LPC2377_78 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6.1 — 16 October 2013 58 of 69
NXP Semiconductors
LPC2377/78
Single-chip 16-bit/32-bit microcontrollers
Fig 22. Oscillator modes and models: oscillation mode of operation and external crystal
model used for C
X1
/C
X2
evaluation
Table 16. Recommended values for C
X1
/C
X2
in oscillation mode (crystal and external
components parameters): low frequency mode
Fundamental oscillation
frequency F
OSC
Crystal load
capacitance C
L
Maximum crystal
series resistance R
S
External load
capacitors C
X1
/C
X2
1 MHz to 5 MHz 10 pF < 300 18 pF, 18 pF
20 pF < 300 39 pF, 39 pF
30 pF < 300 57 pF, 57 pF
5 MHz to 10 MHz 10 pF < 300 18 pF, 18 pF
20 pF < 200 39 pF, 39 pF
30 pF < 100 57 pF, 57 pF
10 MHz to 15 MHz 10 pF < 160 18 pF, 18 pF
20 pF < 60 39 pF, 39 pF
15 MHz to 20 MHz 10 pF < 80 18 pF, 18 pF
Table 17. Recommended values for C
X1
/C
X2
in oscillation mode (crystal and external
components parameters): high frequency mode
Fundamental oscillation
frequency F
OSC
Crystal load
capacitance C
L
Maximum crystal
series resistance R
S
External load
capacitors C
X1
, C
X2
15 MHz to 20 MHz 10 pF < 180 18 pF, 18 pF
20 pF < 100 39 pF, 39 pF
20 MHz to 25 MHz 10 pF < 160 18 pF, 18 pF
20 pF < 80 39 pF, 39 pF
002aaf494
LPC2xxx
XTALIN XTALOUT
C
X2
C
X1
XTAL
=
C
L
C
P
R
S
L
LPC2377_78 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6.1 — 16 October 2013 59 of 69
NXP Semiconductors
LPC2377/78
Single-chip 16-bit/32-bit microcontrollers
14.3 RTC 32 kHz oscillator component selection
The RTC external oscillator circuit is shown in Figure 23. Since the feedback resistance is
integrated on chip, only a crystal, the capacitances C
X1
and C
X2
need to be connected
externally to the microcontroller.
Table 18
gives the crystal parameters that should be used. C
L
is the typical load
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
C
L
influences oscillation frequency. When using a crystal that is manufactured for a
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in Table 18
that belong to a specific C
L
. The value of external capacitances C
X1
and C
X2
specified in
this table are calculated from the internal parasitic capacitances and the C
L
. Parasitics
from PCB and package are not taken into account.
14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
X1
, C
X2
, and C
X3
in case
of third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
X1
and C
X2
should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
Fig 23. RTC oscillator modes and models: oscillation mode of operation and external
crystal model used for C
X1
/C
X2
evaluation
Table 18. Recommended values for the RTC external 32 kHz oscillator C
X1
/C
X2
components
Crystal load capacitance
C
L
Maximum crystal series
resistance R
S
External load capacitors C
X1
/C
X2
11 pF < 100 k 18 pF, 18 pF
13 pF < 100 k 22 pF, 22 pF
15 pF < 100 k 27 pF, 27 pF
002aaf495
LPC2xxx
RTCX1 RTCX2
C
X2
C
X1
32 kHz XTAL
=
C
L
C
P
R
S
L
LPC2377_78 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6.1 — 16 October 2013 60 of 69
NXP Semiconductors
LPC2377/78
Single-chip 16-bit/32-bit microcontrollers
14.5 Standard I/O pin configuration
Figure 24 shows the possible pin modes for standard I/O pins with analog input function:
Digital output driver
Digital input: Pull-up enabled/disabled
Digital input: Pull-down enabled/disabled
Analog input (for ADC input channels)
The default configuration for standard I/O pins is input with pull-up enabled. The weak
MOS devices provide a drive capability equivalent to pull-up and pull-down resistors.
Fig 24. Standard I/O pin configuration with analog input
PIN
V
DD
ESD
V
SS
ESD
V
DD
weak
pull-up
weak
pull-down
output enable
output
pull-up enable
pull-down enable
data input
analog input
select analog input
002aaf496
pin configured
as digital output
driver
pin configured
as digital input
pin configured
as analog input

LPC2378FBD144,551

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM7 512KF/USB/ENET
Lifecycle:
New from this manufacturer.
Delivery:
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