AD9940
Rev. 0 | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter Rating
AVDD and TCVDD to AVSS −0.3 V to +3.9 V
−0.3 V to +3.9 V
HVDD and RGVDD to HVSS and
RGVSS
DVDD and OVDD to DVSS and OVSS −0.3 V to +3.9 V
Any VSS to Any VSS −0.3 V to +0.3 V
CLPOB/HBLK to DVSS −0.3 V to DVDD + 0.3 V
THERMAL CHARACTERISTICS
SCK, SL, and SDI to DVSS −0.3 V to DVDD + 0.3 V
RG to RGVSS −0.3 V to RGVDD + 0.3 V
θ
JA
is measured using a 4-layer PCB with the exposed paddle
soldered to the board.
H1–H4 to HVSS −0.3 V to HVDD + 0.3 V
REFT, REFB, and CCDIN to AVSS −0.3 V to AVDD + 0.3 V
Thermal resistance for 48-lead LQFP package:
Junction Temperature 150°C
θ
JA
= 92°C/W
Lead Temperature (10 sec) 350°C
Thermal resistance for 48-lead LFCSP package:
θ
JA
= 24°C/W
1
1
θ
JA
is measured using a 4-layer PCB with the exposed paddle
soldered to the board.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.