PCE85133AUG All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 22 July 2015 39 of 50
NXP Semiconductors
PCE85133AUG
Universal 80 × 4 LCD driver for low multiplex rates
[1] For most applications, SDA and SDAACK are shorted together; see Section 7.
[1] Pressure of diamond head: 10 g to 50 g.
BP3 109 1228.05 436.5 LCD backplane output
BP1 110 1174.05 436.5
D1 - 1932.03 436.5 dummy pads
D2 - 1909.53 436.5
D3 - 1801.53 436.5
D4 - 1693.53 436.5
D5 - 1585.53 436.5
D6 - 1477.53 436.5
D7 - 1846.35 436.5
D8 - 1953 436.5
D9 - 1930.05 436.5
Table 20. Gold bump hardness
Type number Min Max Unit
[1]
PCE85133AUG 60 120 HV
The positions of the alignment marks are approximately shown in Figure 27.
Fig 28. Alignment marks of PCE85133AUG
Table 21. Alignment mark locations
All x/y coordinates represent the position of the REF point (see Figure 28
) with respect to the center
(x/y = 0) of the chip; see Figure 27
.
Symbol Size (m) X (m) Y (m)
S1 81 81 1916.1 45
C1 81 81 1855.8 45
Table 19. Bump locations of PCE85133AUG
All x/y coordinates represent the position of the center of each bump with respect to the center
(x/y = 0) of the chip; see Figure 27
.
Symbol Bump X (m) Y (m) Description
