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M24C02-RDS6G

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P40
M24C16, M24C08, M24C04, M24C02, M24C01 Initial delivery state
Doc ID 5067 Rev 13 19/40
4 Initial delivery state
The device is delivered with all bits in the memory array set to 1 (each byte contains FFh).
5 Maximum rating
Stressing the device outside the ratings listed in Table 5 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the operating sections of this specification, is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE program and other relevant
quality documents.
Table 5. Absolute maximum ratings
Symbol Parameter Min. Max. Unit
T
A
Ambient operating temperature –40 130 °C
T
STG
Storage temperature –65 150 °C
T
LEAD
Lead temperature during soldering see note
(1)
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK
®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
°C
PDIP-specific lead temperature during soldering 260
(2)
2. T
LEAD
max must not be applied for more than 10 s.
°C
I
OL
DC output current (SDA = 0) - 5 mA
V
IO
Input or output range –0.50 6.5 V
V
CC
Supply voltage –0.50 6.5 V
V
ESD
Electrostatic discharge voltage (human body model)
(3)
3. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114, C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω).
–4000 4000 V
DC and AC parameters M24C16, M24C08, M24C04, M24C02, M24C01
20/40 Doc ID 5067 Rev 13
6 DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristic tables that
follow are derived from tests performed under the measurement conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 6. Operating conditions (M24Cxx-W)
Symbol Parameter Min. Max. Unit
V
CC
Supply voltage 2.5 5.5 V
T
A
Ambient operating temperature (device grade 6) –40 85 °C
Ambient operating temperature (device grade 3) –40 125 °C
Table 7. Operating conditions (M24Cxx-R)
Symbol Parameter Min. Max. Unit
V
CC
Supply voltage 1.8 5.5 V
T
A
Ambient operating temperature –40 85 °C
Table 8. Operating conditions (M24Cxx-F)
Symbol Parameter Min. Max. Unit
V
CC
Supply voltage 1.7 5.5 V
T
A
Ambient operating temperature –20 85 °C
Table 9. DC characteristics (M24Cxx-W, device grade 6)
Symbol Parameter
Test conditions (in addition to those in
Table 6)
Min. Max. Unit
I
LI
Input leakage current
(SCL, SDA, E0, E1,and E2)
V
IN
= V
SS
or
V
CC
, device in Standby mode ± 2 µA
I
LO
Output leakage current V
OUT
= V
SS
or
V
CC,
SDA in Hi-Z ± 2 µA
I
CC
Supply current
V
CC
= 5 V, f
c
= 400 kHz
(rise/fall time < 50 ns)
2 mA
V
CC
= 2.5 V, f
c
= 400 kHz
(rise/fall time < 50 ns)
1 mA
I
CC1
Standby supply current
Device not selected
(1)
, V
IN
= V
SS
or
V
CC
,
for 2.5 V < V
CC
≤ 5.5 V
1 µA
V
IL
Input low voltage (SDA,
SCL, WC)
–0.45 0.3V
CC
V
M24C16, M24C08, M24C04, M24C02, M24C01 DC and AC parameters
Doc ID 5067 Rev 13 21/40
V
IH
Input high voltage (SDA,
SCL, WC)
0.7V
CC
V
CC
+1 V
V
OL
Output low voltage
I
OL
= 2.1 mA when V
CC
= 2.5 V or I
OL
= 3
mA when V
CC
= 5.5 V
0.4 V
1. The device is not selected after a power-up, after a read command (after the Stop condition), or after the
completion of the internal write cycle t
W
(t
W
is triggered by the correct decoding of a write command).
Table 10. DC characteristics (M24Cxx-W, device grade 3)
Symbol Parameter
Test condition
(in addition to those in Table 6)
Min. Max. Unit
I
LI
Input leakage current (SCL,
SDA, E0, E1,and E2)
V
IN
= V
SS
or
V
CC
, device in
Standby mode
± 2 µA
I
LO
Output leakage current V
OUT
= V
SS
or
V
CC,
SDA in Hi-Z ± 2 µA
I
CC
Supply current
V
CC
= 5 V, f
C
= 400 kHz
(rise/fall time < 50 ns)
3 mA
V
CC
= 2.5 V, f
C
= 400 kHz
(rise/fall time < 50 ns)
3 mA
I
CC1
Standby supply current
Device not selected
(1)
, V
IN
= V
SS
or
V
CC
, V
CC
= 5 V
1. The device is not selected after a power-up, after a read command (after the Stop condition), or after the
completion of the internal write cycle t
W
(t
W
is triggered by the correct decoding of a write command).
5 µA
Device not selected
(1)
, V
IN
= V
SS
or
V
CC
, V
CC
= 2.5 V
2 µA
V
IL
Input low voltage (SDA,
SCL, WC)
–0.45 0.3V
CC
V
V
IH
Input high voltage (SDA,
SCL, WC)
0.7V
CC
V
CC
+1 V
V
OL
Output low voltage
I
OL
= 2.1 mA when V
CC
= 2.5 V or
I
OL
= 3 mA when V
CC
= 5.5 V
0.4 V
Table 11. DC characteristics (M24Cxx-R)
Symbol Parameter
Test condition
(in addition to those in Table 7)
Min. Max. Unit
I
LI
Input leakage current
(SCL, SDA, E0, E1,and E2)
V
IN
= V
SS
or
V
CC
, device in
Standby mode
± 2 µA
I
LO
Output leakage current V
OUT
= V
SS
or
V
CC,
SDA in Hi-Z ± 2 µA
I
CC
Supply current
V
CC
= 1.8 V, f
c
= 400 kHz
(rise/fall time < 50 ns)
0.8 mA
I
CC1
Standby supply current
Device not selected
(1)
, V
IN
= V
SS
or
V
CC
, V
CC
= 1.8 V
1 µA
Table 9. DC characteristics (M24Cxx-W, device grade 6)
Symbol Parameter
Test conditions (in addition to those in
Table 6)
Min. Max. Unit
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P40

M24C02-RDS6G

Mfr. #:
Buy M24C02-RDS6G
Manufacturer:
STMicroelectronics
Description:
EEPROM 1.8-5.5V 2K (256x8)
Lifecycle:
New from this manufacturer.
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