SiI 164 PanelLink Transmitter
Data Sheet
SiI-DS-0021-E 26
Decoupling Capacitors
Designers should include decoupling and bypass capacitors at each power pin in the layout. These are shown
schematically in Figure 21. Place these components as closely as possible to the SiI 164 pins, and avoid routing
through vias if possible, as shown in Figure 20, which is representative of the various types of power pins on the
transmitter.
C1
VCC
Ferrite
Via to GND
VCC
GND
C2
C3
L1
Figure 20. Decoupling and Bypass Capacitor Placement
VCCPIN
C1 C2
L1
C3
VCC
Figure 21. Decoupling and Bypass Schematic
The values shown in Table 7 are recommendations that should be adjusted according to the noise characteristics
of the specific board-level design. Pins in one group (such as VCC) may share C2, L1, and C3, each pin having
C1 placed as closely to the pin as possible.
Table 7. Recommended Components for Bypass and Decoupling Circuits
C1 C2 C3 L1
100 – 300 pF 2.2 – 10 µF 10 µF
200+ Ω