Package mechanical data M24C16, M24C08, M24C04, M24C02, M24C01
28/40 Doc ID 5067 Rev 13
Table 18. M24C08: Thin WLCSP (0.3 mm height), 0.4 mm pitch, 5 bumps, package
data
(1)
1. Preliminary data.
Symbol
millimeters inches
(2)
2. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.3 0.270 0.330 0.0118 0.0096 0.014
A1 0.1 0.0039
A2 0.2 0.0079
b 0.16 0.0063
D 1.215 1.34 0.0478 0.0528
E 1.025 1.15 0.0404 0.0453
e 0.4 0.0157
e1 0.693 0.0273
e2 0.346 0.0136
F 0.313 0.0123
G 0.261 0.0103
N
(3)
3. N is the total number of terminals.
5 5
Table 19. M24C16: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data
(1)
1. Preliminary data.
Symbol
millimeters inches
(2)
2. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.545 0.495 0.595 0.0215 0.0195 0.0234
A1 0.19 0.165 0.215 0.0075 0.0065 0.0085
A2 0.355 0.33 0.38 0.014 0.013 0.015
b 0.27 0.24 0.3 0.0106 0.0094 0.0118
D 1.255 1.235 1.275 0.0494 0.0486 0.0502
E 1.210 1.190 1.230 0.0476 0.0469 0.0484
e 0.4 0.0157
e1 0.693 0.0273
e2 0.346 0.0136
F 0.405 0.0159
G 0.281 0.0111
N
(3)
3. N is the total number of terminals.
5 5
M24C16, M24C08, M24C04, M24C02, M24C01 Package mechanical data
Doc ID 5067 Rev 13 29/40
Figure 14. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package
outline
1. Drawing is not to scale.
2. The ‘1’ that appears in the top view of the package shows the position of pin 1 and the ‘N’ indicates the total
number of pins.
Table 20. SO8 narrow – 8 lead plastic small outline, 150 mils body width,
package mechanical data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 1.75 0.0689
A1 0.1 0.25 0.0039 0.0098
A2 1.25 0.0492
b 0.28 0.48 0.011 0.0189
c 0.17 0.23 0.0067 0.0091
ccc 0.1 0.0039
D 4.9 4.8 5 0.1929 0.189 0.1969
E 6 5.8 6.2 0.2362 0.2283 0.2441
E1 3.9 3.8 4 0.1535 0.1496 0.1575
e 1.27 - - 0.05 - -
h 0.25 0.5 0.0098 0.0197
k
L 0.4 1.27 0.0157 0.05
L1 1.04 0.0409
SO-A
E1
8
ccc
b
e
A
D
c
1
E
h x 45˚
A2
k
0.25 mm
L
L1
A1
GAUGE PLANE
Package mechanical data M24C16, M24C08, M24C04, M24C02, M24C01
30/40 Doc ID 5067 Rev 13
Figure 15. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
SS
. It must not be
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
3. The circle in the top view of the package indicates the position of pin 1.
Table 21. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.55 0.45 0.6 0.0217 0.0177 0.0236
A1 0.02 0 0.05 0.0008 0 0.002
b 0.25 0.2 0.3 0.0098 0.0079 0.0118
D 2 1.9 2.1 0.0787 0.0748 0.0827
D2 1.6 1.5 1.7 0.063 0.0591 0.0669
E 3 2.9 3.1 0.1181 0.1142 0.122
E2 0.2 0.1 0.3 0.0079 0.0039 0.0118
e 0.5 - - 0.0197 - -
L 0.45 0.4 0.5 0.0177 0.0157 0.0197
L1 0.15 0.0059
L3 0.3 0.0118
ddd
(2)
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.08 0.08
D
E
UFDFPN-01
A
A1
ddd
L1
e
b
D2
L
E2
L3

M24C02-RDS6G

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
EEPROM 1.8-5.5V 2K (256x8)
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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