NCV7710
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PIN FUNCTION DESCRIPTION
Pin No. Pin Name Pin Type Description
1 GND Ground Ground Supply (all GND pins have to be connected externally)
2 n.c. Not connected
3 n.c. Not connected
4 n.c. Not connected
5 n.c. Not connected
6 n.c. Not connected
7 VS Supply Battery Supply Input (all VS pins have to be connected externally)
8 SI Digital Input SPI interface Serial Data Input
9 ISOUT/PWM2
Digital Input /
Analog Output
PWM control Input / Current Sense Output. This pin is a bidirectional pin.
Depending on the selected multiplexer bits, an image of the instant current
of the corresponding HS stage can be read out.
This pin can also be used as PWM control input pin for OUT2.
10 CSB Digital Input SPI interface Chip Select
11 SO Digital Output SPI interface Serial Data Output
12 VCC Supply Logic Supply Input
13 SCLK Digital Input SPI interface Shift Clock
14 VS Supply Battery Supply Input (all VS pins have to be connected externally)
15 VS Supply Battery Supply Input (all VS pins have to be connected externally)
16 OUT1 Half bridge driver Output Door Lock Output (has to be connected externally to pin 17)
17 OUT1 Half bridge driver Output Door Lock Output (has to be connected externally to pin 16)
18 GND Ground Ground Supply (all GND pins have to be connected externally)
19 GND Ground Ground Supply (all GND pins have to be connected externally)
20 OUT2 Half bridge driver Output Door Lock Output (has to be connected externally to pin 21)
21 OUT2 Half bridge driver Output Door Lock Output (has to be connected externally to pin 20)
22 n.c. Not connected
23 VS Supply Battery Supply Input (all VS pins have to be connected externally)
24 VS Supply Battery Supply Input (all VS pins have to be connected externally)
25 VS/TEST Supply/Test Input Test Input, has to be connected to VS in application
26 CHP Analog Output Reverse Polarity FET Control Output
27 PWM1 Digital Input PWM control Input
28 n.c. Not connected
29 n.c. Not connected
30 n.c. Not connected
31 n.c. Not connected
32 n.c. Not connected
33 n.c. Not connected
34 n.c. Not connected
35 n.c. Not connected
36 n.c. Not connected
Heat slug Ground Substrate; Heat slug has to be connected to all GND pins
NCV7710
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ABSOLUTE MAXIMUM RATINGS
Symbol Rating Min Max Unit
Vs
Power supply voltage
Continuous supply voltage
Transient supply voltage (t < 500 ms, “clamped load dump”)
0.3
0.3
28
40
V
Vcc Logic supply 0.3 5.5 V
Vdig DC voltage at all logic pins (SO, SI, SCLK, CSB, PWM1) 0.3 Vcc + 0.3 V
Visout/pwm2 Current monitor output / PWM2 logic input 0.3 Vcc + 0.3 V
Vchp Charge pump output (the most stringent value is applied)
25
Vs 25
40
Vs + 15
V
Voutx Static output voltage (OUT1/2) 0.3 Vs + 0.3 V
Iout1/2 OUT1/2 Output current 10 10 A
ESD_HBM
ESD Voltage, HBM (Human Body Model); (100 pF, 1500 W) (Note 1)
All pins
Output pins OUT1/2 to GND (all unzapped pins grounded)
2
4
2
4
kV
ESD_CDM
ESD according to CDM (Charge Device Model) (Note 1)
All pins
Corner pins
500
750
500
750
V
T
J
Operating junction temperature range 40 150 °C
Tstg Storage temperature range 55 150 °C
MSL Moisture sensitivity level (Note 2) MSL3
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114)
ESD Charge Device Model tested per EIA/JES D22/C101, Field Induced Charge Model
2. For soldering information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Symbol Rating Value Unit
R
θJA
Thermal Characteristics, SSOP36EP, 1layer PCB
Thermal Resistance, JunctiontoAir (Note 3)
49.4 °C/W
R
θJA
Thermal Characteristics, SSOP36EP, 4layer PCB
Thermal Resistance, JunctiontoAir (Note 4)
