PTN3393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 10 June 2014 25 of 30
NXP Semiconductors
PTN3393
2-lane DisplayPort to VGA adapter IC
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 9
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 17
and 18
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 9
.
Table 17. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350
< 2.5 235 220
2.5 220 220
Table 18. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
PTN3393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 10 June 2014 26 of 30
NXP Semiconductors
PTN3393
2-lane DisplayPort to VGA adapter IC
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
MSL: Moisture Sensitivity Level
Fig 9. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 19. Abbreviations
Acronym Description
AUX CH Auxiliary Channel
BER Bit Error Rate
bpc bits per color
CDM Charged-Device Model
CMOS Complementary Metal-Oxide Semiconductor
CVT Coordinated Video Timings
CVT RB CVT Reduced Blanking
DAC Digital-to-Analog Converter
DDC Data Display Channel
DJ Deterministic Jitter
DP DisplayPort (VESA)
DPCD DisplayPort Configuration Data
ECC Error Correction Code
EDID Extended Display Identification Data
ESD ElectroStatic Discharge
HBM Human Body Model
HBR High Bit Rate
HDCP High-bandwidth Digital Content Protection
HPD Hot Plug Detect
PTN3393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 10 June 2014 27 of 30
NXP Semiconductors
PTN3393
2-lane DisplayPort to VGA adapter IC
16. References
[1] VESA DisplayPort Standard — Version 1, Revision 1a; January 11, 2008
[2] Display Data Channel Command Interface Standard — Version 1.1;
October 29, 2004
[3] Video Signal Standard (VSIS) — Version 1, Rev. 2; December 12, 2002
17. Revision history
I
2
C-bus Inter-Integrated Circuit bus
IEC International Electrotechnical Commission
I/O Input/Output
LSB Least Significant Bit
MCCS Monitor Control Command Set (VESA)
MSB Most Significant Bit
QXGA Quad eXtended Graphics Array
RBR Reduced Bit Rate
RGB Red/Green/Blue
SSC Spread Spectrum Clocking
SVGA Super Video Graphics Array
SXGA Super eXtended Graphics Array
TJ Total Jitter
UI Unit Interval
UXGA Ultra eXtended Graphics Array
VESA Video Electronics Standards Association
VGA Video Graphics Array
VSIS Video Signal Interface Standard
WUXGA Wide Ultra eXtended Graphics Array
XGA eXtended Graphics Array
Table 19. Abbreviations
…continued
Acronym Description
Table 20. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PTN3393 v.4 20140610 Product data sheet - PTN3393 v.3
Modifications:
Table 5 “Display resolution and pixel clock rate
[1]
updated
Table 6 “Limiting values:
Table note [1]
updated to new ESD testing standards
Table note [2] updated to new ESD testing standards
PTN3393 v.3 20130808 Product data sheet - PTN3393 v.2
PTN3393 v.2 20130422 Product data sheet - PTN3393 v.1
PTN3393 v.1 20130404 Product data sheet - -

PTN3393BSY

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Interface - Specialized 2lane DisplayPort to VGA adapter testIC
Lifecycle:
New from this manufacturer.
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