M24C16, M24C08, M24C04, M24C02, M24C01 DC and AC parameters
Doc ID 5067 Rev 13 25/40
Table 16. AC characteristics at 100 kHz (I
2
C Standard-mode)
(1)
(M24Cxx-W,
M24Cxx-R, M24Cxx-F)
1. Values recommended by the I
2
C bus Standard-mode specification for a robust design of the I
2
C bus
application. Note that the M24xxx devices decode correctly faster timings as specified in Table 15: AC
characteristics at 400 kHz (I2C Fast-mode) (M24Cxx-W, M24Cxx-R, M24Cxx-F).
Test conditions specified in either Table 6, Table 7 or Table 8 and Table 13
Symbol Alt. Parameter Min. Max. Unit
f
C
f
SCL
Clock frequency - 100 kHz
t
CHCL
t
HIGH
Clock pulse width high 4 - µs
t
CLCH
t
LOW
Clock pulse width low 4.7 - µs
t
XH1XH2
t
R
Input signal rise time - 1 µs
t
XL1XL2
t
F
Input signal fall time - 300 ns
t
DL1DL2
(2)
2. Characterized only.
t
F
SDA fall time - 300 ns
t
DXCX
t
SU:DAT
Data in setup time 250 - ns
t
CLDX
t
HD:DAT
Data in hold time 0 - ns
t
CLQX
t
DH
Data out hold time 200 - ns
t
CLQV
(3)
3. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or
rising edge of SDA.
t
AA
Clock low to next data valid (access time) 200 3450 ns
t
CHDX
(4)
4. For a reStart condition, or following a Write cycle.
t
SU:STA
Start condition setup time 4.7 - µs
t
DLCL
t
HD:STA
Start condition hold time 4 - µs
t
CHDH
t
SU:STO
Stop condition setup time 4 - µs
t
DHDL
t
BUF
Time between Stop condition and next Start
condition
4.7 - µs
t
W
t
WR
Write time - 5 ms
DC and AC parameters M24C16, M24C08, M24C04, M24C02, M24C01
26/40 Doc ID 5067 Rev 13
Figure 12. AC waveforms
SCL
SDA In
SCL
SDA Out
SCL
SDA In
tCHCL
tDLCL
tCHDX
Start
condition
tCLCH
tDXCXtCLDX
SDA
Input
SDA
Change
tCHDH tDHDL
Stop
condition
Data valid
tCLQV tCLQX
tCHDH
Stop
condition
tCHDX
Start
condition
Write cycle
tW
AI00795e
Start
condition
tCHCL
tXH1XH2
tXH1XH2
tXL1XL2
tXL1XL2
Data valid
tDL1DL2
M24C16, M24C08, M24C04, M24C02, M24C01 Package mechanical data
Doc ID 5067 Rev 13 27/40
7 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 13. WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps,
package outline
1. Drawing is not to scale.
Table 17. M24C08: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.545 0.495 0.595 0.0215 0.0195 0.0234
A1 0.19 0.165 0.215 0.0075 0.0065 0.0085
A2 0.355 0.33 0.38 0.014 0.013 0.015
b 0.27 0.24 0.3 0.0106 0.0094 0.0118
D 1.215 1.195 1.235 0.0478 0.047 0.0486
E 1.025 1.005 1.045 0.0404 0.0396 0.0411
e 0.4 0.0157
e1 0.693 0.0273
e2 0.346 0.0136
F 0.313 0.0123
G 0.261 0.0103
N
(2)
2. N is the total number of terminals.
5 5
Orientation reference
E
A
B
C
D
e1
e2
e
F
G
A
A2
A1
SEATING PLANE
1 2 3
1Ca_ME
b

M24C02-RDS6G

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
EEPROM 1.8-5.5V 2K (256x8)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union