24 °C/W
3. Values based on PCB of 76.2 x 114.3 mm, 72 mm copper thickness, 20 % copper area coverage and FR4 PCB substrate.
4. Values based on PCB of 76.2 x 114.3 mm, 72 / 36 mm copper thickness (signal layers / internal planes), 20 / 90 % copper area coverage
(signal layers / internal planes) and FR4 PCB substrate.
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ELECTRICAL CHARACTERISTICS
4.5 V < Vcc < 5.25 V, 8 V < Vs < 18 V, 40°C < Tj < 150°C; unless otherwise noted.
Symbol
Parameter Test Conditions Min Typ Max Unit
SUPPLY
Vs
Supply voltage
Functional (see Vuv_vs / Vov_vs)
Parameter specification
5.5
8
28
18
V
Is(standby) Supply Current (VS), Standby mode
Standby mode,
VS = 16 V, 0 V v VCC v 5.25 V,
CSB = VCC, OUT1/2 = floating,
SI = SCLK = 0 V, Tj < 85°C
(T
J
= 150°C)
3
(6)
12
(25)
mA
Is(active) Supply current (VS), Active mode
Active mode,
VS = 16 V,
OUT1/2 = floating
6 20 mA
Icc(standby) Supply Current (VCC), Standby mode
Standby mode,
VCC = 5.25 V,
SI = SCLK = 0 V, T
J
< 85°C
(T
J
= 150°C)
3
(12)
6
(50)
mA
Icc(active) Supply current (VCC), Active mode
Active mode, VS = 16 V,
OUT1/2 = floating
3.3 8 mA
I(stdby)
Total Standby mode supply current
(Is + Icc)
Standby mode,
VS = 16 V, T
J
< 85°C,
CSB = VCC, OUT1/2 = floating
8 18
mA
OVERVOLTAGE AND UNDERVOLTAGE DETECTION
Vuv_vs(on)
VS Undervoltage detection
VS increasing 5.6 6.2 V
Vuv_vs(off) VS decreasing 5.2 5.8 V
Vuv_vs(hys) VS Undervoltage hysteresis Vuv_vs(on) Vuv_vs(off) 0.65 V
Vov_vs(off)
VS Overvoltage detection
VS increasing 20 24.5 V
Vov_vs(on) VS decreasing 18 23.5 V
Vov_vs(hys) VS Overvoltage hysteresis Vov_vs(off) Vov_vs(on) 2 V
Vuv_vcc(off)
VCC Undervoltage detection
VCC increasing 2.9 V
Vuv_vcc(on) VCC decreasing 2 V
Vuv_vcc(hys) VCC Undervoltage hysteresis Vuv_vcc(off) Vuv_vcc(on) 0.11 V
td_uvov VS Undervoltage / Overvoltage filter time
Time to set the power supply
fail bit UOV_OC in the Global
Status Byte
6 100
ms
CHARGE PUMP OUTPUT CHP
Vchp8
Chargepump Output Voltage
Vs = 8 V, Ichp = 60 mA
Vs + 6 Vs + 9 Vs + 13 V
Vchp10 Chargepump Output Voltage
Vs = 10 V, Ichp = 80 mA
Vs + 8 Vs + 11 Vs + 13 V
Vchp12 Chargepump Output Voltage
VS > 12 V, Ichp = 100 mA
Vs + 9.5 Vs + 11 Vs + 13 V
Ichp Chargepump Output current VS = 13.5 V, Vchp = Vs + 10 V 750 95
mA

NCV7710DQR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Motor / Motion / Ignition Controllers & Drivers DOOR LOCK DVR IC LIGHT
Lifecycle:
New from this manufacturer.
Delivery:
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