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M24C02-RDS6G

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P40
M24C16, M24C08, M24C04, M24C02, M24C01 Revision history
Doc ID 5067 Rev 13 37/40
9 Revision history
Table 31. Document revision history
Date Version Changes
10-Dec-1999 2.4
TSSOP8 Turned-Die package removed (p 2 and order information)
Lead temperature added for TSSOP8 in table 2
18-Apr-2000 2.5
Labelling change to Fig-2D, correction of values for ‘E’ and main caption for
Tab-13
05-May-2000 2.6 Extra labelling to Fig-2D
23-Nov-2000 3.0
SBGA package information removed to an annex document
-R range changed to being the -S range, and the new -R range added
19-Feb-2001 3.1
SBGA package information put back in this document
Lead Soldering Temperature in the Absolute Maximum Ratings table
amended
Write Cycle Polling Flow Chart using ACK illustration updated
References to PSDIP changed to PDIP and Package Mechanical data
updated
Wording brought in to line with standard glossary
20-Apr-2001 3.2 Revision of DC and AC characteristics for the -S series
08-Oct-2001 3.3
Ball numbers added to the SBGA connections and package mechanical
illustrations
09-Nov-2001 3.4
Specification of Test Condition for Leakage Currents in the DC
Characteristics table improved
30-Jul-2002 3.5
Document reformatted using new template. SBGA5 package removed
TSSOP8 (3x3mm² body size) package (MSOP8) added. -L voltage range
added
04-Feb-2003 3.6
Document title spelt out more fully. “W”-marked devices with tw=5ms
added.
05-May-2003 3.7
-R voltage range upgraded to 400kHz working, and no longer preliminary
data.
5V voltage range at temperature range 3 (-xx3) no longer preliminary data.
-S voltage range removed. -Wxx3 voltage+temp ranged added as
preliminary data.
07-Oct-2003 4.0
Table of contents, and Pb-free options added. Minor wording changes in
Summary Description, Power-On Reset, Memory Addressing, Read
Operations. V
IL
(min) improved to
-0.45V. t
W
(max) value for -R voltage range corrected.
17-Mar-2004 5.0
MLP package added. Absolute Maximum Ratings for V
IO
(min) and
V
CC
(min) changed. Soldering temperature information clarified for RoHS
compliant devices. Device grade information clarified. Process
identification letter “G” information added. 2.2-5.5V range is removed, and
4.5-5.5V range is now Not for New Design
Revision history M24C16, M24C08, M24C04, M24C02, M24C01
38/40 Doc ID 5067 Rev 13
7-Oct-2005 6.0
Product List summary table added. AEC-Q100-002 compliance. Device
Grade information clarified. Updated Device internal reset section,
Figure 4, Figure 5, Table 16 and Table 25 Added ECOPACK® information.
Updated tW=5ms for the M24Cxx-W.
17-Jan-2006 7.0
Pin numbers removed from silhouettes (see on page 1). Internal Device
Reset paragraph moved to below Section 2.4: Supply voltage (VCC).
Section 2.4: Supply voltage (VCC) added below Section 2: Signal
description. Test conditions for V
OL
updated in Table 9 and Table 10 SO8N
package specifications updated (see Table 20)
New definition of I
CC1
over the whole V
CC
range (see Tables 9, 10 and 11).
19-Sep-2006 8
Document converted to new ST template.
SO8 and UFDFPN8 package specifications updated (see Section 7:
Package mechanical data). Section 2.4: Supply voltage (VCC) clarified.
I
LI
value given with the device in Standby mode in Tables 9, 10 and 11.
Information given in Table 16: AC characteristics (M24Cxx-R and M24Cxx-
F) are no longer preliminary data.
03-Aug-2007 9
1.7 V to 5.5 V V
CC
voltage range added (M24C16-F, M24C08-F, M24C04-F
part numbers added; Table 8 and Table 12 added).
Section 2.4: Supply voltage (VCC) modified.
Note 1 updated to latest standard revision in Table 5: Absolute maximum
ratings.
Rise/fall time conditions for I
CC
modified in Table 9, Table 10 and Table 11.
I
CC1
conditions modified in Table 11: DC characteristics (M24Cxx-R).
Note removed below Table 14: Input parameters.
t
W
modified for M24Cxx-R in Table 16, note added.
TSSOP8 (DS) package specifications updated (see Table 23 and
Figure 17).
Added: Table 26, Table 27, Table 28, Table 29 and Table 30 summarizing
all available products.
Table 25: Ordering information scheme: Blank option removed under
Plating technology, /W removed under Process.
27-Sep-2007 10
Section 2.3: Chip Enable (E0, E1, E2) updated.
Concerned signals specified for V
IL
and V
IH
parameters, and note removed
in DC characteristics tables (Table 9, Table 10, Table 11 and Table 12).
t
W
modified in Table 16: AC characteristics (M24Cxx-R and M24Cxx-F).
M24C08-F and M24C04-F offered in UFDFPN8 package in the
temperature range 5 (see Table 27 and Table 28).
Table 31. Document revision history (continued)
Date Version Changes
M24C16, M24C08, M24C04, M24C02, M24C01 Revision history
Doc ID 5067 Rev 13 39/40
30-Jan-2009 11
Section 2.4: Supply voltage (VCC) clarified.
Figure 5: Maximum RP value versus bus parasitic capacitance (C) for an
I²C bus updated.
I
OL
added to Table 5: Absolute maximum ratings. ICC1 test conditions
clarified in DC characteristics Table 9, Table 10, Table 11 and Table 12.
Note modified below Table 14: Input parameters.
t
XH1XH2
and t
XL1XL2
added to Table 15: AC characteristics at 400 kHz (I2C
Fast-mode) (M24Cxx-W, M24Cxx-R, M24Cxx-F), note 4 removed.
Figure 12: AC waveforms updated.
WLCSP package added (refer to Figure 3 and Section 7: Package
mechanical data).
In Section 7: Package mechanical data:
– ECOPACK text added
– inch values calculated from millimeters and rounded to four decimal
digits
– UFDFPN package specifications updated
Small text changes.
11-Mar-2009 12
Timings for 100 kHz I
2
C Standard-mode added (see Table 16: AC
characteristics at 100 kHz (I2C Standard-mode) (M24Cxx-W, M24Cxx-R,
M24Cxx-F).
28-May-2009 13
Added Thin WLCSP package.
Added Table 19: M24C16: WLCSP (0.5 mm height) 0.4 mm pitch, 5
bumps, package data.
Updated available devices in Table 26, Table 27, Table 28, Table 29, and
Table 30.
Table 31. Document revision history (continued)
Date Version Changes
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P40

M24C02-RDS6G

Mfr. #:
Buy M24C02-RDS6G
Manufacturer:
STMicroelectronics
Description:
EEPROM 1.8-5.5V 2K (256x8)
Lifecycle:
New from this manufacturer.
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