Figure 7: 96-Ball FBGA Die Rev. E (package code KNR)
Seating plane
Ball A1 ID
(covered by SR)
Ball A1 ID
0.34 ±0.05
1.1 ±0.1
6.4 CTR
7.5 ±0.1
0.8 TYP
12 CTR
13.5 ±0.1
96X Ø0.47
Dimensions apply
to solder balls post-
reflow on Ø0.42 SMD
ball pads.
0.8 TYP
123789
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A 0.12 A
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: SAC302 (96.8% Sn, 3% Ag, 0.2% Cu).
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Micron and the Micron logo are trademarks of Micron Technology, Inc. TwinDie is a trademark of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
16Gb: x16 TwinDie Single Rank DDR4 SDRAM
Package Dimensions
CCMTD-1725822587-9947
16gb_x16_1cs_TwinDie.pdf - Rev. G 06/18 EN
23
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© 2015 Micron Technology, Inc. All rights reserved.
