PCF8591 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7 — 27 June 2013 30 of 31
NXP Semiconductors
PCF8591
8-bit A/D and D/A converter
22. Figures
Fig 1. Block diagram of PCF8591 . . . . . . . . . . . . . . . . . .3
Fig 2. Pin configuration for PCF8591P (DIP16). . . . . . . .3
Fig 3. Pin configuration for PCF8591T (SO16) . . . . . . . .3
Fig 4. Control byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Fig 5. DAC resistor divider chain . . . . . . . . . . . . . . . . . . .7
Fig 6. DAC data and DC conversion characteristics . . . .7
Fig 7. D/A conversion sequence . . . . . . . . . . . . . . . . . . .8
Fig 8. A/D conversion sequence . . . . . . . . . . . . . . . . . . .8
Fig 9. A/D conversion characteristics of single ended
inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Fig 10. A/D conversion characteristics of differential
inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Fig 11. Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Fig 12. Definition of START and STOP conditions. . . . . .11
Fig 13. System configuration . . . . . . . . . . . . . . . . . . . . . .12
Fig 14. Acknowledgement on the I
2
C-bus . . . . . . . . . . . .12
Fig 15. Bus protocol for write mode, D/A conversion. . . .13
Fig 16. Bus protocol for read mode, A/D conversion. . . .13
Fig 17. Application diagram . . . . . . . . . . . . . . . . . . . . . . .14
Fig 18. Device protection diagram. . . . . . . . . . . . . . . . . .15
Fig 19. Operating supply current as a function of supply
voltage (analog output disabled) . . . . . . . . . . . . .19
Fig 20. Output impedance of analog output buffer
(near power rails). . . . . . . . . . . . . . . . . . . . . . . . .19
Fig 21. I
2
C bus timing diagram; rise and fall times
refer to V
IL
and V
IH
. . . . . . . . . . . . . . . . . . . . . . . .20
Fig 22. DIP16: plastic dual in-line package; 16 leads
(300 mil). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Fig 23. SO16: plastic small outline package; 16 leads:
body width 7.5 mm. . . . . . . . . . . . . . . . . . . . . . . .22
Fig 24. Temperature profiles for large and small
components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25