided externally.
Because the signal from the thermocouple is small, the AD7785
is operated with the in-amp enabled to amplify the signal from
the thermocouple. As the input channel is buffered, large
decoupling capacitors can be placed on the front end to
eliminate any noise pickup that may be present in the
thermocouple leads. The AD7785 has a reduced common-
mode range with the in-amp enabled, so the bias voltage
generator provides a common-mode voltage so that the voltage
generated by the thermocouple is biased up to AV
DD
/2.
The cold junction compensation is performed using a thermis-
tor. The on-chip excitation current supplies the thermistor. In
addition, the reference voltage for the cold junction
measurement is derived from a precision resistor in series with
the thermistor. This allows a ratiometric measure-ment so that
variation of the excitation current has no effect on the
measurement (it is the ratio of the precision reference resistance
to the thermistor resistance that is measured).
06721-020
DOUT/RD
Y
DIN
SCLK
CS
DV
DD
SERIAL
INTERFACE
AND
CONTROL
LOGIC
Σ-Δ
ADC
AD7785
AIN2(+)
REFIN(+)
REFIN(–)
AIN2(–)
AV
DD
GND
MUX
BAND GAP
REFERENCE
INTERNAL
CLOCK
CLK
GND
GND
A
V
DD
AV
DD
IN-AMPBUF
REFIN(+) REFIN(–)
V
BIAS
AIN1(+)
AIN1(–)
R
R
T
HERMOCOUPLE
JUNCTION
C
R
REF
IOUT2
Figure 20. Thermocouple Measurement Using the AD7785

AD7785BRUZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 3Ch Lo Noise Lo Pwr 20B w/ On-Chip Ref
Lifecycle:
New from this manufacturer.
Delivery:
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