PROGRAMMABLE CLOCK GENERATOR 4 MARCH 3, 2017
5P49V5907 DATASHEET
Pin Descriptions (cont.)
PLL Features and Descriptions
Spread Spectrum
To help reduce electromagnetic interference (EMI), the
5P49V5907 supports spread spectrum modulation. The
output clock frequencies can be modulated to spread energy
across a broader range of frequencies, lowering system EMI.
The 5P49V5907 implements spread spectrum using the
Fractional-N output divide, to achieve controllable modulation
rate and spreading magnitude. The Spread spectrum can be
applied to any output divider and any spread amount from
±0.25% to ±2.5% center spread and -0.5% to -5% down
spread.
Table 2: Loop Filter
PLL loop bandwidth range depends on the input reference
frequency (Fref) and can be set between the loop bandwidth
range as shown in the table below.
Table 3: Configuration Table
This table shows the SEL1, SEL0 settings to select the
configuration stored in OTP. Four configurations can be stored
in OTP. These can be factory programmed or user
programmed.
At power up time, the SEL0 and SEL1 pins must be tied to
either the VDDA power supply so that they ramp with that
supply or are tied low (this is the same as floating the pins).
This will cause the register configuration to be loaded that is
selected according to Table 3 above. Providing that
OUT0_SEL_I2CB was 1 at POR and OTP register 0:7=0, after
the first 10mS of operation the levels of the SELx pins can be
changed, either to low or to the same level as VDDA. The
SELx pins must be driven with a digital signal of < 300ns
Rise/Fall time and only a single pin can be changed at a time.
After a pin level change, the device must not be interrupted for
at least 1ms so that the new values have time to load and take
effect.
If OUT0_SEL_I2CB was 0 at POR, alternate configurations
can only be loaded via the I2C interface.
Number Name Description
36 VDDO Power Connect to 1.8V. Power pin for outputs 3, 5-7
37 VDD Power Connect to 1.8V.
38 OE_buffer Internal Pull-
up
Active High Output enable for outputs 3, 5-7. 0=disable outputs.
1=enable outputs. This pin has internal pull-up.
39 VDDO0 Power Power supply pin for OUT0_SEL_I2CB. Connect to 1.8 to 3.3V. Sets output
voltage levels for OUT0.
40 OUT0_SEL_I2CB Output Internal Pull-
down
Latched input/LVCMOS Output. At power up, the voltage at the pin
OUT0_SEL_I2CB is latched by the part and used to select the state of pins 11
and 12. If a weak pull up (10Kohms) is placed on OUT0_SEL_I2CB, pins 11 and
12 will be configured as hardware select pins, SEL1 and SEL0. If a weak pull
down (10Kohms) is placed on OUT0_SEL_I2CB or it is left floating, pins 11 and
12 will act as the SDA and SCL pins of an I2C interface. After power up, the pin
acts as a LVCMOS reference output.
ePAD GND GND Connect to ground pad
Type
Input Reference
Frequency–Fref
(MHz)
Loop
Bandwidth Min
(kHz)
Loop
Bandwidth Max
(kHz)
5 40 126
350 300 1000
OUT0_SEL_I2CB
@ POR
SEL1 SEL0 I
2
C
Access
REG0:7 Config
100No00
101No01
110No02
111No03
0 X X Yes 1 I2C
defaults
0XXYes00
MARCH 3, 2017 5 PROGRAMMABLE CLOCK GENERATOR
5P49V5907 DATASHEET
Crystal Input (XIN/REF)
The crystal used should be a fundamental mode quartz
crystal; overtone crystals should not be used.
A crystal manufacturer will calibrate its crystals to the nominal
frequency with a certain load capacitance value. When the
oscillator load capacitance matches the crystal load
capacitance, the oscillation frequency will be accurate. When
the oscillator load capacitance is lower than the crystal load
capacitance, the oscillation frequency will be higher than
nominal and vice versa so for an accurate oscillation
frequency you need to make sure to match the oscillator load
capacitance with the crystal load capacitance.
To set the oscillator load capacitance there are two tuning
capacitors in the IC, one at XIN and one at XOUT. They can
be adjusted independently but commonly the same value is
used for both capacitors. The value of each capacitor is
composed of a fixed capacitance amount plus a variable
capacitance amount set with the XTAL[5:0] register.
Adjustment of the crystal tuning capacitors allows for
maximum flexibility to accommodate crystals from various
manufacturers. The range of tuning capacitor values available
are in accordance with the following table.
XTAL[5:0] Tuning Capacitor Characteristics
The capacitance at each crystal pin inside the chip starts at
9pF with setting 000000b and can be increased up to 25pF
with setting 111111b. The step per bit is 0.5pF.
You can write the following equation for this capacitance:
Ci = 9pF + 0.5pF × XTAL[5:0]
The PCB where the IC and the crystal will be assembled adds
some stray capacitance to each crystal pin and more
capacitance can be added to each crystal pin with additional
external capacitors.
You can write the following equations for the total capacitance
at each crystal pin:
C
XIN
= Ci
1
+ Cs
1
+ Ce
1
C
XOUT
= Ci
2
+ Cs
2
+ Ce
2
Ci
1
and Ci
2
are the internal, tunable capacitors. Cs
1
and Cs
2
are stray capacitances at each crystal pin and typical values
are between 1pF and 3pF.
Ce
1
and Ce
2
are additional external capacitors that can be
added to increase the crystal load capacitance beyond the
tuning range of the internal capacitors. However, increasing
the load capacitance reduces the oscillator gain so please
consult the factory when adding Ce
1
and/or Ce
2
to avoid
crystal startup issues. Ce
1
and Ce
2
can also be used to adjust
for unpredictable stray capacitance in the PCB.
