Trademarks of Infineon Technologies AG
µHVIC
™
, µIPM
™
, µPFC
™
, AU-ConvertIR
™
, AURIX
™
, C166
™
, CanPAK
™
, CIPOS
™
, CIPURSE
™
, CoolDP
™
, CoolGaN
™
, COOLiR
™
, CoolMOS
™
, CoolSET
™
, CoolSiC
™
, DAVE
™
,
DI-POL
™
, DirectFET
™
, DrBlade
™
, EasyPIM
™
, EconoBRIDGE
™
, EconoDUAL
™
, EconoPACK
™
, EconoPIM
™
, EiceDRIVER
™
, eupec
™
, FCOS
™
, GaNpowIR
™
, HEXFET
™
,
HITFET
™
, HybridPACK
™
, iMOTION
™
, IRAM
™
, ISOFACE
™
, IsoPACK
™
, LEDrivIR
™
, LITIX
™
, MIPAQ
™
, ModSTACK
™
, my-d
™
, NovalithIC
™
, OPTIGA
™
, OptiMOS
™
, ORIGA
™
,
PowIRaudio
™
, PowIRStage
™
, PrimePACK
™
, PrimeSTACK
™
, PROFET
™
, PRO-SIL
™
, RASIC
™
, REAL3
™
, SmartLEWIS
™
, SOLID FLASH
™
, SPOC
™
, StrongIRFET
™
,
SupIRBuck
™
, TEMPFET
™
, TRENCHSTOP
™
, TriCore
™
, UHVIC
™
, XHP
™
, XMC
™
.
Trademarks Update 2015-12-22
Other Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2017-02-16
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2017 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-hws1468299808712
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information given in this document with respect to such
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