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XE3005I033TRLF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37
© Semtech 2005 www.semtech.com
34
XE3005/XE3006
8.2 XE3005 PACKAGE SIZE (5X4 UCSP
®
)
Figure 25: 5x4 uCSP
®
Ultra Chip Scale Package, 5 x 4 balls array.
TOP VIEW
BOTTOM VIEW
SIDE VIEW
PACKAGE OUTLINE of the XE3005 uCSP
®
Nominal dimensions in mm
A A1 A2
bDD1EE1e1 SDSE
< 0.8 0.31
0.46
max
0.37 1.95
3.225
± 0.125
2.40
0.65
0.325
± 0.075
0
± 0.125
e2
0.60
2.745
± 0.075
XEMI
CS
XE3005
P
GE OUTLINE of the XE300
sion
5
© Semtech 2005 www.semtech.com
35
XE3005/XE3006
8.3 XE3006 PACKAGE SIZE (TSSOP24)
w
M
b
p
Z
e
112
24
13
pin 1 index
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
D
y
UNIT A
1
A
2
A
3
b
p
cD E eH
E
LL
p
y
wv
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
0.4
0.3
8
0
o
o
0.13 0.10.21.0
DIMENSIONS (mm are the original dimensions)
0.75
0.50
0.25
0.5
0.2
A
max.
1.10
Q
Z
Figure 26: TSSOP24
Plastic Thin Shrink Small Outline Package with 24 leads and a body width of 4.4 mm.
© Semtech 2005 www.semtech.com
36
XE3005/XE3006
9 XE3005 LAND PATTERN RECOMMENDATIONS (5X4 UCSP
®
)
Figure 27: Land pattern recommendations (5x4 uCSP®)
PAD
PASTE_MASK
SOLDER_MASK
LAND PATTERN RECOMMENDATION
for the XE3005 uCSP
®
Nominal dimensions in mm
D E e1 SD SE
3.35
0.65 0.325 0
e2
0.60
2.82
PLACEMENT OUTLINE
Ø 0.25
Ø 0.25
Ø 0.35
LAND PATT
sion
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37

XE3005I033TRLF

Mfr. #:
Buy XE3005I033TRLF
Manufacturer:
Semtech
Description:
IC CODEC LOW PWR 16BIT 20-TSSOP
Lifecycle:
New from this manufacturer.
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