The final load capacitance of the crystal:
CL = C
XIN
× C
XOUT
/ (C
XIN
+ C
XOUT
)
For most cases it is recommended to set the value for
capacitors the same at each crystal pin:
C
XIN
= C
XOUT
= Cx CL = Cx / 2
The complete formula when the capacitance at both crystal
pins is the same:
CL = (9pF + 0.5pF × XTAL[5:0] + Cs + Ce) / 2
Example 1
: The crystal load capacitance is specified as 8pF
and the stray capacitance at each crystal pin is Cs=1.5pF.
Assuming equal capacitance value at XIN and XOUT, the
equation is as follows:
8pF = (9pF + 0.5pF × XTAL[5:0] + 1.5pF) / 2
0.5pF × XTAL[5:0] = 5.5pF XTAL[5:0] = 11 (decimal)
Example 2
: The crystal load capacitance is specified as 12pF
and the stray capacitance Cs is unknown. Footprints for
external capacitors Ce are added and a worst case Cs of 5pF
is used. For now we use Cs + Ce = 5pF and the right value for
Ce can be determined later to make 5pF together with Cs.
12pF = (9pF + 0.5pF × XTAL[5:0] + 5pF) / 2
XTAL[5:0] = 20 (decimal)
Parameter Bits Step (pF) Min (pF) Max (pF)
XTAL 6 0.5 9 25
PROGRAMMABLE CLOCK GENERATOR 6 MARCH 3, 2017
5P49V5907 DATASHEET
OTP Interface
The 5P49V5907 can also store its configuration in an internal
OTP. The contents of the device's internal programming
registers can be saved to the OTP by setting burn_start
(W114[3]) to high and can be loaded back to the internal
programming registers by setting usr_rd_start(W114[0]) to
high.
To initiate a save or restore using I
2
C, only two bytes are
transferred. The Device Address is issued with the read/write
bit set to “0”, followed by the appropriate command code. The
save or restore instruction executes after the STOP condition
is issued by the Master, during which time the 5P49V5907 will
not generate Acknowledge bits. The 5P49V5907 will
acknowledge the instructions after it has completed execution
of them. During that time, the I
2
C bus should be interpreted as
busy by all other users of the bus.
On power-up of the 5P49V5907, an automatic restore is
performed to load the OTP contents into the internal
programming registers. The 5P49V5907 will be ready to
accept a programming instruction once it acknowledges its
7-bit I
2
C address.
Availability of Primary and Secondary I
2
C addresses to allow
programming for multiple devices in a system. The I
2
C slave
address can be changed from the default 0xD4 to 0xD0 by
programming the I2C_ADDR bit D0. VersaClock 5
Programming Guide provides detailed I
2
C programming
guidelines and register map.
SD/OE Pin Function
The polarity of the SD/OE signal pin can be programmed to be
either active HIGH or LOW with the SP bit (W16[1]). When SP
is “0” (default), the pin becomes active LOW and when SP is
“1”, the pin becomes active HIGH. The SD/OE pin can be
configured as either to shutdown the PLL or to enable/disable
the outputs. The SH bit controls the configuration of the
SD/OE pin The SH bit needs to be high for SD/OE pin to be
configured as SD
.
When configured as SD, device is shut down, differential
outputs are driven High/low, and the single-ended LVCMOS
outputs are driven low. When configured as OE, and outputs
are disabled, the outputs are driven high/low.
Table 4: SD/OE Pin Function Truth Table
Output Alignment
Each output divider block has a synchronizing POR pulse to
provide startup alignment between outputs. This allows
alignment of outputs for low skew performance. The phase
alignment works both for integer output divider values and for
fractional output divider values.
Besides the POR at power up, the same synchronization reset
is also triggered when switching between configurations with
the SEL0/1 pins. This ensures that the outputs remain aligned
in every configuration. This reset causes the outputs to
suspend for a few hundred microseconds so the switchover is
not glitch-less. The reset can be disabled for applications
where glitch-less switch over is required and alignment is not
critical.
When using I
2
C to reprogram an output divider during
operation, alignment can be lost. Alignment can be restored
by manually triggering the reset through I
2
C.
When alignment is required for outputs with different
frequencies, the outputs are actually aligned on the falling
edges of each output by default. Rising edge alignment can
also be achieved by utilizing the programmable skew feature
to delay the faster clock by 180 degrees. The programmable
skew feature also allows for fine tuning of the alignment.
For details of register programming, please see VersaClock 5
Family Register Descriptions and Programming Guide for
details.
SD/OE Input
SP
SH
OEn
OSn
Global Shutdown
OUTn
SH bit SP bit OSn bit OEn bit SD/OE OUTn
0 0 0 x x Tri-state
2
0 0 1 0 x Output active
0 0 1 1 0 Output active
0 0 1 1 1 Output driven High Low
0 1 0 x x Tri-state
2
0 1 1 0 x Output active
0 1 1 1 0 Output driven High Low
0 1 1 1 1 Output active
1 0 0 x 0 Tri-state
2
1 0 1 0 0 Output active
1 0 1 1 0 Output active
1 1 0 x 0 Tri-state
2
1 1 1 0 0 Output active
1 1 1 1 0 Output driven High Low
1x x x 1
Output driven High Low
1
Note 1 : Global Shutdown
Note 2 : Tri-state regardless of OEn bits

5P49V5907B000NDGI

Mfr. #:
Manufacturer:
IDT
Description:
Clock Generators & Support Products XTAL 1 LVCMOS PCIe 4 Out 7 Diff 3 Pairs
Lifecycle:
New from this manufacturer.
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