RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
CH
Optional Center Pad Width
Center Pad Chamfer
Optional Center Pad Length
Contact Pitch
X2
Y2
1.30
0.90
MILLIMETERS
0.50 BSC
MIN
E
MAX
0.28
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.70
0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2261A
NOM
8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN]
CContact Pad Spacing 2.10
Contact Pad to Contact Pad (X6) G1 0.20
C
E
G
X1
Y1
Y2
X2
2X CH
(G2)
SILK SCREEN
1
2
8
Contact Pad to Center Pad (X8) G1 0.25 REF
REF: Reference Dimension, usually without tolerances, for reference only.
Thermal Via Diameter V 0.30
ØV
